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MT9M001C12STM-TR

Onsemi

MT9M001C12STM-TR by Onsemi

The Onsemi MT9M001C12STM-TR is a CMOS image sensor with 5.2x5.2 um pixel size, 1280x1024 resolution, and 48 MHz master clock. It is used in applications requiring digital voltage output, such as frame arrays for imaging systems.

Median Price

$18.870

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$18.870

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300

$18.870

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Vyrian

USA . 2,430 parts In-Stock

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2,430

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Digiode

USA . 192 parts In-Stock

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192

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Inventory MP

USA . 4 parts In-Stock

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4

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Bristol Electronics

USA . 4 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,816 parts In-Stock

1+ parts

$2.080

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3,816

$2.080

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AZTECH Wire

Italy . 660 parts In-Stock

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$13.555

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660

$13.555

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Corohmni

South Africa . 358 parts In-Stock

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$18.493

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358

$18.493

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$18.870

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$17.927

10k+ parts

$17.549

2,000

$18.870

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$17.927

$17.549

Continental Prestige Electronics

USA . 13 parts In-Stock

1+ parts

$18.870

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$18.493

13

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$18.493

Semicontronic

India . 858 parts In-Stock

1+ parts

$30.750

100+ parts

$29.981

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$29.828

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858

$30.750

$29.981

$29.828

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Ampacity Inc.

Singapore . 788 parts In-Stock

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$53.750

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788

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,053 parts In-Stock

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TANS Electronics

Latvia . 4,421 parts In-Stock

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Problanco Electronics

Mexico . 3,414 parts In-Stock

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SupplyDigital Components

Austria . 2,766 parts In-Stock

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Corphita

USA . 2,468 parts In-Stock

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Argo Parts USA

USA . 1,729 parts In-Stock

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1,729

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UHIMA Technologies

Türkiye . 48 parts In-Stock

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48

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Overview

Capture stunning images with the MT9M001C12STM-TR image sensor by Onsemi, a leading manufacturer known for top-quality products. Ideal for a wide range of applications, this CMOS sensor delivers exceptional performance and reliability. With its high pixel resolution and advanced features, this sensor provides customers with unparalleled value, making it the perfect choice for all your imaging needs. Trust Onsemi to bring innovation and excellence to your projects with the MT9M001C12STM-TR.

Feature Benefit Bullets

Pixel Size (um): 5.2X5.2

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage: 3.6 V

Allows for efficient power usage and compatibility with standard power sources.

Master Clock: 48 MHz

High clock speed enables fast data processing and real-time image capturing.

Body Width: 14.22 inch

Compact size makes it easy to integrate into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology provides high sensitivity and low noise for excellent image quality.

Package Shape or Style: SQUARE

Square package design simplifies mounting and ensures secure placement in devices.

Minimum Supply Voltage: 3 V

Wide voltage range allows for flexibility in power supply options.

Maximum Operating Temperature: 70 °C

High operating temperature range ensures reliability in different environmental conditions.

Horizontal Pixel: 1280

High pixel count for detailed and sharp horizontal image capture.

Output Type: DIGITAL VOLTAGE

Digital output simplifies data transmission and processing for easy integration with digital systems.

Minimum Operating Temperature: 0 °C

Low operating temperature ensures functionality even in cold environments.

Maximum Operating Current: 110 mA

Efficient power consumption with low operating current for extended battery life.

Housing: CERAMIC

Durable ceramic housing provides protection against mechanical and environmental damage.

Dynamic Range: 68.2 dB

Wide dynamic range captures both bright and dark areas in a scene with detail and accuracy.

Vertical Pixel: 1024

High pixel count for detailed and sharp vertical image capture.

Body Length/Diameter: 14.22 mm

Compact size allows for easy integration and space-saving in devices.

Optical Format (inch): 1/2

Standard optical format for compatibility with various lenses and optical systems.

Termination Type: SOLDER

Solder termination for secure and reliable electrical connections.

Output Interface Type: 2-WIRE INTERFACE

Simple 2-wire interface for easy connectivity and communication with other devices.

Frame Rate: 30 fps

High frame rate ensures smooth and fluid video recording and playback.

Array Type: FRAME

Frame array design enables simultaneous capture of multiple image frames for better image quality.

Mounting Feature: SURFACE MOUNT

Surface mount feature for easy and secure mounting on PCBs and electronic devices.

Technical Specifications

Image Sensors MT9M001C12STM-TR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

14.22 inch

Body Height:

2.21 mm

Body Length/Diameter:

14.22 mm

Dynamic Range:

68.2 dB

Frame Rate:

30 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

110 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1/2

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

5.2X5.2

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

1024

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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