Loading...

KAF-50100-ABA-JR-BA

Onsemi

KAF-50100-ABA-JR-BA by Onsemi

KAF-50100-ABA-JR-BA by Onsemi is a CCD image sensor with 6x6 um pixel size, offering 8176 horizontal and 6132 vertical pixels. It operates b/w 0 to 60 °C, with a dynamic range of 70.2 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,585

-

-

-

-

Digiode

USA . 1,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,643

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 977 parts In-Stock

1+ parts

$13.160

100+ parts

-

1k+ parts

-

10k+ parts

-

977

$13.160

-

-

-

TANS Electronics

Latvia . 8,388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,388

-

-

-

-

Problanco Electronics

Mexico . 5,816 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,816

-

-

-

-

Kulean Microsystems

USA . 5,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,187

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

UHIMA Technologies

Türkiye . 907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

907

-

-

-

-

Corohmni

South Africa . 486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

486

-

-

-

-

Corphita

USA . 378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

378

-

-

-

-

SupplyDigital Components

Austria . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Overview

Capture every detail with the KAF-50100-ABA-JR-BA by Onsemi, a high-quality image sensor designed to deliver exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this sensor is perfect for a wide range of applications, from industrial imaging to scientific research. With its advanced features and precise design, this product offers customers unparalleled value and benefits, allowing them to achieve superior image quality and accuracy in their projects. Trust Onsemi and experience the difference with the KAF-50100-ABA-JR-BA.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for high-resolution images with fine detail.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage ensures stable and reliable performance under varying power conditions.

Body Width: 50.8 inch

The compact body width makes this image sensor suitable for integration into a variety of devices and systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

The use of CCD technology ensures high-quality image capture with low noise levels.

Body Height: 3.46 mm

The low body height enables slim and sleek designs for products utilizing this image sensor.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy integration into electronic circuits and PCB layouts.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage helps in reducing power consumption and increasing energy efficiency.

Maximum Operating Temperature: 60 °C

The high maximum operating temperature ensures reliable performance even in elevated temperature environments.

Horizontal Pixel: 8176

The high horizontal pixel count provides detailed and crisp images with wide coverage.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the image sensor can function in cold conditions without any issues.

Housing: CERAMIC

The ceramic housing provides durability and protection for the sensitive internal components of the image sensor.

Dynamic Range: 70.2 dB

The high dynamic range allows for capturing a wide range of brightness levels in the same image without overexposure or underexposure.

Vertical Pixel: 6132

The high vertical pixel count ensures detailed images with good resolution in both horizontal and vertical dimensions.

Body Length/Diameter: 59.61 mm

The compact body length/diameter ratio allows for easy integration into various devices and systems with limited space.

Spectral Response (nm): 350-1100

The wide spectral response range enables the image sensor to capture a broad spectrum of colors and wavelengths accurately.

Termination Type: SOLDER

The solder termination type provides a reliable and secure connection for the image sensor during installation and operation.

Array Type: FULL FRAME

The full-frame array type ensures that the entire image sensor surface is utilized for capturing the image, leading to high-quality results.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for secure and stable installation of the image sensor onto circuit boards or mounting platforms.

Technical Specifications

Image Sensors KAF-50100-ABA-JR-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON, IT ALSO HAVE ESTIMATED LINEAR DYNAMIC RANGE 69.3 DB

Array Type:

FULL FRAME

Body Width:

50.8 inch

Body Height:

3.46 mm

Body Length/Diameter:

59.61 mm

Dynamic Range:

70.2 dB

Horizontal Pixel:

8176

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Spectral Response (nm):

350-1100

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

6132

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12