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KAI-2020-ABA-CD-BA

Onsemi

KAI-2020-ABA-CD-BA by Onsemi

The Onsemi KAI-2020-ABA-CD-BA is a 7.4x7.4 um CCD image sensor with 1600H x 1200V pixels, offering a dynamic range of 60 dB. It operates at supply voltages b/w 14.5V to 15.5V and has an output type of analog voltage, making it suitable for high-resolution imaging applications in industrial and scientific fields.

Median Price

$4,486.980

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 108 parts In-Stock

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$4,486.980

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$3,167.280

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Verical

USA . 108 parts In-Stock

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$4,486.980

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108

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Digiode

USA . 2,261 parts In-Stock

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$4,262.631

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Cyclops Electronics Ltd

UK . 88,528 parts In-Stock

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Vyrian

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Corphita

USA . 265 parts In-Stock

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$4,038.282

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Corohmni

South Africa . 374 parts In-Stock

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Problanco Electronics

Mexico . 7,337 parts In-Stock

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TANS Electronics

Latvia . 6,784 parts In-Stock

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SupplyDigital Components

Austria . 6,120 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 302 parts In-Stock

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Overview

Capture the essence of every moment with the KAI-2020-ABA-CD-BA by Onsemi, a top-tier image sensor that delivers unparalleled quality and precision. Manufactured by industry leader Onsemi, this device is designed to enhance a wide range of applications, from surveillance cameras to medical imaging equipment. With its impressive dynamic range and high pixel resolution, the KAI-2020-ABA-CD-BA ensures crisp, detailed images every time. Elevate your projects with this advanced technology and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Higher pixel size allows for better light sensitivity and improved image quality.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for greater flexibility in power requirements.

Body Width: 20.32 inch

Compact body width makes it suitable for applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality imaging capabilities, making this product a good choice for applications requiring superior image quality.

Body Height: 4.44 mm

Low body height allows for easy integration into compact devices.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides ease of mounting and integration into various devices.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in reducing power consumption.

Horizontal Pixel: 1600

High horizontal pixel count allows for detailed image capture.

Output Type: ANALOG VOLTAGE

Analog voltage output provides compatibility with a wide range of systems.

Dynamic Range: 60 dB

High dynamic range enables the sensor to capture a wide range of light intensities.

Vertical Pixel: 1200

Vertical pixel count contributes to the overall resolution and clarity of images.

Body Length/Diameter: 33.02 mm

Moderate body length/diameter allows for easy handling and installation.

Data Rate: 40 Mbps

High data rate ensures fast and efficient transfer of image data.

Termination Type: SOLDER

Solder termination provides reliable electrical connections.

Array Type: INTERLINE

Interline array type offers high-speed image capture suitable for various applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature simplifies the installation process in many devices.

Technical Specifications

Image Sensors KAI-2020-ABA-CD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 30 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Height:

4.44 mm

Body Length/Diameter:

33.02 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

1600

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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