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AR0135CS2M00SUEA0-DPBR2

Onsemi

AR0135CS2M00SUEA0-DPBR2 by Onsemi

Onsemi's AR0135CS2M00SUEA0-DPBR2 is a 1/3 inch CMOS image sensor with a 9mm square package. It features solder termination, frame array type, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact spaces like mobile devices and security cameras.

Median Price

$28.185

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,382 parts In-Stock

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$26.640

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$26.640

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Flip Electronics (Authorized)

USA . 2,382 parts In-Stock

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Mouser Electronics

USA . 300 parts In-Stock

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$29.730

1k+ parts

$29.060

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300

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$29.730

$29.060

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$31.430

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50

$31.430

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Flip Electronics

USA . 2,142 parts In-Stock

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2,142

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Vyrian

USA . 1,349 parts In-Stock

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1,349

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Digiode

USA . 950 parts In-Stock

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950

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VNN

France . 641 parts In-Stock

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641

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,388 parts In-Stock

1+ parts

$2.650

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1,388

$2.650

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Modulus Dynamics

Lithuania . 1,754 parts In-Stock

1+ parts

$3.215

100+ parts

$3.215

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$3.215

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1,754

$3.215

$3.215

$3.215

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Ampacity Inc.

Singapore . 1,381 parts In-Stock

1+ parts

$22.640

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1,381

$22.640

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Corohmni

South Africa . 78 parts In-Stock

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$26.640

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78

$26.640

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Continental Prestige Electronics

USA . 1,151 parts In-Stock

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$31.430

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$30.801

1,151

$31.430

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$30.801

Netroflash

USA . 100 parts In-Stock

1+ parts

$31.430

100+ parts

-

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$29.859

10k+ parts

$29.230

100

$31.430

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$29.859

$29.230

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,152 parts In-Stock

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7,152

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Lixinc

USA . 5,868 parts In-Stock

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5,868

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TANS Electronics

Latvia . 4,789 parts In-Stock

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4,789

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Argo Parts USA

USA . 4,377 parts In-Stock

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Problanco Electronics

Mexico . 3,453 parts In-Stock

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3,453

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SupplyDigital Components

Austria . 2,304 parts In-Stock

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2,304

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Corphita

USA . 1,537 parts In-Stock

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1,537

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UHIMA Technologies

Türkiye . 77 parts In-Stock

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77

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Overview

Unleash the power of high-quality imaging with the AR0135CS2M00SUEA0-DPBR2 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch Image Sensors that are perfect for a wide range of applications. From security cameras to automotive systems, this sensor offers unparalleled value, benefits, and advantages like no other. Experience crisp and clear images with ease, thanks to the advanced technology packed into this compact and versatile sensor. Trust Onsemi to elevate your imaging experience to new heights.

Feature Benefit Bullets

Body Width: 9 inch

Provides a compact design for easy integration into smaller devices.

Type: IMAGE SENSOR, CMOS

Offers high-quality image capturing capabilities for clear and detailed visuals.

Body Height: 1.55 mm

Enables a slim profile for flexible installation in various applications.

Package Shape: SQUARE

Facilitates a straightforward mounting process and efficient use of space.

Body Length/Diameter: 9 mm

Maintains a balanced and symmetrical form factor for uniform performance.

Optical Format: 1/3 inch

Delivers optimal image resolution and sensor sensitivity for superior image quality.

Termination Type: SOLDER

Ensures secure and reliable connections for stable data transmission.

Array Type: FRAME

Supports accurate image capture with consistent pixel arrangement and alignment.

Mounting Feature: SURFACE MOUNT

Allows for easy and secure attachment to circuit boards or PCBs.

Technical Specifications

Image Sensors AR0135CS2M00SUEA0-DPBR2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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