Loading...

AR1335HSSC11SMAA0-DPBR-E

Onsemi

AR1335HSSC11SMAA0-DPBR-E by Onsemi

Onsemi's AR1335HSSC11SMAA0-DPBR-E is a 1/3.2" CMOS image sensor with 4208x3120 pixels, offering a 69 dB dynamic range and operating at a max supply voltage of 1.3 V. This sensor, featuring a square package style, is ideal for applications requiring high-resolution imaging at 30 fps such as surveillance cameras or industrial machine vision systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,303

-

-

-

-

Vyrian

USA . 755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

755

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,974

-

-

-

-

SupplyDigital Components

Austria . 4,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,291

-

-

-

-

Kulean Microsystems

USA . 4,279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,279

-

-

-

-

TANS Electronics

Latvia . 2,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,594

-

-

-

-

Corphita

USA . 2,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,062

-

-

-

-

Northwest PG Solutions

USA . 1,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,037

-

-

-

-

Native Components

USA . 586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

586

-

-

-

-

UHIMA Technologies

Türkiye . 366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

366

-

-

-

-

Corohmni

South Africa . 69 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69

-

-

-

-

Overview

Capture every moment in stunning detail with the AR1335HSSC11SMAA0-DPBR-E image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that meet and exceed customer expectations. Ideal for applications in automotive, security, and industrial imaging, this image sensor offers unparalleled performance and reliability. Elevate your products with the advanced features and benefits of the AR1335HSSC11SMAA0-DPBR-E, providing value and precision that customers can trust.

Feature Benefit Bullets

Pixel Size (um): 1.1

Small pixel size allows for high resolution and detailed images to be captured.

Maximum Supply Voltage: 1.3 V

Low maximum supply voltage helps in reducing power consumption and heat generation.

Master Clock: 48 MHz

High master clock frequency enables fast data processing and high frame rates.

Body Width: 10 inch

Compact size allows for easy integration into different devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors provide high image quality, low noise, and efficient imaging performance.

Body Height: 1.325 mm

Slim body height design enables the sensor to be used in thin devices or applications.

Package Shape or Style: SQUARE

Square package shape makes it easier for mounting and handling during installation.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage helps in optimizing power consumption and extending battery life.

Horizontal Pixel: 4208

High horizontal pixel count allows for wide and detailed image capture.

Output Type: DIGITAL VOLTAGE

Digital output voltage provides easy interfacing with other digital systems and components.

Housing: CERAMIC

Ceramic housing offers durability, thermal stability, and protection from external factors.

Dynamic Range: 69 dB

High dynamic range ensures accurate representation of both dark and bright areas in an image.

Vertical Pixel: 3120

High vertical pixel count allows for detailed image capture in the vertical direction.

Body Length/Diameter: 10 mm

Compact body length allows for versatile installation and integration options.

Optical Format (inch): 1/3.2

Optical format ensures compatibility with various lenses and optical systems for different imaging requirements.

Termination Type: SOLDER

Solder termination provides secure electrical connections for reliable performance.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connectivity and communication with external systems or controllers.

Frame Rate: 30 fps

High frame rate allows for smooth and fast video recording or image capture.

Array Type: FULL FRAME

Full frame array ensures that the entire image is captured without cropping or distortion.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for easy and secure attachment to PCBs or other surfaces.

Technical Specifications

Image Sensors AR1335HSSC11SMAA0-DPBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

MECHANICAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.6 V TO 2.9 V

Array Type:

FULL FRAME

Body Width:

10 inch

Body Height:

1.325 mm

Body Length/Diameter:

10 mm

Dynamic Range:

69 dB

Frame Rate:

30 fps

Horizontal Pixel:

4208

Housing:

CERAMIC

Master Clock:

48 MHz

Mounting Feature:

Optical Format (inch):

1/3.2

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

1.1

Sensors or Transducers Type:

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.14 V

Termination Type:

SOLDER

Vertical Pixel:

3120

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6