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TC241-22

Texas Instruments

TC241-22 by Texas Instruments

TC241-22 by Texas Instruments is an image sensor with 754x244 pixels, 11.5X27um size, and operates at -10 to 45 °C. It requires a 12V power supply and features THROUGH HOLE MOUNT. Ideal for applications requiring high-resolution imaging in varying temperature conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,722 parts In-Stock

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Digiode

USA . 1,211 parts In-Stock

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1,211

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Distributors (Availability)

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Parana Technologies

USA . 390 parts In-Stock

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$1.708

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-

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$2.300

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390

$1.708

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$2.300

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DigiPath Technology Company

USA . 1,053 parts In-Stock

1+ parts

$1.881

100+ parts

$1.730

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1,053

$1.881

$1.730

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ChromeModa Solutions

Germany . 6,150 parts In-Stock

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$1.919

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$1.574

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6,150

$1.919

$1.574

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IDEA Electronic Components Group

UK . 122 parts In-Stock

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$1.919

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$1.727

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122

$1.919

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$1.727

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One Stop Electronics

USA . 423 parts In-Stock

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$2.750

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423

$2.750

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AZTECH Wire

Italy . 217 parts In-Stock

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$10.856

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217

$10.856

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Ampacity Inc.

Singapore . 247 parts In-Stock

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$19.750

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247

$19.750

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Semicontronic

India . 272 parts In-Stock

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$50.750

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$49.481

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$49.228

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272

$50.750

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$49.228

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Corphita

USA . 3,652 parts In-Stock

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Corohmni

South Africa . 205 parts In-Stock

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Overview

Elevate your imaging projects with the TC241-22 by Texas Instruments, a top-quality image sensor designed to exceed expectations. With a focus on precision and reliability, Texas Instruments has crafted this sensor to deliver outstanding performance in a variety of applications. From surveillance systems to medical devices, the TC241-22 offers unparalleled value, providing customers with crystal-clear images, seamless integration, and unparalleled efficiency. Trust Texas Instruments to provide you with the tools you need for success.

Feature Benefit Bullets

Pixel Size (um): 11.5X27

The larger pixel size allows for more light to be captured, resulting in improved image quality even in low-light conditions.

Power Supplies (V): 12

The product operates efficiently on a standard 12V power supply, making it easy to integrate into various systems.

Maximum Operating Temperature: 45 °C

With a high maximum operating temperature of 45°C, this product is suitable for use in a wide range of environments without risk of overheating.

Horizontal Pixel: 754

A high number of horizontal pixels allows for detailed imaging and accuracy in capturing images with precision.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10°C ensures the product can withstand cold conditions, making it versatile for different applications.

Vertical Pixel: 244

The vertical pixel count adds depth and clarity to images, making this product ideal for capturing detailed and high-resolution visuals.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature offers secure and reliable installation, ensuring stability during operation and ease of integration into various systems.

Technical Specifications

Image Sensors TC241-22 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Horizontal Pixel:

754

Mounting Feature:

Maximum Operating Temperature:

45 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

11.5X27

Power Supplies (V):

12

Sub-Category:

CCD Image Sensors

Vertical Pixel:

244

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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