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KAF-18500-NXA-JH-AE-08

Onsemi

KAF-18500-NXA-JH-AE-08 by Onsemi

KAF-18500-NXA-JH-AE-08 by Onsemi is a 6.8X6.8 um CCD image sensor with 5270 (H) x 3516 (V) pixels, offering a dynamic range of 68.1 dB. It operates b/w 0 to 60 °C and has a data rate of 24 Mbps. Ideal for high-resolution imaging applications in industries like surveillance, astronomy, and scientific research.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 12,370 parts In-Stock

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Digiode

USA . 628 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 461 parts In-Stock

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$19.170

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Semicontronic

India . 981 parts In-Stock

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$32.750

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$31.931

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$31.768

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Ampacity Inc.

Singapore . 1,196 parts In-Stock

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$36.750

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SupplyDigital Components

Austria . 7,713 parts In-Stock

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Kulean Microsystems

USA . 6,784 parts In-Stock

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Problanco Electronics

Mexico . 4,060 parts In-Stock

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Continental Prestige Electronics

USA . 3,625 parts In-Stock

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Argo Parts USA

USA . 2,603 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 693 parts In-Stock

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TANS Electronics

Latvia . 276 parts In-Stock

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Corohmni

South Africa . 125 parts In-Stock

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Overview

Discover the unparalleled quality and innovation of the KAF-18500-NXA-JH-AE-08 by Onsemi. As a leader in image sensor technology, Onsemi delivers cutting-edge solutions that exceed expectations. Ideal for a wide range of applications, this image sensor offers exceptional performance and reliability. Unlock new possibilities with the KAF-18500-NXA-JH-AE-08 and experience the value, benefits, and advantages it brings to your projects. Elevate your creations with Onsemi's superior technology.

Feature Benefit Bullets

Pixel Size (um): 6.8X6.8

This small pixel size allows for high resolution imaging, making it ideal for detailed photography.

Maximum Supply Voltage: 15.5 V

With a high supply voltage, this image sensor can operate reliably in a variety of electronic devices.

Body Width: 34.1 inch

The compact body width makes this sensor easy to integrate into a wide range of systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors offer high-quality image reproduction and are commonly used in professional cameras.

Body Height: 3.5 mm

The low body height of this sensor ensures minimal space usage, perfect for slim electronic devices.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy placement and alignment during assembly.

Minimum Supply Voltage: 14.5 V

With a low minimum supply voltage, this sensor can operate efficiently even in energy-efficient devices.

Maximum Operating Temperature: 60 °C

This sensor can function reliably in high-temperature environments, expanding its potential applications.

Horizontal Pixel: 5270

The high number of horizontal pixels results in sharp, detailed images with precise color representation.

Minimum Operating Temperature: 0 °C

This sensor can operate in cold temperatures without compromising performance, making it versatile for various environments.

Dynamic Range: 68.1 dB

The wide dynamic range of this sensor allows for accurate image capture in both bright and dark conditions.

Vertical Pixel: 3516

The vertical pixel count ensures excellent image resolution and clarity for any application.

Body Length/Diameter: 48.1 mm

The moderate body length/diameter makes this sensor easy to handle and install in different devices.

Data Rate: 24 Mbps

With a high data rate, this sensor can quickly transmit large amounts of image data, essential for real-time applications.

Termination Type: SOLDER

The solder termination ensures a secure connection, preventing signal loss and ensuring reliable performance.

Array Type: FULL FRAME

A full-frame array provides a larger imaging area, capturing more detail and producing high-quality images.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process, making this sensor user-friendly for assembly.

Technical Specifications

Image Sensors KAF-18500-NXA-JH-AE-08 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FULL FRAME

Body Width:

34.1 inch

Body Height:

3.5 mm

Body Length/Diameter:

48.1 mm

Data Rate:

24 Mbps

Dynamic Range:

68.1 dB

Horizontal Pixel:

5270

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6.8X6.8

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3516

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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