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AR0138AT3R00XUEA0-DPBR

Onsemi

AR0138AT3R00XUEA0-DPBR by Onsemi

Onsemi's AR0138AT3R00XUEA0-DPBR is a 1/2.6 inch CMOS image sensor with 1288x968 resolution, 4.2um pixel size, and 69fps frame rate. Ideal for surface mount applications in cameras, offering high-quality imaging capabilities for various visual sensing needs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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Vyrian

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Digiode

USA . 1,254 parts In-Stock

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AZTECH Wire

Italy . 311 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 8,046 parts In-Stock

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Kulean Microsystems

USA . 7,051 parts In-Stock

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TANS Electronics

Latvia . 6,742 parts In-Stock

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SupplyDigital Components

Austria . 3,979 parts In-Stock

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Corphita

USA . 2,309 parts In-Stock

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Northwest PG Solutions

USA . 2,019 parts In-Stock

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Native Components

USA . 932 parts In-Stock

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UHIMA Technologies

Türkiye . 280 parts In-Stock

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Corohmni

South Africa . 246 parts In-Stock

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Overview

Discover the cutting-edge AR0138AT3R00XUEA0-DPBR by Onsemi, a high-quality image sensor that sets new standards in imaging technology. With Onsemi's reputation for excellence in manufacturing, this sensor delivers unparalleled performance and reliability. Ideal for applications in automotive, surveillance, and consumer electronics, this sensor offers customers exceptional value with its superior image quality, efficiency, and versatility. Upgrade your imaging systems with the AR0138AT3R00XUEA0-DPBR and experience the difference today.

Feature Benefit Bullets

Pixel Size (um) 4.2X4.2

Small pixel size allows for high resolution and detailed images.

Body Width 9 inch

Compact size makes it suitable for various applications where space is limited.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high image quality.

Body Height 1.4 mm

Low profile design enables easy integration into different devices.

Package Shape or Style RECTANGULAR

Rectangular shape allows for efficient placement and mounting.

Horizontal Pixel 1288

High horizontal pixel count results in wide image capture.

Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish ensures reliable connections.

Vertical Pixel 968

Vertical pixel count contributes to overall image quality and clarity.

Body Length/Diameter 10 mm

Moderate body length provides a good balance between size and functionality.

Optical Format (inch) 1/2.6

Optical format determines the sensor's compatibility with different lenses and setups.

Termination Type SOLDER

Solder termination ensures secure and stable connections.

Output Interface Type 2-WIRE INTERFACE

2-wire interface simplifies the connectivity and data transfer process.

Frame Rate 69 fps

High frame rate allows for smooth and detailed video capture.

Array Type SINGLE FRAME

Single frame array simplifies the image capture process.

Mounting Feature SURFACE MOUNT

Surface mount capability makes installation and integration straightforward.

Technical Specifications

Image Sensors AR0138AT3R00XUEA0-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

SINGLE FRAME

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

10 mm

Frame Rate:

69 fps

Horizontal Pixel:

1288

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/2.6

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

4.2X4.2

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

968

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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