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NOM02A4-AR03G

Onsemi

NOM02A4-AR03G by Onsemi

NOM02A4-AR03G by Onsemi is a CMOS image sensor with 4.5-5.5V supply voltage range, 0.90-1.1V analog output, and 67mA max current draw. It is ideal for applications requiring high-resolution imaging in a compact form factor, such as security cameras or industrial machine vision systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,343 parts In-Stock

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Digiode

USA . 2,274 parts In-Stock

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AZTECH Wire

Italy . 780 parts In-Stock

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$18.620

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780

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Kulean Microsystems

USA . 8,131 parts In-Stock

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TANS Electronics

Latvia . 8,032 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,260 parts In-Stock

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Corphita

USA . 1,139 parts In-Stock

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Problanco Electronics

Mexico . 845 parts In-Stock

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Corohmni

South Africa . 244 parts In-Stock

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Perfect Parts

USA . 224 parts In-Stock

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UHIMA Technologies

Türkiye . 73 parts In-Stock

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Overview

Enhance your imaging experience with the NOM02A4-AR03G by Onsemi. Crafted with precision and cutting-edge technology, this image sensor offers unmatched quality and reliability. Perfect for a wide range of applications, this sensor delivers crisp and clear images with ease. Whether you're capturing moments or enhancing security, this product provides exceptional value and performance. Trust Onsemi to provide you with top-notch solutions that exceed expectations. Elevate your imaging game today with the NOM02A4-AR03G.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Supports a higher supply voltage, allowing for better performance and versatility in different applications.

Body Width: 19.2 inch

Wide body width provides stability and durability for the sensor, making it suitable for industrial use.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology ensures high-quality image capture and processing capabilities.

Body Height: 13.7 mm

Compact body height allows for easy integration into various devices without taking up much space.

Package Shape or Style: RECTANGULAR

Rectangular package shape makes it easy to mount and align the sensor in different orientations.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage helps in minimizing power consumption and extending battery life.

Maximum Operating Temperature: 50 °C

High maximum operating temperature range ensures the sensor can operate in harsh environmental conditions.

Output Range: 0.90-1.1V

Narrow output range provides precise and accurate output signals for image capture and processing.

Output Type: ANALOG VOLTAGE

Analog voltage output allows for easy interface with other electronic components and systems.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the sensor can function in cold environments without issues.

Maximum Operating Current: 67 mA

Low operating current consumption helps in reducing power requirements and heat generation.

Housing: PLASTIC

Plastic housing provides a lightweight and cost-effective solution for the sensor's enclosure.

Body Length/Diameter: 232.1 mm

Long body length/diameter allows for more imaging elements to be packed within the sensor, enhancing image quality.

Termination Type: SOLDER

Solder termination type ensures secure and reliable connections for the sensor's electrical interfaces.

Mounting Feature: PANEL MOUNT

Panel mounting feature makes it easy to install and replace the sensor in various devices and systems.

Technical Specifications

Image Sensors NOM02A4-AR03G attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Body Width:

19.2 inch

Body Height:

13.7 mm

Body Length/Diameter:

232.1 mm

Housing:

PLASTIC

Mounting Feature:

Maximum Operating Current:

67 mA

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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