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TC237

Texas Instruments

TC237 by Texas Instruments

TC237 by Texas Instruments is an image sensor with 7.4x7.4 um pixel size, ideal for applications requiring high sensitivity and a dynamic range of 58 dB. With a max supply voltage of 23V and operating temperature range from -10 to 45 °C, it offers 680 horizontal pixels and 500 vertical pixels for detailed imaging tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,709 parts In-Stock

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2,709

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Digiode

USA . 1,100 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 738 parts In-Stock

1+ parts

$2.252

100+ parts

-

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$2.754

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738

$2.252

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$2.754

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DigiPath Technology Company

USA . 2,226 parts In-Stock

1+ parts

$2.479

100+ parts

$2.281

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$2.479

$2.281

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ChromeModa Solutions

Germany . 5,288 parts In-Stock

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$2.530

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$2.075

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$2.530

$2.075

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IDEA Electronic Components Group

UK . 450 parts In-Stock

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$2.530

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$2.277

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450

$2.530

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$2.277

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AZTECH Wire

Italy . 554 parts In-Stock

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$5.237

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554

$5.237

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One Stop Electronics

USA . 1,160 parts In-Stock

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$17.750

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$17.750

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Ampacity Inc.

Singapore . 655 parts In-Stock

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$38.750

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$38.750

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Semicontronic

India . 1,105 parts In-Stock

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$47.750

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$46.556

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$46.318

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$47.750

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$46.318

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Corphita

USA . 2,948 parts In-Stock

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Corohmni

South Africa . 453 parts In-Stock

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Overview

Capture stunning images with the TC237 by Texas Instruments, a top-of-the-line image sensor that offers unparalleled quality and performance. Manufactured by the industry leader, Texas Instruments, this sensor is designed for a wide range of applications. From high-resolution photography to advanced security systems, the TC237 delivers exceptional value and benefits to customers. Experience the advantages of this cutting-edge technology and elevate your imaging capabilities with the TC237.

Feature Benefit Bullets

Pixel Size (um) 7.4X7.4

The small pixel size allows for higher resolution image capture, making this image sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage 23 V

The high maximum supply voltage provides flexibility in power requirements and allows for usage in systems with varying power supply voltages.

Body Width 11 inch

The compact body width of 11 inches makes this image sensor easy to integrate into different devices and systems without taking up too much space.

Power Supplies (V) 22

The power supply voltage of 22V meets the standard requirements for a wide range of applications, ensuring compatibility and ease of integration.

Sensors or Transducers Type IMAGE SENSOR, CCD

Being a CCD image sensor, this device provides high-quality image capture with low noise, making it ideal for applications where image clarity is crucial.

Body Height 3.7 mm

The low body height of 3.7 mm allows for compact design integration, making this image sensor suitable for small form factor devices.

Package Shape or Style RECTANGULAR

The rectangular package shape simplifies mounting and integration processes, ensuring ease of use and compatibility with standard mounting methods.

Minimum Supply Voltage 21 V

With a low minimum supply voltage of 21V, this image sensor offers energy efficiency and can operate effectively even in systems with limited power availability.

Maximum Operating Temperature 45 °C

The high maximum operating temperature of 45°C ensures reliable performance in a wide range of environmental conditions, making it suitable for various applications.

Horizontal Pixel 680

The high horizontal pixel count of 680 contributes to improved image quality and resolution, making this image sensor ideal for capturing detailed images.

Output Type ANALOG VOLTAGE

The analog voltage output type simplifies interface compatibility and signal processing, making it easy to integrate this image sensor into existing systems.

Minimum Operating Temperature -10 °C

With a low minimum operating temperature of -10°C, this image sensor can withstand cold environments and operate effectively in challenging conditions.

Maximum Operating Current 10 mA

The low maximum operating current of 10 mA indicates energy efficiency and ensures that the image sensor can operate without drawing excessive power.

Housing CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired housing provides durability and protection for the image sensor, making it suitable for use in rugged environments.

Dynamic Range 58 dB

The high dynamic range of 58 dB allows the image sensor to capture a wide range of light intensities accurately, making it suitable for applications with varying lighting conditions.

Vertical Pixel 500

The vertical pixel count of 500 contributes to the overall image quality and resolution, ensuring clear and detailed image capture.

Body Length/Diameter 12.2 mm

The compact body length/diameter of 12.2 mm facilitates easy integration and placement of the image sensor within devices, optimizing space usage.

Optical Format (inch) 1/3

The 1/3 inch optical format provides a balance between sensor size and image quality, making this image sensor suitable for a wide range of imaging applications.

Termination Type SOLDER

The solder termination type simplifies the installation and connection process, ensuring secure and reliable connections for seamless integration.

Array Type FRAME TRANSFER

The frame transfer array type offers fast image capture and transfer capabilities, making this image sensor suitable for applications that require rapid image processing.

Sensitivity (V/lx.s) 0.03 V/lx.s

The high sensitivity of 0.03 V/lx.s enables the image sensor to capture clear images even in low light conditions, making it suitable for low-light imaging applications.

Mounting Feature THROUGH HOLE MOUNT

The through hole mounting feature simplifies installation and ensures secure placement of the image sensor, making it suitable for applications requiring stable mounting.

Technical Specifications

Image Sensors TC237 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Array Type:

FRAME TRANSFER

Body Width:

11 inch

Body Height:

3.7 mm

Body Length/Diameter:

12.2 mm

Dynamic Range:

58 dB

Horizontal Pixel:

680

Housing:

CERAMIC, METAL-SEALED COFIRED

Mounting Feature:

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

45 Cel

Minimum Operating Temperature:

-10 Cel

Optical Format (inch):

1/3

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Power Supplies (V):

22

Sensitivity (V/lx.s):

.03 V/lx.s

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

23 V

Minimum Supply Voltage:

21 V

Termination Type:

SOLDER

Vertical Pixel:

500

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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