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KLI-8023-AAA-ER-AA

Onsemi

KLI-8023-AAA-ER-AA by Onsemi

KLI-8023-AAA-ER-AA by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal and vertical pixels. It operates b/w 0 to 70 °C, with a dynamic range of 84 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

$4,318.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 8 parts In-Stock

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$4,318.750

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8

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Verical

USA . 8 parts In-Stock

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$4,318.750

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8

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Distributors (In-Stock)

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Digiode

USA . 1,880 parts In-Stock

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$4,102.812

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$4,102.812

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Vyrian

USA . 6,528 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 48 parts In-Stock

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$18.710

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48

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Corphita

USA . 2,281 parts In-Stock

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$3,886.875

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Corohmni

South Africa . 262 parts In-Stock

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$4,318.750

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262

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Problanco Electronics

Mexico . 5,477 parts In-Stock

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TANS Electronics

Latvia . 3,161 parts In-Stock

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Kulean Microsystems

USA . 3,118 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 369 parts In-Stock

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UHIMA Technologies

Türkiye . 5 parts In-Stock

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Overview

Discover the unparalleled quality and precision offered by Onsemi's KLI-8023-AAA-ER-AA Image Sensor. Ideal for a wide range of applications, this cutting-edge device delivers exceptional performance and reliability. Experience crystal-clear imaging with a dynamic range of 84 dB and a pixel size of 9x9 um. Maximize your projects with the advantage of a 6 Mbps data rate and a spectral response range of 350-850 nm. Elevate your technology to new heights with the superior value and benefits of the KLI-8023-AAA-ER-AA Image Sensor from Onsemi.

Feature Benefit Bullets

Pixel Size (um): 9X9

Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage: 15.5 V

Higher supply voltage enables the sensor to operate efficiently and deliver optimum performance.

Body Width: 15.49 inch

Compact body width allows for easy integration into various devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image output and low noise, making them a reliable choice for capturing clear and accurate images.

Body Height: 6.1 mm

Low body height provides versatility in mounting options and allows for the sensor to be used in space-constrained applications.

Package Shape or Style: RECTANGULAR

Rectangular package shape simplifies the design and integration process, making it easier to incorporate the sensor into various systems.

Minimum Supply Voltage: 14.5 V

Having a lower minimum supply voltage ensures that the sensor can operate effectively even in lower power scenarios.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range allows the sensor to be used in environments with varying temperatures without compromising performance.

Horizontal Pixel: 8002

High horizontal pixel count enables the sensor to capture wide and detailed images, making it suitable for applications requiring high-resolution visuals.

Output Range: 5.2-5.5V

Stable output voltage range ensures consistent and accurate signal output from the sensor, leading to reliable image data transmission.

Output Type: ANALOG VOLTAGE

Analog voltage output provides compatibility with a wide range of systems and interfaces, allowing for seamless integration and data processing.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the sensor can function effectively in colder environments without any performance degradation.

Housing: CERAMIC

Ceramic housing offers durability and reliability, ensuring the sensor is well-protected and can withstand harsh operating conditions.

Dynamic Range: 84 dB

High dynamic range capability allows the sensor to capture a wide range of light intensities accurately, making it suitable for applications with varying lighting conditions.

Vertical Pixel: 8002

Matching the high horizontal pixel count, a high vertical pixel count ensures detailed and clear images are captured efficiently.

Body Length/Diameter: 93.98 mm

Long body length provides flexibility in mounting and positioning the sensor, allowing for easy integration into different systems or devices.

Spectral Response (nm): 350-850

Broad spectral response range enables the sensor to capture images across a wide range of wavelengths, making it suitable for diverse imaging applications.

Data Rate: 6 Mbps

High data rate ensures quick and efficient transmission of image data, making it suitable for applications requiring fast image processing.

Termination Type: SOLDER

Solder termination type ensures secure connections and reliable signal transmission, enhancing overall system stability.

Array Type: LINEAR

Linear array type simplifies image capture and data processing, making it suitable for applications requiring linear imaging capabilities.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature offers ease of installation and secure attachment, making it suitable for applications where stability and durability are critical.

Technical Specifications

Image Sensors KLI-8023-AAA-ER-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

LINEAR

Body Width:

15.49 inch

Body Height:

6.1 mm

Body Length/Diameter:

93.98 mm

Data Rate:

6 Mbps

Dynamic Range:

84 dB

Horizontal Pixel:

8002

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Spectral Response (nm):

350-850

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

8002

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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