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MT9V022IA7ATM-DP

Onsemi

MT9V022IA7ATM-DP by Onsemi

MT9V022IA7ATM-DP by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a max supply voltage of 3.6V and operating temperature range from -40 to 85°C. With a frame rate of 60 fps, this sensor is ideal for digital current output applications requiring high dynamic range and precise imaging capabilities.

Median Price

$19.654

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 45,720 parts In-Stock

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-

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$17.470

1k+ parts

$15.630

10k+ parts

$14.710

45,720

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$17.470

$15.630

$14.710

Verical

USA . 44,185 parts In-Stock

1+ parts

-

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$21.837

1k+ parts

$19.538

10k+ parts

$18.387

44,185

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$21.837

$19.538

$18.387

Distributors (In-Stock)

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Digiode

USA . 340 parts In-Stock

1+ parts

$18.478

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340

$18.478

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Nova Conductors

Japan . 100 parts In-Stock

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$19.329

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100

$19.329

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Component Sense

UK . 75,905 parts In-Stock

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Vyrian

USA . 7,089 parts In-Stock

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Chip Stock

USA . 4,100 parts In-Stock

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Flip Electronics

USA . 2,000 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 273 parts In-Stock

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$13.890

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273

$13.890

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Semicontronic

India . 33,655 parts In-Stock

1+ parts

$16.530

100+ parts

$16.117

1k+ parts

$16.034

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33,655

$16.530

$16.117

$16.034

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Ampacity Inc.

Singapore . 33,625 parts In-Stock

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$16.530

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$16.530

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Corphita

USA . 1,162 parts In-Stock

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$17.505

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Corohmni

South Africa . 130 parts In-Stock

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$18.942

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$18.942

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Continental Prestige Electronics

USA . 2,283 parts In-Stock

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$19.329

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$18.942

2,283

$19.329

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$18.942

Netroflash

USA . 2,000 parts In-Stock

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$19.329

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$18.363

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$17.976

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$19.329

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$18.363

$17.976

Kulean Microsystems

USA . 7,428 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Problanco Electronics

Mexico . 6,931 parts In-Stock

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SupplyDigital Components

Austria . 5,756 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 2,255 parts In-Stock

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GreenTree Electronics

Israel . 1,820 parts In-Stock

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Perfect Parts

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Argo Parts USA

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S.R.D Solutions

India . 750 parts In-Stock

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UHIMA Technologies

Türkiye . 719 parts In-Stock

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Futuretech Components

Singapore . 260 parts In-Stock

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Overview

Unleash the power of cutting-edge imaging technology with the MT9V022IA7ATM-DP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that are revolutionizing the way we capture and process visual data. From surveillance systems to medical imaging devices, the applications for this product are endless. Experience unrivaled performance, reliability, and versatility with the MT9V022IA7ATM-DP, providing customers with unparalleled value and benefits that will take their projects to the next level. Join the future of imaging technology today with Onsemi.

Feature Benefit Bullets

Pixel Size (um): 6X6

Smaller pixel size allows for higher resolution images to be captured.

Maximum Supply Voltage: 3.6 V

Low maximum supply voltage can help in reducing power consumption.

Master Clock: 26.6 MHz

High master clock frequency enables fast data readout and processing.

Body Width: 9 inch

Compact body width makes it suitable for space-constrained applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high-quality image output.

Body Height: 1.3 mm

Low body height allows for easy integration into slim devices.

Package Shape or Style: SQUARE

Square package shape provides efficient use of space and easy mounting.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the sensor suitable for use in harsh environments.

Horizontal Pixel: 752

High horizontal pixel count allows for detailed and wide-angle images.

Output Range: -9-9mA

Wide output range provides flexibility in signal processing and interpretation.

Output Type: DIGITAL CURRENT

Digital current output simplifies signal processing and reduces noise interference.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish ensures reliable electrical connections.

Maximum Operating Current: 60 mA

Moderate operating current allows for efficient power usage.

Dynamic Range: 54.4 dB

Wide dynamic range enables the sensor to capture both bright and dark details in a scene.

Vertical Pixel: 480

Vertical pixel count helps in capturing detailed images in the vertical direction.

Body Length/Diameter: 9 mm

Compact body length/diameter makes the sensor easy to handle and install.

Optical Format (inch): 1/3

1/3 inch optical format is a common standard for image sensors, ensuring compatibility with various systems.

Termination Type: SOLDER

Solder termination provides secure and reliable connections.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies communication with external devices.

Frame Rate: 60 fps

High frame rate allows for smooth video recording and capturing of fast-moving subjects.

Array Type: FRAME

Frame array type enables simultaneous capture of multiple pixels for higher image quality.

Mounting Feature: SURFACE MOUNT

Surface mounting feature simplifies installation and ensures secure placement.

Technical Specifications

Image Sensors MT9V022IA7ATM-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 3-3.60 V, IT ALSO HAVE DYNAMIC RANGE 80DB-100DB IN HIDY MODE

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.3 mm

Body Length/Diameter:

9 mm

Dynamic Range:

54.4 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

JESD-609 Code:

e1

Master Clock:

26.6 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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