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AR0134CSSM00SUEA0-TRBR

Onsemi

AR0134CSSM00SUEA0-TRBR by Onsemi

The Onsemi AR0134CSSM00SUEA0-TRBR image sensor features 1280x960 resolution, 3.75um pixel size, and a 50MHz master clock. Ideal for applications requiring high-quality digital imaging in automotive cameras, surveillance systems, and industrial machine vision setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 11,192 parts In-Stock

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Digiode

USA . 1,152 parts In-Stock

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Vyrian

USA . 751 parts In-Stock

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751

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 98 parts In-Stock

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$1.470

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98

$1.470

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AZTECH Wire

Italy . 751 parts In-Stock

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$19.286

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751

$19.286

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Ampacity Inc.

Singapore . 1,016 parts In-Stock

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$38.750

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$38.750

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Semicontronic

India . 1,648 parts In-Stock

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$47.750

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$46.556

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$46.318

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1,648

$47.750

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$46.318

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Problanco Electronics

Mexico . 6,209 parts In-Stock

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TANS Electronics

Latvia . 4,478 parts In-Stock

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SupplyDigital Components

Austria . 3,642 parts In-Stock

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Kulean Microsystems

USA . 2,444 parts In-Stock

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Continental Prestige Electronics

USA . 2,046 parts In-Stock

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Corphita

USA . 1,454 parts In-Stock

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UHIMA Technologies

Türkiye . 645 parts In-Stock

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Corohmni

South Africa . 228 parts In-Stock

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Argo Parts USA

USA . 44 parts In-Stock

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Bastille Electronics

Australia . 25 parts In-Stock

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25

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Overview

Enhance your imaging projects with the AR0134CSSM00SUEA0-TRBR Image Sensor by Onsemi. Known for its high-quality products, Onsemi delivers reliable and innovative solutions in the field of image sensors. This sensor offers customers unparalleled value with its impressive dynamic range and high frame rate capabilities. Ideal for a wide range of applications, this sensor is a game-changer in the world of digital imaging. Upgrade your technology with the AR0134CSSM00SUEA0-TRBR and experience the difference in quality and performance.

Feature Benefit Bullets

Pixel Size (um): 3.75

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage: 1.95 V

Wide voltage range ensures compatibility with various systems and power sources.

Master Clock: 50 MHz

High master clock frequency supports fast data processing and high frame rates.

Body Width: 9 inch

Compact body width allows for easy integration into different devices and applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor offers low power consumption and high sensitivity for quality image capture.

Package Shape or Style: SQUARE

Square package shape provides a simple and versatile form factor for mounting and handling.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures performance reliability in various environmental conditions.

Horizontal Pixel: 1280

High horizontal pixel count enables detailed and high-resolution image capture.

Output Range: -22-22mA

Wide output range allows for flexible signal processing and compatibility with different circuit designs.

Output Type: DIGITAL CURRENT

Digital current output simplifies signal processing and transmission for easy integration with digital systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

High-quality terminal finish provides long-lasting and reliable electrical connections.

Maximum Operating Current: 60 mA

High maximum operating current supports stable performance under heavy loads and high data processing requirements.

Dynamic Range: 64 dB

Wide dynamic range allows for capturing both bright and dark areas in a scene with detail and accuracy.

Vertical Pixel: 960

High vertical pixel count contributes to producing sharp and clear images with depth and dimension.

Body Length/Diameter: 9 mm

Compact body size with length/diameter dimension for easy integration and mounting in space-constrained applications.

Optical Format (inch): 1/3

Standard optical format for compatibility with various lenses and optical systems.

Data Rate: 700 Mbps

High data rate enables fast and efficient transfer of image data for real-time processing and analysis.

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections for long-term use.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices and systems.

Frame Rate: 60 fps

High frame rate provides smooth and fluid motion capture for video recording and live streaming applications.

Array Type: SINGLE FRAME

Single frame array setup simplifies image processing and synchronization for consistent and accurate image capture.

Mounting Feature: SURFACE MOUNT

Surface mount capability offers easy and secure mounting options for quick and efficient assembly in various devices and systems.

Technical Specifications

Image Sensors AR0134CSSM00SUEA0-TRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5-3.1V

Array Type:

SINGLE FRAME

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Data Rate:

700 Mbps

Dynamic Range:

64 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

960

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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