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MT9M001C12STM-DP

Onsemi

MT9M001C12STM-DP by Onsemi

MT9M001C12STM-DP by Onsemi is an image sensor with 5.2x5.2 um pixel size, 48 MHz master clock, and 1280x1024 resolution. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 68.2 dB and frame rate of 30 fps.

Median Price

$21.472

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 192 parts In-Stock

1+ parts

$17.096

100+ parts

$13.630

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10k+ parts

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192

$17.096

$13.630

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Arrow

USA . 192 parts In-Stock

1+ parts

$25.848

100+ parts

$22.468

1k+ parts

$21.797

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192

$25.848

$22.468

$21.797

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Distributors (In-Stock)

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Digiode

USA . 1,916 parts In-Stock

1+ parts

$16.241

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1,916

$16.241

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$34.366

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10

$34.366

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Vyrian

USA . 3,770 parts In-Stock

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3,770

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Chip Stock

USA . 3,375 parts In-Stock

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3,375

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Flip Electronics

USA . 1,000 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,767 parts In-Stock

1+ parts

$3.300

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4,767

$3.300

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AZTECH Wire

Italy . 487 parts In-Stock

1+ parts

$8.626

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487

$8.626

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Ampacity Inc.

Singapore . 85 parts In-Stock

1+ parts

$14.530

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85

$14.530

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Corphita

USA . 1,077 parts In-Stock

1+ parts

$15.386

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1,077

$15.386

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Corohmni

South Africa . 222 parts In-Stock

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$17.096

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222

$17.096

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Semicontronic

India . 269 parts In-Stock

1+ parts

$31.630

100+ parts

$30.839

1k+ parts

$30.681

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269

$31.630

$30.839

$30.681

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Continental Prestige Electronics

USA . 783 parts In-Stock

1+ parts

$34.366

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$33.679

783

$34.366

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$33.679

Lixinc

USA . 13,571 parts In-Stock

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SupplyDigital Components

Austria . 7,805 parts In-Stock

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Problanco Electronics

Mexico . 3,950 parts In-Stock

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TANS Electronics

Latvia . 3,794 parts In-Stock

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Kulean Microsystems

USA . 2,980 parts In-Stock

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Perfect Parts

USA . 1,680 parts In-Stock

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1,680

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Futuretech Components

Singapore . 1,500 parts In-Stock

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GreenTree Electronics

Israel . 960 parts In-Stock

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Argo Parts USA

USA . 896 parts In-Stock

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UHIMA Technologies

Türkiye . 838 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$33.679

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$32.648

10k+ parts

$31.961

100

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$33.679

$32.648

$31.961

Overview

Capture stunning images with the Onsemi MT9M001C12STM-DP image sensor. Renowned for their high-quality products, Onsemi delivers top-notch performance and reliability. Ideal for a range of applications, this image sensor offers exceptional value and benefits to customers looking for crisp, clear images. Whether you're in the automotive industry, security sector, or consumer electronics field, the MT9M001C12STM-DP is sure to exceed your expectations with its advanced features and cutting-edge technology. Elevate your imaging capabilities with Onsemi's superior image sensor today.

Feature Benefit Bullets

Pixel Size (um): 5.2X5.2

Smaller pixel size allows for higher resolution images to be captured, making it ideal for applications requiring detailed imaging.

Maximum Supply Voltage: 3.6 V

Higher supply voltage ensures stable operation of the image sensor, preventing any potential damage from voltage fluctuations.

Master Clock: 48 MHz

High master clock frequency enables fast data processing and capture speed, resulting in real-time image output.

Body Width: 14.22 inch

Narrow body width allows for compact and slim designs when integrating the image sensor into devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high-quality image output, making them a popular choice in various applications.

Body Height: 2.21 mm

Low body height enables thin profile designs of devices incorporating the image sensor, especially in applications where space is limited.

Package Shape or Style: SQUARE

Square package shape allows for easy integration and alignment of the image sensor, ensuring efficient assembly in devices.

Minimum Supply Voltage: 3 V

Lower minimum supply voltage reduces power consumption and extends battery life in battery-powered devices utilizing the image sensor.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures the image sensor can function reliably in various environmental conditions without overheating.

Horizontal Pixel: 1280

Higher horizontal pixel count enables wider image capture, allowing for more detailed and comprehensive imaging.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies the integration of the image sensor with digital systems, enabling easy data processing and transmission.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the image sensor can function effectively in cold environments without performance degradation.

Maximum Operating Current: 110 mA

Low operating current consumption minimizes power usage, making the image sensor energy-efficient and suitable for battery-powered devices.

Housing: CERAMIC

Ceramic housing provides durability, thermal stability, and protection to the image sensor, ensuring long-term reliability and performance.

Dynamic Range: 68.2 dB

High dynamic range allows the image sensor to capture a wide range of light intensities without losing detail, resulting in high-quality images with accurate color representation.

Vertical Pixel: 1024

Higher vertical pixel count enables taller image capture, allowing for detailed imaging of objects in vertical orientation.

Body Length/Diameter: 14.22 mm

Compact body length/diameter facilitates easy integration of the image sensor into devices with limited space, ensuring efficient use of available space.

Optical Format (inch): 1/2

Optical format of 1/2 is suitable for capturing high-resolution images with good light sensitivity, making it ideal for various imaging applications.

Termination Type: SOLDER

Solder termination simplifies the assembly process of the image sensor onto circuit boards, ensuring a secure and reliable connection for data transmission.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connection of the image sensor to external devices, enabling easy data transfer and communication for seamless integration.

Frame Rate: 30 fps

High frame rate of 30 fps allows for smooth and fluid video capture, making the image sensor suitable for real-time imaging applications.

Array Type: FRAME

Frame array type enables the image sensor to capture images in a grid pattern, ensuring comprehensive coverage and detailed imaging of the scene.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure attachment of the image sensor to circuit boards, ensuring reliable operation and performance stability.

Technical Specifications

Image Sensors MT9M001C12STM-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

14.22 inch

Body Height:

2.21 mm

Body Length/Diameter:

14.22 mm

Dynamic Range:

68.2 dB

Frame Rate:

30 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

110 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1/2

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

5.2X5.2

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

1024

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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