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KAI-08051-QBA-JD-BA

Onsemi

KAI-08051-QBA-JD-BA by Onsemi

KAI-08051-QBA-JD-BA by Onsemi is an image sensor with 5.5um pixel size, 3364 horizontal pixels, and 2520 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

$1,038.240

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16 parts In-Stock

1+ parts

$857.640

100+ parts

$806.180

1k+ parts

$754.720

10k+ parts

-

16

$857.640

$806.180

$754.720

-

DigiKey

USA . 16 parts In-Stock

1+ parts

$1,038.240

100+ parts

$1,038.240

1k+ parts

$1,038.240

10k+ parts

$1,038.240

16

$1,038.240

$1,038.240

$1,038.240

$1,038.240

Verical

USA . 16 parts In-Stock

1+ parts

$1,072.050

100+ parts

$1,007.725

1k+ parts

$943.400

10k+ parts

-

16

$1,072.050

$1,007.725

$943.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,092 parts In-Stock

1+ parts

$805.030

100+ parts

-

1k+ parts

-

10k+ parts

-

1,092

$805.030

-

-

-

Vyrian

USA . 8,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,523

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,460 parts In-Stock

1+ parts

$762.660

100+ parts

-

1k+ parts

-

10k+ parts

-

1,460

$762.660

-

-

-

Corohmni

South Africa . 192 parts In-Stock

1+ parts

$847.400

100+ parts

-

1k+ parts

-

10k+ parts

-

192

$847.400

-

-

-

Continental Prestige Electronics

USA . 16 parts In-Stock

1+ parts

$847.400

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$847.400

-

-

-

Problanco Electronics

Mexico . 7,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,198

-

-

-

-

SupplyDigital Components

Austria . 3,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,333

-

-

-

-

TANS Electronics

Latvia . 2,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,033

-

-

-

-

Kulean Microsystems

USA . 1,581 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,581

-

-

-

-

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

UHIMA Technologies

Türkiye . 301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

301

-

-

-

-

Overview

Capture breathtaking images with the KAI-08051-QBA-JD-BA image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This sensor is perfect for applications such as professional photography, surveillance systems, and medical imaging. With its high-resolution capabilities and advanced features, this sensor delivers unparalleled performance that will exceed your expectations. Upgrade your imaging experience with the KAI-08051-QBA-JD-BA and unlock a world of possibilities.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Small pixel size allows for higher resolution images to be captured with great detail.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility in power options and ensures stable operation.

Body Width: 29 inch

Compact body width allows for easy integration into various systems or devices.

Power Supplies (V): 15

Operates efficiently with a standard power supply voltage of 15V.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Use of CCD image sensor technology ensures high-quality and accurate image capture.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy placement and mounting in different setups.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range allows for use in varying environmental conditions.

Horizontal Pixel: 3364

High horizontal pixel count enables capturing detailed and wide-angle images.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature range makes the sensor suitable for use in extreme cold environments.

Dynamic Range: 66 dB

Wide dynamic range ensures accurate image capture in both bright and low light conditions.

Vertical Pixel: 2520

Vertical pixel count contributes to the overall resolution and quality of the captured images.

Body Length/Diameter: 40 mm

Compact body length allows for easy installation in tight spaces or compact devices.

Optical Format (inch): 4/3

Standard optical format ensures compatibility with a wide range of lenses and accessories.

Termination Type: SOLDER

Solder termination provides secure and reliable connections for seamless integration.

Array Type: INTERLINE

Interline array type offers fast readout speeds and reduced image noise for better image quality.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature allows for secure and stable installation in various applications.

Technical Specifications

Image Sensors KAI-08051-QBA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

29 inch

Body Length/Diameter:

40 mm

Dynamic Range:

66 dB

Horizontal Pixel:

3364

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2520

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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