Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NOIV1SE1300A-QDC by Onsemi features 4.80x4.80 um pixel size, 62 MHz master clock, and 1280 horizontal pixels. Ideal for image sensing applications with a dynamic range of 53 dB and frame rate of 150 fps.
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The small pixel size of 4.80X4.80 um allows for higher resolution and image quality.
Operates within a safe voltage range of up to 2 V, ensuring reliable performance.
High master clock frequency of 62 MHz enables fast data readout and processing.
Compact body width of 14.22 inch for easy integration into various devices.
Efficient power usage with a low voltage requirement of 3.3 V.
Utilizes CMOS technology for improved sensitivity and signal processing.
Low profile body height of 2.2 mm for slim device designs.
Square package shape for simple and secure mounting.
Can operate at a low minimum voltage of 1.6 V, conserving power.
Wide operating temperature range of -40 to 85°C for versatility in various environments.
High-resolution horizontal pixel array of 1280 for detailed image capture.
Capable of functioning even in extremely low temperatures of -40°C.
Operates within an efficient current limit of 75 mA for power-saving operation.
Wide dynamic range of 53 dB for capturing both bright and dark areas accurately.
Large vertical pixel array of 1024 for capturing detailed images in the vertical plane.
Compact body length/diameter of 14.22 mm for space-saving integration.
Utilizes a 1/2 inch optical format for compatibility with various lenses and optical systems.
Solder termination type for secure and reliable connections.
4-Wire interface for fast and efficient data transfer.
High frame rate of 150 fps for smooth and high-speed image capture.
Utilizes a frame array for efficient image processing and data handling.
Surface mountable design for easy installation and integration.
Image Sensors NOIV1SE1300A-QDC attributes and parameters. Explore more Image Sensors devices from Onsemi
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PCN Obsolescence/ EOL - Mult Dev EOL 16/Jul/2019
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
Bkc Semiconductors
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
Infinex
Loras Industries
STM32H743XIH6
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
Taitron Components
Fairchild Semiconductor
Lite-on Semiconductor
MT9M001C12STM
Onsemi
The Onsemi MT9M001C12STM image sensor features a pixel size of 5.2x5.2 um, operates at a max supply voltage of 3.6V, and has a master clock of 48 MHz. This CMOS sensor is commonly used in applications requiring high-quality digital imaging with an optical format of 1/2 inch and a frame rate of 30 fps.
TCD1304DG(8Z,AW)
Toshiba
Toshiba's TCD1304DG(8Z,AW) is an 8X200 um CCD image sensor with a 2 MHz master clock. Operating at 3-5.5V, it offers a spectral response of 400-1200nm and sensitivity of 160 V/lx.s. Ideal for applications requiring high-resolution imaging in industrial automation and scientific instruments.
KAI-2001-ABA-CP-BA
KAI-2001-ABA-CP-BA by Onsemi is an Image Sensor with 7.4X7.4 um pixel size, 1600H x 1200V resolution, and 60 dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V, outputs analog voltage at a rate of 40 Mbps, and is suitable for applications requiring high-quality image capture in various industries.
KAI-08051-QXA-JD-BA
KAI-08051-QXA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in various industries.
AR0234CSSC28SUKA0-CR
AR0234CSSC28SUKA0-CR by Onsemi is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive, surveillance, and industrial systems.
KAI-08051-AAA-JP-AE
Onsemi's KAI-08051-AAA-JP-AE is a 5.5x5.5 um pixel size CCD image sensor with 3364H x 2520V resolution, offering a dynamic range of 66 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and is ideal for industrial imaging applications due to its high-quality image capture capabilities.
MT9M114D00STCZK24BC1-200
Onsemi's MT9M114D00STCZK24BC1-200 is a CMOS image sensor with 1.90x1.90 um pixel size, 54 MHz master clock, and 70.8 dB dynamic range. Ideal for applications requiring a digital voltage output interface, such as frame arrays in surveillance cameras or industrial imaging systems at temperatures ranging from -30 to 70°C.
MT9P031I12STM
Aptina
The Aptina MT9P031I12STM image sensor features 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-quality imaging such as surveillance cameras, industrial inspection systems, and medical devices.
MT9V023
The Onsemi MT9V023 is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 752 (H) x 480 (V) resolution and a dynamic range of 120 dB. Operating at up to 60 fps with a master clock of 26 MHz, it is ideal for applications requiring high-quality imaging in varying lighting conditions.
MT9M021IA3XTM-DPBR
MT9M021IA3XTM-DPBR by Onsemi is a 1/3-inch CMOS image sensor with 1280x960 pixels. It operates at 50 MHz master clock, offers 64 dB dynamic range, and has a frame rate of 45 fps. Ideal for digital voltage output applications in surveillance cameras, drones, and industrial imaging systems.
NOIV1SN2000A-QDC
NOIV1SN2000A-QDC by Onsemi features 4.80X4.80 um pixel size, 62 MHz master clock, and 1920 horizontal pixels. This image sensor is ideal for applications requiring high-resolution imaging with a max supply voltage of 2V and operating temperature range of 0-70°C.
KAF-3200-ABA-CD-B2
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Minimum Operating Temperature: -60 Cel; Horizontal Pixel: 2184;
NOIP1SN0480A-STI
NOIP1SN0480A-STI by Onsemi features 4.80X4.80 um pixel size, 68 MHz master clock, and 808 (H) x 608 (V) resolution. This image sensor is ideal for applications requiring high-speed imaging with a frame rate of up to 120 fps in a compact surface-mount package.
AR0431CSSC14SMRA0-DP
Onsemi's AR0431CSSC14SMRA0-DP is a 10.16mm x 10.16mm CMOS image sensor with 2312x1746 resolution, offering high-quality imaging for applications like surveillance cameras and automotive vision systems at a frame rate of 120 fps.
KAI-0330-ABA-CB-BA-SINGLE
Image Sensors;
AR0330CM1C21SHKA0-CR
The Onsemi AR0330CM1C21SHKA0-CR image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2304 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras, automotive vision systems, and industrial imaging solutions.
KAI-29050-FXA-JD-AE
KAI-29050-FXA-JD-AE by Onsemi is an image sensor with 5.5X5.5 um pixel size, 6644 horizontal pixels, and 4452 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings at frame rates up to 4 fps.
KAI-0340-AAA-CP-AA
KAI-0340-AAA-CP-AA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640 horizontal pixels, and 480 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 62 dB. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
KAF-18500-NXA-JH-AA-08
The Onsemi KAF-18500-NXA-JH-AA-08 is a CCD image sensor with 6.8X6.8 um pixel size, offering a dynamic range of 68.1 dB and 5270 horizontal pixels for high-quality imaging applications. With a max supply voltage of 15.5 V and operating temperature range from 0 to 60 °C, it is suitable for industrial cameras and scientific imaging systems requiring precise data capture at up to 24 Mbps data rate.
AR0331SRSC00XUEE0-DRBR
Onsemi's AR0331SRSC00XUEE0-DRBR is a 2.2x2.2 um CMOS image sensor with 2048H x 1536V pixels, offering a dynamic range of 100 dB and operating at temperatures from -30 to 85 °C. It has a digital voltage output interface, operates at 48 MHz master clock, and is commonly used in applications requiring high-resolution imaging such as surveillance cameras and industrial machine vision systems.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NOIV1SN025KA-GDC
NOIV1SN025KA-GDC by Onsemi is a CMOS image sensor with 4.50x4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. It is used in applications requiring high-resolution imaging at 53 fps, such as surveillance cameras and industrial machine vision systems.
NOIV1SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 75 mA; Dynamic Range: 53 dB;
NOIV2SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Height: 2.2 mm; Array Type: FRAME; Body Length/Diameter: 14.22 mm;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC; Optical Format (inch): 2/3;
NOIV1SN025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Spectral Response (nm): 400-1000; Body Length/Diameter: 43.1 mm;
NOIV1SE2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Array Type: FRAME; Maximum Operating Temperature: 70 Cel; Output Interface Type: 4-WIRE INTERFACE;
NOIV1SN1300A-XXC
IMAGE SENSOR,CMOS; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Dynamic Range: 53 dB; Additional Features: GLOBAL SHUTTER, ROLLING SHUTTER; Body Length/Diameter: 10.617 mm;
NOIV1SE5000A-QDC
NOIV1SE5000A-QDC by Onsemi is an image sensor with 4.80x4.80 um pixel size, 62 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring high-resolution imaging at a max supply voltage of 2V and operating temperature up to 70°C.
NOIV1SE012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Vertical Pixel: 3072;
NOIV1SE025KA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1000; Minimum Operating Temperature: -40 Cel; Array Type: FRAME;
NOIV1SN012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC;
NOIV1SN025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: FRAME; Maximum Operating Temperature: 85 Cel; Housing: CERAMIC;
NOIV1SN012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 340 MHz; Maximum Supply Voltage: 2 V;
NOIV1SE016KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Output Interface Type: 4-WIRE INTERFACE; Vertical Pixel: 4096;
NOIV1SE025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Array Type: FRAME; Maximum Supply Voltage: 2 V;
NOIV1SN016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Spectral Response (nm): 400-1000;
NOIV1SE012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Master Clock: 340 MHz;
NOIV1SE016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 915 mA; Body Length/Diameter: 43.1 mm;
NOIV1SE025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 2 V; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 775 mA;
Supply Digital Components
$106.00
$54.25
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$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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