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MT9V034C12STM-DP

Onsemi

MT9V034C12STM-DP by Onsemi

Onsemi's MT9V034C12STM-DP is a 1/3 inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at 60 fps with a pixel size of 6x6 um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.

Median Price

$11.398

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 1,510 parts In-Stock

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$10.274

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$10.274

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$10.274

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$10.274

1,510

$10.274

$10.274

$10.274

$10.274

Arrow

USA . 7,600 parts In-Stock

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$12.523

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$12.523

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Digiode

USA . 1,850 parts In-Stock

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$9.760

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$9.760

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Nova Conductors

Japan . 750 parts In-Stock

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$13.842

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750

$13.842

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Flip Electronics

USA . 25,215 parts In-Stock

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Vyrian

USA . 8,197 parts In-Stock

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Chip Stock

USA . 7,580 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,531 parts In-Stock

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$2.070

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$2.070

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Ampacity Inc.

Singapore . 4,269 parts In-Stock

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$8.730

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$8.730

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Semicontronic

India . 4,178 parts In-Stock

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$8.730

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$8.512

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$8.468

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$8.730

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$8.468

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Corphita

USA . 2,195 parts In-Stock

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$9.247

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Corohmni

South Africa . 240 parts In-Stock

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$10.274

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240

$10.274

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Continental Prestige Electronics

USA . 6,446 parts In-Stock

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$13.842

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$13.565

6,446

$13.842

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$13.565

AZTECH Wire

Italy . 1,009 parts In-Stock

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$16.950

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$16.950

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

USA . 18,000 parts In-Stock

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Lixinc

USA . 17,363 parts In-Stock

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S.R.D Solutions

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TANS Electronics

Latvia . 6,996 parts In-Stock

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Problanco Electronics

Mexico . 5,165 parts In-Stock

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Kulean Microsystems

USA . 4,062 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 3,040 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 2,000 parts In-Stock

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$12.873

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RC Electronics

USA . 1,514 parts In-Stock

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Benley Electronics

USA . 126 parts In-Stock

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SupplyDigital Components

Austria . 112 parts In-Stock

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UHIMA Technologies

Türkiye . 74 parts In-Stock

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Overview

Revolutionize your imaging experience with the MT9V034C12STM-DP image sensor by Onsemi. Known for producing top-quality components, Onsemi delivers unparalleled performance in the field of image sensors. This innovative product offers a wide range of applications in various industries, providing crisp and clear images with a high dynamic range. With its advanced features and reliable design, the MT9V034C12STM-DP guarantees value and benefits to customers looking for top-notch image sensor technology. Experience the difference with Onsemi's cutting-edge sensor technology.

Feature Benefit Bullets

Pixel Size (um): 6X6

Small pixel size allows for high-resolution image capture with fine details.

Maximum Supply Voltage: 3.6 V

Wide supply voltage range provides flexibility in power source options.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and frame rates.

Body Width: 11.43 inch

Compact size makes it suitable for integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology offers low power consumption and high image quality.

Body Height: 2.3 mm

Low profile design allows for slim device form factor.

Package Shape or Style: SQUARE

Square package shape simplifies mounting and alignment during assembly.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures performance in various environmental conditions.

Horizontal Pixel: 752

High horizontal pixel count provides detailed image output.

Output Range: -11-11mA

Wide output range allows for versatile signal processing.

Output Type: DIGITAL CURRENT

Digital current output simplifies interfacing with external devices.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature range enables use in extreme cold conditions.

Maximum Operating Current: 60 mA

High operating current capacity supports multiple functions simultaneously.

Housing: CERAMIC

Ceramic housing provides durability and thermal stability.

Dynamic Range: 100 dB

Wide dynamic range captures both dark and bright areas in high detail.

Vertical Pixel: 480

Vertical pixel count complements horizontal resolution for balanced image quality.

Body Length/Diameter: 11.43 mm

Compact body size allows for easy integration into different devices.

Optical Format (inch): 1/3

Common optical format for compatibility with various lenses and imaging systems.

Termination Type: SOLDER

Solder termination provides secure connection for reliable signal transmission.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies communication with external devices.

Frame Rate: 60 fps

High frame rate ensures smooth video capture and real-time imaging.

Array Type: FRAME

Array frame design enhances overall image capture efficiency.

Sensitivity (V/lx.s): 4.8 V/lx.s

High sensitivity allows for clear image output even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount capability for easy and secure installation on PCBs.

Technical Specifications

Image Sensors MT9V034C12STM-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

DUAL OUTPUT

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.3 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

Housing:

CERAMIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensitivity (V/lx.s):

4.8 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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