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KAE-04471-FBA-SP-EE

Onsemi

KAE-04471-FBA-SP-EE by Onsemi

KAE-04471-FBA-SP-EE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w -30 to 40 °C, has a max supply voltage of 15.3 V, and outputs voltage data at a rate of 40 Mbps. Ideal for applications requiring high-quality imaging in various lighting conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 437 parts In-Stock

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Digiode

USA . 210 parts In-Stock

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SupplyDigital Components

Austria . 6,406 parts In-Stock

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TANS Electronics

Latvia . 6,044 parts In-Stock

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Problanco Electronics

Mexico . 4,117 parts In-Stock

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Kulean Microsystems

USA . 1,876 parts In-Stock

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Corphita

USA . 354 parts In-Stock

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Corohmni

South Africa . 180 parts In-Stock

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UHIMA Technologies

Türkiye . 137 parts In-Stock

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Overview

Experience the superior image quality with the KAE-04471-FBA-SP-EE by Onsemi! As a leading manufacturer in the industry, Onsemi's image sensors are known for their reliability and high performance. Ideal for a wide range of applications, this CCD sensor offers unparalleled clarity and precision in every image it captures. With a dynamic range of 72 dB and a fast data rate of 40 Mbps, customers can trust that they are getting the best value for their investment. Upgrade your imaging systems today with the KAE-04471-FBA-SP-EE and see the difference for yourself!

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Small pixel size allows for high resolution imaging with detailed pictures.

Maximum Supply Voltage: 15.3 V

Allows for efficient power utilization and stable performance.

Body Width: 41 inch

Compact size for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors provide high quality image capture for professional applications.

Package Shape or Style: RECTANGULAR

Standard shape for easy mounting and installation.

Minimum Supply Voltage: 14.7 V

Allows for flexibility in power supply options.

Maximum Operating Temperature: 40 °C

Can withstand high temperatures for extended operating times.

Horizontal Pixel: 2096

High pixel count for capturing detailed images with clarity.

Output Type: VOLTAGE OUTPUT

Provides stable voltage output for reliable data transmission.

Minimum Operating Temperature: -30 °C

Can operate in low temperature environments without issues.

Maximum Operating Current: 9 mA

Low current consumption for energy efficient operation.

Dynamic Range: 72 dB

Wide dynamic range for capturing images with varying light intensities.

Vertical Pixel: 2096

Equal vertical and horizontal pixel counts for balanced image capture.

Body Length/Diameter: 43.5 mm

Compact body size for versatile mounting options.

Optical Format (inch): 4/3

Standard optical format for compatibility with various lenses.

Data Rate: 40 Mbps

High data rate for quick and efficient data transfer.

Termination Type: SOLDER

Secure solder termination for reliable connections.

Frame Rate: 30 fps

Smooth frame rate for capturing high quality videos.

Array Type: INTERLINE

Interline array for fast image readout and minimal image lag.

Mounting Feature: THROUGH HOLE MOUNT

Easy and secure mounting for stable installation.

Technical Specifications

Image Sensors KAE-04471-FBA-SP-EE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 45 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

41 inch

Body Length/Diameter:

43.5 mm

Data Rate:

40 Mbps

Dynamic Range:

72 dB

Frame Rate:

30 fps

Horizontal Pixel:

2096

Mounting Feature:

Maximum Operating Current:

9 mA

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

4/3

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.3 V

Minimum Supply Voltage:

14.7 V

Termination Type:

SOLDER

Vertical Pixel:

2096

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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