Loading...

KAI-0373-ABA-CB-BA

Onsemi

KAI-0373-ABA-CB-BA by Onsemi

KAI-0373-ABA-CB-BA by Onsemi is an image sensor with 768x484 pixels, 11.6X13.6 um pixel size, and 60 dB dynamic range. It operates b/w -25 to +40 °C and has a supply voltage range of 14.5V to 15.5V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in industrial or scientific settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,221

-

-

-

-

Digiode

USA . 2,203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,203

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,914

-

-

-

-

TANS Electronics

Latvia . 4,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,473

-

-

-

-

SupplyDigital Components

Austria . 3,724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,724

-

-

-

-

Corphita

USA . 2,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,164

-

-

-

-

Problanco Electronics

Mexico . 1,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,253

-

-

-

-

UHIMA Technologies

Türkiye . 153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

153

-

-

-

-

Corohmni

South Africa . 148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

148

-

-

-

-

Overview

Experience unparalleled image quality and precision with the KAI-0373-ABA-CB-BA by Onsemi. As a leading manufacturer in the field of image sensors, Onsemi delivers cutting-edge technology that is revolutionizing industries worldwide. This image sensor offers exceptional performance in a compact design, making it ideal for applications in surveillance, medical imaging, and automotive systems. Trust Onsemi to provide you with reliable and innovative solutions that exceed your expectations. Elevate your projects with the KAI-0373-ABA-CB-BA and unlock a world of possibilities.

Feature Benefit Bullets

Pixel Size (um): 11.6X13.6

High pixel size allows for better light sensitivity and image quality, making this image sensor suitable for low-light environments or applications requiring high resolution.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility in power supply options and ensures stable operation of the image sensor in various voltage conditions.

Body Width: 20.19 inch

Compact body width makes this image sensor suitable for applications where space is limited or where a smaller form factor is desirable.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensor technology offers high-quality image capture with low noise, making it ideal for applications requiring precise image reproduction.

Body Height: 4.32 mm

Low body height allows for easy integration into slim devices or systems where space constraints are a concern.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides ease of installation and alignment in devices or systems, simplifying the manufacturing and assembly process.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in power efficiency and can extend battery life in portable devices or applications where power consumption is critical.

Maximum Operating Temperature: 40 °C

Wide operating temperature range ensures reliable performance in varying environmental conditions, making this image sensor suitable for outdoor or industrial applications.

Horizontal Pixel: 768

High horizontal pixel count allows for detailed image capture and better resolution, making this image sensor ideal for applications requiring high-definition imaging.

Minimum Operating Temperature: 25 °C

Low minimum operating temperature ensures the image sensor can function in cold environments or during temperature fluctuations without performance degradation.

Housing: CERAMIC

Ceramic housing provides durability and resistance to temperature changes, mechanical stress, and chemical exposure, ensuring long-term reliability in harsh operating conditions.

Dynamic Range: 60 dB

High dynamic range enables the image sensor to capture a wide range of light intensities accurately, making it suitable for applications with challenging lighting conditions.

Vertical Pixel: 484

Vertical pixel count contributes to the overall image resolution and quality, allowing for detailed image capture in both horizontal and vertical dimensions.

Body Length/Diameter: 30.48 mm

Moderate body length/diameter provides a balance between size constraints and functionality, making this image sensor suitable for various applications without compromising performance.

Optical Format (inch): 2/3

2/3 inch optical format is a common standard in the industry, ensuring compatibility with a wide range of lenses and systems, making integration easier and more versatile.

Termination Type: SOLDER

Solder termination type ensures secure electrical connections, preventing connectivity issues or signal loss, making this image sensor reliable in demanding applications.

Array Type: INTERLINE

Interline array type offers fast readout speeds and reduced image lag, making this image sensor ideal for applications requiring high-speed image capture or video recording.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature allows for secure and stable installation on circuit boards or other surfaces, ensuring the image sensor remains securely in place during operation.

Technical Specifications

Image Sensors KAI-0373-ABA-CB-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 9 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

20.19 inch

Body Height:

4.32 mm

Body Length/Diameter:

30.48 mm

Dynamic Range:

60 dB

Horizontal Pixel:

768

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

25 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

11.6X13.6

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

484

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20