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KAF-18500-NXA-JH-AA-08

Onsemi

KAF-18500-NXA-JH-AA-08 by Onsemi

The Onsemi KAF-18500-NXA-JH-AA-08 is a CCD image sensor with 6.8X6.8 um pixel size, offering a dynamic range of 68.1 dB and 5270 horizontal pixels for high-quality imaging applications. With a max supply voltage of 15.5 V and operating temperature range from 0 to 60 °C, it is suitable for industrial cameras and scientific imaging systems requiring precise data capture at up to 24 Mbps data rate.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,606 parts In-Stock

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Digiode

USA . 2,431 parts In-Stock

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Nova Conductors

Japan . 26 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 562 parts In-Stock

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$9.819

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Semicontronic

India . 189 parts In-Stock

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$39.750

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$38.756

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$38.558

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Ampacity Inc.

Singapore . 614 parts In-Stock

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$52.750

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Problanco Electronics

Mexico . 7,943 parts In-Stock

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Kulean Microsystems

USA . 5,973 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 4,659 parts In-Stock

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Corphita

USA . 2,431 parts In-Stock

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Argo Parts USA

USA . 1,031 parts In-Stock

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TANS Electronics

Latvia . 889 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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UHIMA Technologies

Türkiye . 663 parts In-Stock

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Corohmni

South Africa . 275 parts In-Stock

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Continental Prestige Electronics

USA . 227 parts In-Stock

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Overview

Capture every moment in stunning clarity with the KAF-18500-NXA-JH-AA-08 Image Sensor by Onsemi. Crafted with precision and expertise, this sensor offers unmatched quality and reliability for a wide range of applications. From high-resolution imaging to advanced surveillance systems, this sensor delivers exceptional performance and versatility. Experience the superior value and benefits this product brings to your projects, with its cutting-edge technology and innovative design. Elevate your creations with the KAF-18500-NXA-JH-AA-08 and see the world in a whole new light.

Feature Benefit Bullets

Pixel Size (um) 6.8X6.8

Smaller pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage 15.5 V

Higher maximum supply voltage provides flexibility in power supply options.

Body Width 34.1 inch

Compact body width makes it suitable for various imaging applications where space is limited.

Power Supplies (V) 15

Standard power supply voltage ensuring compatibility with existing systems.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors are known for their high image quality and low noise performance.

Body Height 3.5 mm

Low profile design allows for easy integration into devices without adding bulk.

Package Shape or Style RECTANGULAR

Rectangular shape provides versatility in mounting options and fitment.

Minimum Supply Voltage 14.5 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature 60 °C

Wide operating temperature range makes it suitable for outdoor and industrial use in various environments.

Horizontal Pixel 5270

High horizontal pixel count results in detailed and sharp images.

Minimum Operating Temperature 0 °C

Operational at low temperatures making it ideal for use in cold climates or refrigeration applications.

Dynamic Range 68.1 dB

Wide dynamic range ensures accurate reproduction of both bright and dark areas in an image.

Vertical Pixel 3516

High vertical pixel count results in high-resolution images with good clarity.

Body Length/Diameter 48.1 mm

Compact body length allows for easy integration into space-constrained devices.

Data Rate 24 Mbps

High data rate enables fast image transfer for real-time applications.

Termination Type SOLDER

Solder termination provides a secure and reliable connection.

Array Type FULL FRAME

Full-frame array ensures maximum image capture area without cropping or reducing image quality.

Mounting Feature THROUGH HOLE MOUNT

Through-hole mounting provides secure and stable attachment to circuit boards or enclosures.

Technical Specifications

Image Sensors KAF-18500-NXA-JH-AA-08 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FULL FRAME

Body Width:

34.1 inch

Body Height:

3.5 mm

Body Length/Diameter:

48.1 mm

Data Rate:

24 Mbps

Dynamic Range:

68.1 dB

Horizontal Pixel:

5270

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6.8X6.8

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3516

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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