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KAE-02150-ABB-SD-EE

Onsemi

KAE-02150-ABB-SD-EE by Onsemi

KAE-02150-ABB-SD-EE by Onsemi is an image sensor with 5.5X5.5 um pixel size, 40 MHz master clock, and 1920x1080 resolution. Ideal for high-speed imaging applications due to its 60 fps frame rate and 68 dB dynamic range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,051 parts In-Stock

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Vyrian

USA . 1,776 parts In-Stock

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TANS Electronics

Latvia . 7,227 parts In-Stock

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Kulean Microsystems

USA . 5,977 parts In-Stock

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SupplyDigital Components

Austria . 5,074 parts In-Stock

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Corphita

USA . 1,993 parts In-Stock

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Corohmni

South Africa . 348 parts In-Stock

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UHIMA Technologies

Türkiye . 336 parts In-Stock

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Problanco Electronics

Mexico . 329 parts In-Stock

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Overview

Unlock the power of high-quality imaging with the KAE-02150-ABB-SD-EE by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch Image Sensors that are innovative and reliable. This product is perfect for a wide range of applications, offering superior performance and precision. Enhance your projects with the advanced technology and unbeatable value that the KAE-02150-ABB-SD-EE provides. Experience the difference in quality and efficiency with Onsemi's Image Sensors.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage: 6 V

Higher supply voltage allows for better performance and faster data processing.

Master Clock: 40 MHz

High master clock frequency enables fast data readout and processing.

Body Width: 29.97 inch

Compact body size makes it suitable for integration into various systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors offer high image quality and sensitivity, making them ideal for imaging applications.

Body Height: 5.39 mm

Low body height enables thin and compact camera designs.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy integration into camera modules.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 40 °C

Wide operating temperature range allows for use in various environmental conditions.

Horizontal Pixel: 1920

High horizontal pixel count ensures high-resolution images.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for use in extreme cold environments.

Maximum Operating Current: 15 mA

Low operating current helps in reducing power consumption.

Dynamic Range: 68 dB

High dynamic range enables capturing detailed images with both bright and dark areas accurately.

Vertical Pixel: 1080

High vertical pixel count ensures high-resolution images.

Body Length/Diameter: 33 mm

Small body length allows for compact camera designs.

Optical Format (inch): 2/3

2/3 inch optical format provides a good balance between image quality and size.

Termination Type: SOLDER

Solder termination provides a reliable connection in the camera module.

Frame Rate: 60 fps

High frame rate allows for capturing fast-moving subjects with smooth video output.

Array Type: INTERLINE

Interline array type allows for faster image readout and processing.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides secure and stable installation in camera modules.

Technical Specifications

Image Sensors KAE-02150-ABB-SD-EE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 86 DB

Array Type:

INTERLINE

Body Width:

29.97 inch

Body Height:

5.39 mm

Body Length/Diameter:

33 mm

Dynamic Range:

68 dB

Frame Rate:

60 fps

Horizontal Pixel:

1920

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

15 mA

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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