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MT9V034C12STM-TP

Onsemi

MT9V034C12STM-TP by Onsemi

MT9V034C12STM-TP by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a max supply voltage of 3.6V and operating temperature range from -30 to 70°C. With a pixel size of 6x6μm, it provides a dynamic range of 100dB and output interface type of 2-wire for applications in digital cameras and surveillance systems.

Median Price

$12.490

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 7,000 parts In-Stock

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7,000

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Rochester

USA . 3 parts In-Stock

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-

100+ parts

$12.490

1k+ parts

$11.180

10k+ parts

$10.520

3

-

$12.490

$11.180

$10.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$12.430

100+ parts

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100

$12.430

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-

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Digiode

USA . 2,053 parts In-Stock

1+ parts

$13.224

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2,053

$13.224

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Flip Electronics

USA . 7,000 parts In-Stock

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7,000

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Vyrian

USA . 5,668 parts In-Stock

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5,668

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,281 parts In-Stock

1+ parts

$2.520

100+ parts

-

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3,281

$2.520

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Semicontronic

India . 3,232 parts In-Stock

1+ parts

$11.830

100+ parts

$11.534

1k+ parts

$11.475

10k+ parts

-

3,232

$11.830

$11.534

$11.475

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Ampacity Inc.

Singapore . 3,072 parts In-Stock

1+ parts

$11.830

100+ parts

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3,072

$11.830

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Corohmni

South Africa . 104 parts In-Stock

1+ parts

$11.938

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104

$11.938

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Continental Prestige Electronics

USA . 6,639 parts In-Stock

1+ parts

$12.410

100+ parts

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$12.162

6,639

$12.410

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$12.162

Corphita

USA . 257 parts In-Stock

1+ parts

$12.528

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257

$12.528

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AZTECH Wire

Italy . 644 parts In-Stock

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$21.130

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644

$21.130

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Authorized Procurement Solutions

USA . 18,000 parts In-Stock

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18,000

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Kulean Microsystems

USA . 7,983 parts In-Stock

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7,983

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Problanco Electronics

Mexico . 3,582 parts In-Stock

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3,582

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TANS Electronics

Latvia . 3,230 parts In-Stock

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SupplyDigital Components

Austria . 1,725 parts In-Stock

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1,725

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UHIMA Technologies

Türkiye . 623 parts In-Stock

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623

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$12.181

1k+ parts

$11.809

10k+ parts

$11.560

100

-

$12.181

$11.809

$11.560

Argo Parts USA

USA . 48 parts In-Stock

1+ parts

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48

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Overview

Unlock a world of crystal-clear imaging with the Onsemi MT9V034C12STM-TP image sensor. Known for their superior quality and cutting-edge technology, Onsemi offers a range of innovative solutions for various applications. Whether you're capturing stunning visuals for security systems, automotive cameras, or industrial machinery, this image sensor delivers unparalleled performance and reliability. With a wide range of benefits and value-added features, the MT9V034C12STM-TP is the ideal choice for customers seeking top-notch image sensing capabilities. Trust Onsemi to provide you with the best in class technology that exceeds your expectations.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for high resolution and sharp images to be captured by the image sensor.

Maximum Supply Voltage: 3.6V

Allows for flexibility in power supply options and can be easily integrated into different electronic systems.

Master Clock: 27 MHz

Provides fast and accurate timing for capturing images with high frame rates.

Body Width: 11.43 inch

A compact size makes it easy to integrate into various devices and applications.

Output Interface Type: 2-WIRE INTERFACE

Offers a simple and efficient way to connect the image sensor to other components in a system.

Dynamic Range: 100 dB

Allows for capturing a wide range of light intensities, resulting in high-quality images in various lighting conditions.

Technical Specifications

Image Sensors MT9V034C12STM-TP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

DUAL OUTPUT

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.3 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

Housing:

CERAMIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensitivity (V/lx.s):

4.8 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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