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KAI-29052-FXA-JD-B2

Onsemi

KAI-29052-FXA-JD-B2 by Onsemi

Onsemi's KAI-29052-FXA-JD-B2 is a 5.5X5.5 um pixel size CCD image sensor with 6576H x 4384V resolution, offering a dynamic range of 66 dB. It operates b/w -50 to 70 °C and has a max supply voltage of 15.5 V, making it suitable for applications requiring high-quality imaging in various lighting conditions.

Median Price

$12,265.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 74 parts In-Stock

1+ parts

$12,265.000

100+ parts

$7,195.470

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$7,195.470

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Verical

USA . 74 parts In-Stock

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$12,265.000

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$7,195.470

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74

$12,265.000

$7,195.470

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Distributors (In-Stock)

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Digiode

USA . 2,092 parts In-Stock

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$11,651.750

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Vyrian

USA . 3,350 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,413 parts In-Stock

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$11,038.500

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2,413

$11,038.500

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Corohmni

South Africa . 404 parts In-Stock

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$12,265.000

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404

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Problanco Electronics

Mexico . 8,261 parts In-Stock

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Kulean Microsystems

USA . 4,103 parts In-Stock

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SupplyDigital Components

Austria . 4,023 parts In-Stock

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TANS Electronics

Latvia . 2,670 parts In-Stock

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UHIMA Technologies

Türkiye . 163 parts In-Stock

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Overview

Capture the essence of every moment with the KAI-29052-FXA-JD-B2 by Onsemi. Crafted with precision and expertise, this image sensor delivers unparalleled quality and performance. Ideal for a wide range of applications, this sensor offers crystal-clear images and exceptional reliability. Elevate your projects with the cutting-edge technology of Onsemi and experience the value and benefits that only the KAI-29052-FXA-JD-B2 can provide.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution images with clearer details.

Maximum Supply Voltage: 15.5 V

Supports higher voltage input for improved performance and flexibility.

Body Width: 45.34 inch

Compact size allows for easy integration into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Uses CCD technology for high-quality image capture and processing.

Body Height: 3.61 mm

Slim profile enables easy installation in space-constrained environments.

Package Shape or Style: RECTANGULAR

Simplifies mounting and alignment during setup and assembly.

Minimum Supply Voltage: 14.5 V

Works efficiently with lower voltage input for power saving and compatibility.

Maximum Operating Temperature: 70 °C

Can operate in high-temperature environments without compromising performance.

Horizontal Pixel: 6576

High pixel count provides detailed and sharp images for accurate analysis.

Output Type: CURRENT OUTPUT

Current output signal ensures reliable data transmission for precise imaging.

Minimum Operating Temperature: -50 °C

Can function in extremely low-temperature conditions for versatile usage.

Maximum Operating Current: 11 mA

Efficient power consumption with low operating current for prolonged use.

Dynamic Range: 66 dB

Wide dynamic range captures both bright and dark elements in the scene accurately.

Vertical Pixel: 4384

Vertical pixel count complements horizontal pixels for full-resolution images.

Body Length/Diameter: 47.24 mm

Compact and lightweight design for easy handling and installation.

Optical Format (inch): 1.7

Standard optical format for compatibility with a wide range of lenses and accessories.

Data Rate: 40 Mbps

High data rate allows for quick transfer of image data for real-time applications.

Termination Type: SOLDER

Secure solder termination for stable and reliable connections in use.

Frame Rate: 4 fps

Provides real-time image capture at a decent frame rate for smooth video output.

Array Type: INTERLINE

Interline array design reduces image artifacts and distortion for better image quality.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting ensures secure attachment and stability during operation.

Technical Specifications

Image Sensors KAI-29052-FXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 35 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

3.61 mm

Body Length/Diameter:

47.24 mm

Data Rate:

40 Mbps

Dynamic Range:

66 dB

Frame Rate:

4 fps

Horizontal Pixel:

6576

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1.7

Output Type:

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4384

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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