Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAE-02150-ABB-SD-EE by Onsemi is an image sensor with 5.5X5.5 um pixel size, 40 MHz master clock, and 1920x1080 resolution. Ideal for high-speed imaging applications due to its 60 fps frame rate and 68 dB dynamic range.
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Small pixel size allows for high resolution images with fine details.
Higher supply voltage allows for better performance and faster data processing.
High master clock frequency enables fast data readout and processing.
Compact body size makes it suitable for integration into various systems.
CCD sensors offer high image quality and sensitivity, making them ideal for imaging applications.
Low body height enables thin and compact camera designs.
Rectangular shape allows for easy integration into camera modules.
Low minimum supply voltage helps in reducing power consumption.
Wide operating temperature range allows for use in various environmental conditions.
High horizontal pixel count ensures high-resolution images.
Wide minimum operating temperature range allows for use in extreme cold environments.
Low operating current helps in reducing power consumption.
High dynamic range enables capturing detailed images with both bright and dark areas accurately.
High vertical pixel count ensures high-resolution images.
Small body length allows for compact camera designs.
2/3 inch optical format provides a good balance between image quality and size.
Solder termination provides a reliable connection in the camera module.
High frame rate allows for capturing fast-moving subjects with smooth video output.
Interline array type allows for faster image readout and processing.
Through hole mounting feature provides secure and stable installation in camera modules.
Image Sensors KAE-02150-ABB-SD-EE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N7002
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
General Semiconductor
LL4148
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
LM317D2TG
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
SS14
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
FDN5618P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
Dc Components
STM32H753IIK6
STMicroelectronics
STM32H753IIK6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like CAN, ETHERNET, and USB. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
AR0234CSSM00SUKA0-CR
AR0234CSSM00SUKA0-CR by Onsemi is an image sensor with 1920x1200 resolution, 3x3 um pixel size, and 54 MHz master clock. It operates b/w -40 to 85 °C and has a dynamic range of 71.4 dB. Ideal for applications requiring high-resolution imaging at a frame rate of up to 120 fps.
MT9V126IA3XTC-DR
MT9V126IA3XTC-DR by Onsemi is an image sensor with 5.60x5.60 um pixel size, 27 MHz master clock, and 1/4 inch optical format. It operates b/w -40 to 105 °C and has a dynamic range of 74.6 dB. Ideal for applications requiring a digital voltage output interface, such as frame arrays in cameras with a frame rate of 30 fps.
KAI-0330-CBA-CB-AE-DUALOUTPUT
Onsemi's KAI-0330-CBA-CB-AE-DUALOUTPUT is a 9x9 um CCD image sensor with 648 (H) x 484 (V) pixels. It operates at a supply voltage range of 12-15.5 V, offering an analog voltage output and a dynamic range of 57 dB. Ideal for applications requiring high-quality imaging in the spectral range of 400-900 nm.
KAF-8300-AXC-CP-AA
The Onsemi KAF-8300-AXC-CP-AA is an image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, making it suitable for high-resolution imaging applications in various industries such as astronomy and microscopy.
KAF-16803-ABA-DD-AE
The Onsemi KAF-16803-ABA-DD-AE is a CCD image sensor with 4096x4096 pixels, 9x9 um pixel size, and 80 dB dynamic range. It operates b/w -60 to 60 °C, has a spectral response of 300-1100 nm, and data rate of 10 Mbps. Ideal for high-resolution imaging applications in astronomy, microscopy, and scientific research.
OV07740-A32A
Omnivision Technologies
IMAGE SENSOR,CMOS;
AR0234CSSM00SUKA0-CP
Onsemi's AR0234CSSM00SUKA0-CP is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C, outputs digital voltage from 0.4-1.26V, and has a frame rate of 120 fps. Ideal for applications requiring high-resolution imaging in automotive or surveillance systems.
KAI-11002-ABA-CP-B1
KAI-11002-ABA-CP-B1 by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in various industries.
TC237B
Texas Instruments
TC237B by Texas Instruments is an image sensor with 7.4x7.4 um pixel size and 680 horizontal pixels. It operates b/w -10 to 45 °C, with a supply voltage range of 21-23 V. Ideal for applications requiring high sensitivity and a dynamic range of 58 dB in a compact rectangular package.
MT9V024IA7XTM-TP
MT9V024IA7XTM-TP by Onsemi is an image sensor with 752x480 pixels, 6x6 um pixel size, and 27 MHz master clock. It operates at -40 to 105 °C and has a dynamic range of 100 dB. Ideal for applications requiring high-resolution imaging in a compact form factor.
KAI-08051-AAA-JP-AE
Onsemi's KAI-08051-AAA-JP-AE is a 5.5x5.5 um pixel size CCD image sensor with 3364H x 2520V resolution, offering a dynamic range of 66 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and is ideal for industrial imaging applications due to its high-quality image capture capabilities.
KAF-4320E
The Onsemi KAF-4320E is a 24x24 um CCD image sensor with 1084x1084 pixels. It operates at a max supply voltage of 21V and has a spectral response range of 350-1000 nm. Ideal for high-resolution imaging applications, it features a data rate of 3 Mbps and through-hole mounting capability.
KAI-47051-FXA-JD-B2
The Onsemi KAI-47051-FXA-JD-B2 is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
KAI-0340-ABB-CP-AA-D
IMAGE SENSOR,CCD;
KAF-39000
Image Sensors;
AR0138AT3R00XUEA0-DPBR-E
Onsemi AR0138AT3R00XUEA0-DPBR-E is a 1/2.6" CMOS image sensor with 1288x968 resolution, 4.2um pixel size, and 69fps frame rate. Ideal for surface mount applications in cameras, offering a rectangular package style with solder termination and 2-wire interface for seamless integration.
TCD1304DG
Toshiba
Toshiba TCD1304DG is an 8x200 um image sensor with a 2 MHz master clock, ideal for applications requiring high sensitivity (160 V/lx.s) and a wide dynamic range (49.54 dB). With a spectral response of 400-1200 nm, this CCD sensor operates at temperatures from -25 to 60 °C, making it suitable for various imaging solutions.
NOIP1SN2000A-LTI
NOIP1SN2000A-LTI by Onsemi features 4.8x4.8 um pixel size, 360 MHz master clock, and 1920x1200 resolution. Ideal for image sensing applications with a spectral response of 400-1000 nm and frame rate of 230 fps.
NOIX2SN8000B-LTI
NOIX2SN8000B-LTI by Onsemi is an Image Sensor with 3.2X3.2 um pixel size, 32.4 MHz master clock, and 1/1.1 inch optical format. Ideal for applications requiring high-resolution imaging at a max operating temperature of 85 °C, offering a dynamic range of 68 dB and I2C/SPI interface for digital voltage output.
NOIV2SE1300A-QDC
NOIV2SE1300A-QDC by Onsemi is an image sensor with 1280x1024 resolution, 4.80um pixel size, and 62 MHz master clock. Ideal for applications requiring high-quality imaging at a max supply voltage of 2V, such as surveillance cameras or industrial machine vision systems.
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KAE-04471-ABA-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2096; Frame Rate: 30 fps;
KAE-01093-QBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Width: 30 inch; Maximum Operating Temperature: 60 Cel;
KAE-02150-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33 mm; Termination Type: SOLDER; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-02150-FBB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1920; Array Type: INTERLINE; Power Supplies (V): 15;
KAE-02150-ABB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Power Supplies (V): 15; Optical Format (inch): 2/3; Minimum Operating Temperature: -70 Cel;
KAE-02150-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Minimum Operating Temperature: -40 Cel; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-01093-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Horizontal Pixel: 1024;
KAE-01093-QBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 33 mm;
KAE-02150-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Housing: ALUMINIUM; Optical Format (inch): 2/3;
KAE-02150-ABB-SP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 4.61 mm; Body Length/Diameter: 33 mm; Horizontal Pixel: 1920;
KAE-02150-FBA-JP-FE
KAE-02150-ABA-JP-FE
KAE-02150-FBB-JP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Optical Format (inch): 2/3; Vertical Pixel: 1080;
KAE-01093-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-SP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 29.97 inch; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-JP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Termination Type: SOLDER; Maximum Operating Temperature: 40 Cel;
KAE-01093-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Frame Rate: 91 fps;
KAE-01093-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 9X9; Minimum Operating Temperature: -50 Cel;
KAE-02150-ABA-JP-FA
IMAGE SENSOR,CCD; Array Type: INTERLINE; Vertical Pixel: 1080; Additional Features: IT ALSO HAVE DYNAMIC RANGE 86 DB; IT HAS SENSITIVITY OF 44 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; Horizontal Pixel: 1920; Dynamic Range: 68 dB;
Supply Digital Components
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