Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi MT9V0221A7ATC is a CMOS image sensor with 6x6 um pixel size, 752H x 480V resolution, and 26.6 MHz master clock. It operates at -40 to 85 °C, has a dynamic range of 54.4 dB, and outputs in the range of 0.30-2.60V. Ideal for applications requiring high-quality imaging at a frame rate of up to 60 fps such as surveillance cameras or industrial machine vision systems.
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Small pixel size allows for higher resolution images with better clarity and detail.
Higher supply voltage allows for efficient performance and reliability of the image sensor.
High master clock frequency enables fast data processing and image capture.
Compact body width makes it suitable for integration into various devices and systems.
CMOS image sensors offer low noise, high sensitivity, and efficient power consumption.
Low body height facilitates slim design and easy integration into compact devices.
Square package shape provides uniformity and ease of mounting in different orientations.
Low minimum supply voltage helps in saving power and extending battery life.
High maximum operating temperature ensures reliable performance even in extreme conditions.
Higher horizontal pixel count enables wider image capture and better resolution.
Wide output range provides flexibility in adjusting output signal levels for different applications.
Low minimum operating temperature allows for use in cold environments without compromising performance.
Moderate operating current ensures power efficiency without excessive power consumption.
High dynamic range allows for capturing images with a wide range of brightness levels and details.
Decent vertical pixel count provides sufficient resolution for capturing detailed images.
Compact body length/diameter allows for versatile mounting options and space-saving design.
Standard optical format makes it compatible with a wide range of lenses and imaging systems.
Solder termination provides secure and reliable electrical connections for long-term usage.
2-wire interface simplifies the connection process and allows for easy integration with other components.
High frame rate ensures smooth and real-time capture of fast-moving objects or scenes.
Frame array type offers efficient image capture and processing for a wide range of applications.
Surface mounting feature enables easy and secure attachment to PCBs or other surfaces.
Image Sensors MT9V0221A7ATC attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
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Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ROHM
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
Hitano Enterprise
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Pro-an Electronic
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
AR0141IRSH00SUEA0-DR
The Onsemi AR0141IRSH00SUEA0-DR is a CMOS image sensor with 1280x800 resolution and 3x3 um pixel size. Operating at -30 to 70 °C, it offers a dynamic range of 79 dB and outputs digital voltage from 0.40-2.50V. Ideal for applications requiring high-quality imaging in a compact form factor like surveillance cameras or industrial machine vision systems.
NOIH2SM1000T-HHC
NOIH2SM1000T-HHC by Onsemi is a CMOS image sensor with 1024x1024 pixels, 18x18 um pixel size, and operates at temperatures from -40 to 85 °C. It has a digital voltage output range of 2.20-2.60V and requires a 3.3V power supply. Ideal for applications requiring high-resolution imaging in a compact square ceramic package for surface mount assembly.
NOIX1SE9400B-LTI
NOIX1SE9400B-LTI by Onsemi is an Image Sensor with 3.2X3.2 um Pixel Size, 32.4 MHz Master Clock, and 3072 Horizontal Pixels. Ideal for applications requiring high-resolution imaging in a compact form factor, such as surveillance cameras or industrial machine vision systems.
NOIP1FN1300A-QDI
NOIP1FN1300A-QDI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 1/2 inch optical format. It operates b/w -40 to 85 °C and has a dynamic range of 60 dB. Ideal for high-speed imaging applications at up to 210 fps.
MT9P401I12STC
The Onsemi MT9P401I12STC is a 2.2x2.2um image sensor with 2592H x 1944V pixels, operating at -30 to 70 °C. It requires a 2.8V power supply and features surface mounting, making it ideal for high-resolution imaging applications in various industries.
AR0220AT3B00XUEA0-DRBR
Onsemi's AR0220AT3B00XUEA0-DRBR is a CMOS image sensor with 1828x948 pixels, 120dB dynamic range, and 27MHz master clock. Ideal for frame array applications in devices requiring high-resolution imaging at temperatures ranging from -40 to 105 °C.
KAI-02150-ABA-JD-BA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Optical Format (inch): 2/3;
KAI-47051-FXA-JD-B1
KAI-47051-FXA-JD-B1 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
MT9J003I12STCV2-TP
MT9J003I12STCV2-TP by Onsemi is a CMOS image sensor with 3856x2764 pixels, 1.67um pixel size, and 65.2dB dynamic range. It operates at -30 to 70°C, has a digital output interface, and is ideal for high-resolution imaging applications requiring fast frame rates up to 60fps.
KAI-29050-AAA-JP-B2
Onsemi's KAI-29050-AAA-JP-B2 is a 5.5x5.5 um CCD image sensor with 6576 (H) x 4384 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C, with data rate of 40 Mbps and frame rate of 4 fps. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.
CMV2000-3E5C1PP
Ams Ag
CMV2000-3E5C1PP by Ams Ag is a 2/3-inch CMOS image sensor with 2048x1088 pixels, offering a high dynamic range of 90 dB. With a pixel size of 5.5um, it operates b/w -30°C to 70°C and features an SPI interface for fast data transfer. Ideal for applications requiring high-speed imaging such as machine vision and industrial inspection.
AR0521SR2C09SURA0-DP
Onsemi's AR0521SR2C09SURA0-DP is a 12mm x 12mm CMOS image sensor with 2592x1944 resolution, suitable for high-speed imaging applications at 60fps. It features a square package style, solder termination, and a 1/2.5-inch optical format, making it ideal for surface mount frame array setups.
NOIX1SN9400B-LTI
NOIX1SN9400B-LTI by Onsemi is an Image Sensor with 3.2x3.2 um Pixel Size, 32.4 MHz Master Clock, and 3072 Horizontal Pixels. It operates b/w -40 to 85 °C and has a dynamic range of 68 dB. Ideal for applications requiring high-resolution imaging at a fast frame rate of 90 fps in a compact surface-mount package.
KAF-3200-ABA-CD-B2
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 2184; Housing: CERAMIC; Minimum Operating Temperature: -60 Cel;
KAI-2001-AAA-CP-AE
IMAGE SENSOR,CCD;
KAF-39000-CAA-DD-AA
The Onsemi KAF-39000-CAA-DD-AA is an image sensor with 6.8X6.8 um pixel size, 7216 horizontal pixels, and 5412 vertical pixels. It operates at temperatures ranging from 0 to 60 °C and requires a power supply of 15V. This sensor is ideal for applications requiring high-resolution imaging in various industries.
NOIP1SE0500A-QTI
NOIP1SE0500A-QTI by Onsemi is an image sensor with 4.80x4.80 um pixel size, 72 MHz master clock, and 800x600 resolution. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high frame rate of 545 fps and wide dynamic range of 60 dB.
KLI-2113-RAA-ED-AA
KLI-2113-RAA-ED-AA by Onsemi is an Image Sensor with 14x14 um pixel size, 76 dB dynamic range, and 20 Mbps data rate. It is used in applications requiring voltage output sensors like CCD cameras for high-quality imaging.
MT9M001C12STM
Aptina
IMAGE SENSOR,CMOS; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.40V; Termination Type: SOLDER; Frame Rate: 30 fps;
AR0231AT7B00XUEA0-DPBR-E
Onsemi's AR0231AT7B00XUEA0-DPBR-E is a CMOS image sensor with 3um pixel size, 27 MHz master clock, and 120dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 60fps, such as surveillance cameras and automotive vision systems.
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MT9V024IA7XTM-DP2
MT9V024IA7XTM-DP2 by Onsemi is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications in various imaging devices due to its compact 9mm square package design.
MT9V024IA7XTM-DP1
MT9V024IA7XTM-DP1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It offers 60 fps frame rate, solder termination, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact devices like smartphones and security cameras.
MT9V024IA7XTM-DR
MT9V024IA7XTM-DR by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at -40 to 105°C, it has a frame rate of 60 fps and digital voltage output interface. Ideal for applications requiring high-quality imaging in varying temperature conditions.
MT9V024IA7XTM-DP
MT9V024IA7XTM-DP by Onsemi features a 6x6 um pixel size, 27 MHz master clock, and 100 dB dynamic range. Ideal for image sensing applications in devices requiring high-resolution imaging capabilities.
MT9V034C12STM-DP1
The Onsemi MT9V034C12STM-DP1 is a 1/3 inch CMOS image sensor with a pixel size of 6X6 um. It operates at a max supply voltage of 3.6 V and has a master clock frequency of 27 MHz. This sensor is commonly used in applications requiring high-resolution imaging at a frame rate of 60 fps.
MT9V034C12STM-DP
Onsemi's MT9V034C12STM-DP is a 1/3 inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at 60 fps with a pixel size of 6x6 um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.
MT9V024IA7XTM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Optical Format (inch): 1/3; Terminal Finish: TIN SILVER COPPER; Additional Features: AEC-Q100; GLOBAL SHUTTER; Array Type: FRAME;
MT9V024IA7XTM-TR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Maximum Operating Temperature: 105 Cel;
MT9V024IA7XTM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Master Clock: 27 MHz;
MT9V024IA7XTC-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Additional Features: GLOBAL SHUTTER;
MT9V034C12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -11-11mA; Body Width: 11.43 inch;
MT9V034C12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -11-11mA; Optical Format (inch): 1/3;
MT9V034C12STM-DR
Onsemi's MT9V034C12STM-DR is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100dB. Operating at 60fps with a pixel size of 6x6um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and fast frame rates in compact designs.
MT9V024IA7XTM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Dynamic Range: 100 dB; Vertical Pixel: 480; Minimum Operating Temperature: -40 Cel;
MT9V128IA3XTC-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Dynamic Range: 74.8 dB;
MT9V128IA3XTC-DP1
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
MT9V128IA3XTC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -40 Cel; Body Width: 9 inch;
MT9V128IA3XTC-DR1
MT9V128IA3XTC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; JESD-609 Code: e1; Termination Type: SOLDER;
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