Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Onsemi MT9M001C12STM image sensor features a pixel size of 5.2x5.2 um, operates at a max supply voltage of 3.6V, and has a master clock of 48 MHz. This CMOS sensor is commonly used in applications requiring high-quality digital imaging with an optical format of 1/2 inch and a frame rate of 30 fps.
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High resolution due to small pixel size.
Compatible with a wide range of power sources.
Ensures fast data processing and image capture.
Provides a compact and space-saving design.
Offers high-quality image capture capabilities.
Slim profile for easy integration into devices.
Easy to mount and secure in place.
Operates efficiently without excessive power consumption.
Can withstand high temperature environments.
Provides a wide range of output voltage options.
Easy compatibility with digital systems.
Functions reliably even in low temperature conditions.
Ensures reliable and long-lasting connections.
Efficient operation without overheating.
Durable and resistant to environmental factors.
Captures a wide range of light intensities accurately.
Uniform size for standardized device integration.
Compatible with various optical systems.
Secure and reliable connections for long-term use.
Easy connectivity for data transfer.
Smooth and high-quality image and video capture.
Efficient data transfer and processing.
Image Sensors MT9M001C12STM attributes and parameters. Explore more Image Sensors devices from Onsemi
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Housing:
JESD-609 Code:
Master Clock:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Terminal Finish:
Termination Type:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
2N2222A
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
Silicon Standard
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
1N4148
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Meritek Electronics
KAF-8300-CXB-CB-AA
The Onsemi KAF-8300-CXB-CB-AA image sensor features 5.4x5.4 um pixel size, 3448 horizontal pixels, and 2574 vertical pixels. With a max supply voltage of 15.5 V, it is ideal for high-resolution imaging applications in industries such as astronomy and microscopy.
AR0239ATSC00XUEA0-DPBR
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
KAE-04471-ABA-JP-EE
KAE-04471-ABA-JP-EE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal pixels, and 2096 vertical pixels. It operates b/w -30 to 40 °C with a dynamic range of 72 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings at a max supply voltage of 15.3 V and min supply voltage of 14.7 V.
KAI-2020-ABA-CD-AE
KAI-2020-ABA-CD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It has a dynamic range of 60 dB and outputs analog voltage data at a rate of 40 Mbps. This rectangular CCD sensor is suitable for applications requiring high-quality imaging in industrial or scientific settings.
AR0237CSSC00PRA0-DR
Onsemi's AR0237CSSC00PRA0-DR is a 1/2.7 inch CMOS image sensor with 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. It operates at -30 to 85 °C, with a max supply voltage of 1.95V and output range of 0.4-1.5V. Ideal for applications requiring high-quality digital imaging at up to 60 fps frame rate.
KAI-16000-AAA-JR-B1
KAI-16000-AAA-JR-B1 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It has a dynamic range of 65 dB and outputs analog voltage. Ideal for applications requiring high-resolution imaging with precise color reproduction.
TCD1304DG(8Z,AW)
Toshiba
Toshiba's TCD1304DG(8Z,AW) is an 8X200 um CCD image sensor with a 2 MHz master clock. Operating at 3-5.5V, it offers a spectral response of 400-1200nm and sensitivity of 160 V/lx.s. Ideal for applications requiring high-resolution imaging in industrial automation and scientific instruments.
AS0142ATSC00XUSM0-DRBR-E
Onsemi's AS0142ATSC00XUSM0-DRBR-E is a 3x3 um CMOS image sensor with 1280H x 800V pixels. It operates at a max supply voltage of 1.89V, has a master clock of 27 MHz, and offers a dynamic range of 93 dB. Ideal for applications requiring high-resolution imaging in compact devices.
KAI-04070-ABA-JD-BA
Onsemi's KAI-04070-ABA-JD-BA image sensor features 7.4x7.4 um pixel size, 2048x2048 resolution, and 82 dB dynamic range. Ideal for applications requiring high-quality imaging in industrial cameras, surveillance systems, and scientific instruments.
AR0234CSSC00SUKA0-CP1
The Onsemi AR0234CSSC00SUKA0-CP1 image sensor features 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It is ideal for applications requiring high-quality digital imaging such as surveillance cameras, automotive vision systems, and drones due to its compact rectangular package and 120 fps frame rate.
KAI-16070-FXA-JD-B2
KAI-16070-FXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 70.5 dB dynamic range. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments due to its 4864x3232 pixel resolution and INTERLINE array type.
TC241-80
Texas Instruments
TC241-80 by Texas Instruments is an image sensor with 754x244 pixels, pixel size of 11.5x27 um, and operates at temperatures from -10 to 45 °C. It requires a power supply of 12V and features THROUGH HOLE MOUNT for easy installation. Ideal for applications requiring high-resolution imaging in various environments.
MT9M025IX3STM
MT9M025IX3STM by Onsemi is an image sensor with 3.75um pixel size, 50MHz master clock, and 1/3 inch optical format. It is ideal for applications requiring a digital voltage output interface, offering a high dynamic range of 115dB and sensitivity of 5.48V/lx.s at a frame rate of 45fps.
AR0234CSSC00SUKA0-CR
Onsemi's AR0234CSSC00SUKA0-CR image sensor features 1920x1200 resolution, 3x3 um pixel size, and 54 MHz master clock. Ideal for high-speed imaging applications with a frame rate of 120 fps, this CMOS sensor offers a dynamic range of 71.4 dB and operates b/w -40 to 85 °C.
TC241-10
TC241-10 by Texas Instruments is an image sensor with 754x244 pixels, pixel size of 11.5X27 um, and operates at temperatures from -10 to 45 °C. It requires a power supply of 12V and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in various environments.
MT9M021IA3XTM-DRBR1
MT9M021IA3XTM-DRBR1 by Onsemi is an image sensor with 3.75um pixel size, 50 MHz master clock, and 1280x960 resolution. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high sensitivity (5.3 V/lx.s), 60 fps frame rate, and compact square package design.
MT9M001C12STM-TR
The Onsemi MT9M001C12STM-TR is a CMOS image sensor with 5.2x5.2 um pixel size, 1280x1024 resolution, and 48 MHz master clock. It is used in applications requiring digital voltage output, such as frame arrays for imaging systems.
KLI-4104-DAA-CB-AA
KLI-4104-DAA-CB-AA by Onsemi is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0-70 °C, has a dynamic range of 60 dB, and outputs analog voltage in the range of 1.50-1.70V. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging devices.
MT9V022IA7ATM
MT9V022IA7ATM by Onsemi features 6x6 um pixel size, 26.6 MHz master clock, and 752 horizontal pixels. Ideal for image sensing applications with a frame rate of 60 fps and an optical format of 1/3 inch.
KAI-4011M
The Onsemi KAI-4011M is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V and outputs analog voltage signals. Ideal for applications requiring high-resolution imaging with precise color reproduction and low noise levels.
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MT9M001C12STM
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.40V; Optical Format (inch): 1/2;
Aptina
IMAGE SENSOR,CMOS; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.40V; Termination Type: SOLDER; Frame Rate: 30 fps;
MT9M001C12STM-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Maximum Operating Temperature: 70 Cel;
MT9M001C12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Body Width: 14.22 inch; Array Type: FRAME;
MT9M001C12STM-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Array Type: FRAME;
MT9M001C12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Supply Voltage: 3 V; Body Height: 2.21 mm;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Frame Rate: 30 fps; Array Type: FRAME;
MT9M001C12STC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Body Height: 2.25 mm; Master Clock: 48 MHz;
MT9M001C12STC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Frame Rate: 30 fps; Minimum Operating Temperature: 0 Cel;
MT9M021IA3XTM-DPBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -30 Cel; Sensitivity (V/lx.s): 5.3 V/lx.s;
MT9M021IA3XTM-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Current: 55 mA; Master Clock: 50 MHz;
MT9M032C12STMU
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.05V; Minimum Supply Voltage: 1.7 V;
MT9M034I12STC-DPBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-2.50V; Minimum Supply Voltage: 1.7 V;
MT9M034I12STC-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -22-22mA; Additional Features: DUAL OUTPUT;
MT9M114D00STCZK24BC1-200
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Output Range: 0.45-1.35V; Output Interface Type: 2-WIRE INTERFACE; Additional Features: ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT 2.50-3.10 V ANALOG SUPPLY VOLATGE;
MT9M114EBLSTCZ-CR1
MT9M114EBLSTCZ-CR1 by Onsemi is an image sensor with 1296x976 pixels, 1.90um pixel size, and 70.8dB dynamic range. It operates b/w -30 to 70°C and has a digital voltage output interface. Ideal for applications requiring high-quality imaging in compact devices like smartphones and tablets.
MT9M012D00STM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 70 Cel;
MT9M015D00STCC14EC1
IMAGE SENSOR,CMOS; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Horizontal Pixel: 1288; Maximum Operating Current: 30 mA; Array Type: FRAME;
MT9M002I12STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: 0.012-0.014mA; Vertical Pixel: 1096;
Supply Digital Components
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12,000 In-Stock
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