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KLI-2113-DAA-ED-AA

Onsemi

KLI-2113-DAA-ED-AA by Onsemi

KLI-2113-DAA-ED-AA by Onsemi is an Image Sensor with 14x14 um pixel size, 2098 horizontal and vertical pixels. It operates b/w -25 to 80 °C, has a dynamic range of 76 dB, and outputs analog voltage. This sensor is ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,774 parts In-Stock

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Vyrian

USA . 852 parts In-Stock

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TANS Electronics

Latvia . 8,267 parts In-Stock

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Kulean Microsystems

USA . 7,449 parts In-Stock

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SupplyDigital Components

Austria . 3,067 parts In-Stock

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Corphita

USA . 2,034 parts In-Stock

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Problanco Electronics

Mexico . 1,190 parts In-Stock

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Corohmni

South Africa . 285 parts In-Stock

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UHIMA Technologies

Türkiye . 223 parts In-Stock

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Overview

Elevate your imaging experience with the KLI-2113-DAA-ED-AA by Onsemi, a top-quality image sensor designed to exceed your expectations. Manufactured by Onsemi, known for their innovative technology and reliable products, this image sensor is perfect for a wide range of applications. With its superior performance, high resolution, and exceptional dynamic range, the KLI-2113-DAA-ED-AA provides unmatched value and benefits to customers looking for top-tier image sensors. Upgrade your imaging capabilities today and see the difference with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Pixel Size (um): 14X14

The small pixel size allows for high resolution images to be captured, making this image sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage: 12.5 V

The high maximum supply voltage provides flexibility in powering the sensor and ensures stable performance in varying voltage conditions.

Body Width: 14.66 inch

The compact body width makes this sensor suitable for integration into space-constrained electronic devices or systems.

Power Supplies (V): 12

The standard power supply voltage of 12V simplifies integration and ensures compatibility with commonly used power sources.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Being a CCD image sensor, it offers high-quality imaging with low noise, making it ideal for applications where image clarity is paramount.

Body Height: 4.24 mm

The low profile body height allows for easy integration into slim devices without adding bulk.

Package Shape or Style: RECTANGULAR

The rectangular package shape simplifies the design and mounting process, making it easier to incorporate the sensor into various systems.

Minimum Supply Voltage: 11.5 V

The low minimum supply voltage ensures efficient power usage and helps to extend the battery life of devices utilizing this sensor.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature range allows for reliable performance in a wide range of environmental conditions.

Horizontal Pixel: 2098

The high horizontal pixel count enables the sensor to capture detailed images with high resolution and clarity.

Output Type: ANALOG VOLTAGE

The analog voltage output simplifies the interface with other electronic components, providing ease of integration into existing systems.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures that the sensor can function effectively even in cold environments without performance degradation.

Housing: CERAMIC

The ceramic housing offers durability and protection to the sensor, making it suitable for demanding industrial or outdoor applications.

Dynamic Range: 76 dB

The high dynamic range allows the sensor to capture a wide range of light intensities accurately, resulting in high-quality images with good contrast.

Vertical Pixel: 2098

The high vertical pixel count complements the horizontal pixel count in capturing detailed images, providing a well-rounded imaging capability.

Body Length/Diameter: 48 mm

The moderate body length/diameter offers a balance between compactness and performance, making this sensor suitable for a variety of applications.

Data Rate: 20 Mbps

The high data rate allows for fast and continuous image capture, making this sensor suitable for real-time imaging applications.

Termination Type: SOLDER

The solder termination type simplifies the installation process and ensures secure electrical connections for reliable performance.

Array Type: LINEAR

The linear array type provides a straightforward imaging setup, making it easy to capture images with consistent quality across the frame.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature offers stability and secure mounting options, ensuring the sensor stays in place during operation.

Technical Specifications

Image Sensors KLI-2113-DAA-ED-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 11.5 UV/ELECTRON

Array Type:

LINEAR

Body Width:

14.66 inch

Body Height:

4.24 mm

Body Length/Diameter:

48 mm

Data Rate:

20 Mbps

Dynamic Range:

76 dB

Horizontal Pixel:

2098

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

14X14

Power Supplies (V):

12

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

12.5 V

Minimum Supply Voltage:

11.5 V

Termination Type:

SOLDER

Vertical Pixel:

2098

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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