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AR1335CSSC11SMKA0-CP

Onsemi

AR1335CSSC11SMKA0-CP by Onsemi

AR1335CSSC11SMKA0-CP by Onsemi is a 1/3.2 inch CMOS image sensor with 4208x3120 pixels, offering a frame rate of 30 fps. It features a 2-wire interface and solder termination, suitable for surface mount applications in various imaging devices.

Median Price

$16.304

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,000 parts In-Stock

1+ parts

$11.149

100+ parts

-

1k+ parts

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$8.153

4,000

$11.149

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-

$8.153

DigiKey

USA . 215 parts In-Stock

1+ parts

$17.420

100+ parts

$13.165

1k+ parts

$12.159

10k+ parts

-

215

$17.420

$13.165

$12.159

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Chip1Stop

Japan . 5,870 parts In-Stock

1+ parts

$59.400

100+ parts

$26.400

1k+ parts

$17.500

10k+ parts

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5,870

$59.400

$26.400

$17.500

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Flip Electronics (Authorized)

USA . 48,000 parts In-Stock

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Verical

USA . 3,800 parts In-Stock

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$15.188

1k+ parts

$13.738

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3,800

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$15.188

$13.738

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Rochester

USA . 1,392 parts In-Stock

1+ parts

-

100+ parts

$11.640

1k+ parts

$10.410

10k+ parts

$9.800

1,392

-

$11.640

$10.410

$9.800

Avnet

USA . 500 parts In-Stock

1+ parts

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$44.231

500

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$44.231

Distributors (In-Stock)

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Digiode

USA . 2,180 parts In-Stock

1+ parts

$10.592

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2,180

$10.592

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$12.896

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300

$12.896

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Flip Electronics

USA . 51,000 parts In-Stock

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51,000

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Sensible Micro Corp

USA . 5,807 parts In-Stock

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5,807

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Vyrian

USA . 4,636 parts In-Stock

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4,636

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VNN

France . 918 parts In-Stock

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918

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Bristol Electronics

USA . 69 parts In-Stock

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69

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AGACORP

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Corohmni

South Africa . 376 parts In-Stock

1+ parts

$6.033

100+ parts

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376

$6.033

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Ampacity Inc.

Singapore . 11,558 parts In-Stock

1+ parts

$9.480

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11,558

$9.480

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Corphita

USA . 1,666 parts In-Stock

1+ parts

$10.034

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1,666

$10.034

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Continental Prestige Electronics

USA . 6,112 parts In-Stock

1+ parts

$12.896

100+ parts

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10k+ parts

$12.638

6,112

$12.896

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-

$12.638

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$12.900

100+ parts

$12.255

1k+ parts

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$11.481

100

$12.900

$12.255

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$11.481

Perfect Parts

USA . 20,048 parts In-Stock

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20,048

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Kulean Microsystems

USA . 7,022 parts In-Stock

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GreenTree Electronics

Israel . 5,975 parts In-Stock

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5,975

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Problanco Electronics

Mexico . 3,207 parts In-Stock

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3,207

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Infinite Electronics LLP (Excess)

. 3,082 parts In-Stock

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Formix International (Excess)

India . 3,072 parts In-Stock

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3,072

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SupplyDigital Components

Austria . 1,306 parts In-Stock

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1,306

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Argo Parts USA

USA . 1,080 parts In-Stock

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1,080

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TANS Electronics

Latvia . 939 parts In-Stock

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939

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UHIMA Technologies

Türkiye . 488 parts In-Stock

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488

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Overview

Elevate your imaging experience with the AR1335CSSC11SMKA0-CP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that are perfect for a wide range of applications. Whether you're capturing stunning photographs or recording high-definition videos, this CMOS image sensor offers exceptional performance and reliability. With a high pixel count and advanced technology, this sensor ensures crystal-clear images every time. Trust Onsemi to provide you with cutting-edge solutions that bring your vision to life.

Feature Benefit Bullets

Pixel Size (um) 1.1X1.1:

Provides high resolution images due to small pixel size.

Sensors or Transducers Type IMAGE SENSOR,CMOS:

Offers high quality imaging with CMOS technology.

Package Shape or Style RECTANGULAR:

Easy to integrate into various electronic devices.

Horizontal Pixel 4208:

Captures detailed and sharp images with high pixel count.

Terminal Finish TIN SILVER COPPER:

Ensures reliable electrical connections for long-term use.

Vertical Pixel 3120:

Delivers clear and crisp images with high vertical resolution.

Optical Format (inch) 1/3.2:

Provides a good balance between sensor size and image quality.

Termination Type SOLDER:

Allows for secure and stable connections during operation.

Output Interface Type 2-WIRE INTERFACE:

Easy to connect to other devices for data transfer.

Frame Rate 30 fps:

Captures smooth and fluid motion in videos and fast-paced scenes.

Array Type FRAME:

Enables efficient image capture with a frame array design.

Mounting Feature SURFACE MOUNT:

Convenient for easy installation and secure placement.

Technical Specifications

Image Sensors AR1335CSSC11SMKA0-CP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Frame Rate:

30 fps

Horizontal Pixel:

4208

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3.2

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

1.1X1.1

Sensors or Transducers Type:

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

3120

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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