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MT9V126IA3XTC-DP

Onsemi

MT9V126IA3XTC-DP by Onsemi

MT9V126IA3XTC-DP by Onsemi is a 1/4 inch CMOS image sensor with 5.60x5.60 um pixel size, offering 680x512 resolution and 30 fps frame rate. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 74.6 dB and low power consumption of 50 mA at a max supply voltage of 1.9 V.

Median Price

$17.120

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70 parts In-Stock

1+ parts

$17.120

100+ parts

$16.090

1k+ parts

$14.550

10k+ parts

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70

$17.120

$16.090

$14.550

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,277 parts In-Stock

1+ parts

$16.264

100+ parts

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2,277

$16.264

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Vyrian

USA . 4,810 parts In-Stock

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4,810

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Nova Conductors

Japan . 89 parts In-Stock

1+ parts

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89

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 70 parts In-Stock

1+ parts

$14.550

100+ parts

-

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70

$14.550

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Corphita

USA . 1,965 parts In-Stock

1+ parts

$15.408

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1,965

$15.408

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Corohmni

South Africa . 107 parts In-Stock

1+ parts

$17.120

100+ parts

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107

$17.120

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AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$19.390

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647

$19.390

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SupplyDigital Components

Austria . 7,061 parts In-Stock

1+ parts

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7,061

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Kulean Microsystems

USA . 4,990 parts In-Stock

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4,990

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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TANS Electronics

Latvia . 1,468 parts In-Stock

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1,468

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Problanco Electronics

Mexico . 865 parts In-Stock

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865

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UHIMA Technologies

Türkiye . 253 parts In-Stock

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253

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Overview

Capture every moment in stunning clarity with the MT9V126IA3XTC-DP image sensor by Onsemi. Crafted with precision and expertise, this sensor delivers unparalleled quality and performance. Ideal for a wide range of applications, from security cameras to medical imaging equipment, this sensor offers exceptional value and benefits to customers. Experience the advantages of crisp images, reliable operation, and seamless integration, all in a compact and efficient package. Trust Onsemi to provide cutting-edge technology that elevates your projects to new heights.

Feature Benefit Bullets

Pixel Size (um): 5.60X5.60

The small pixel size allows for high resolution images to be captured with minimal noise, making it ideal for applications requiring detailed imaging.

Maximum Supply Voltage: 1.9 V

The low maximum supply voltage helps in reducing power consumption and heat generation, leading to longer battery life and improved overall efficiency.

Master Clock: 27 MHz

The high master clock frequency enables fast data readout and processing, resulting in real-time image capture and transmission.

Body Width: 9 inch

The compact body width allows for easy integration into various devices and systems without taking up much space.

Power Supplies (V): 1.8

The stable power supply voltage ensures consistent performance and accurate output, making it reliable for critical imaging applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

The CMOS sensor technology provides high sensitivity, low noise, and fast response times, resulting in high-quality images with accurate color reproduction.

Body Height: 1.4 mm

The low profile body height allows for easier installation and integration, especially in compact devices or systems where space is limited.

Package Shape or Style: SQUARE

The square package shape provides a simple and versatile design for mounting and connecting the image sensor to other components or circuitry.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage ensures reliable operation even under low power conditions, making it suitable for portable or battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance in harsh environmental conditions, making it suitable for a wide range of applications.

Horizontal Pixel: 680

The high horizontal pixel count enables high-resolution imaging with detailed image capture, making it suitable for applications requiring fine details.

Output Range: -0.30-2.80V

The wide output voltage range allows for flexible signal processing and compatibility with different systems or devices, providing versatile integration options.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies signal processing and communication, making it easier to integrate the image sensor with digital systems or interfaces.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions, making it suitable for outdoor or industrial applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish with tin, silver, and copper provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Maximum Operating Current: 50 mA

The low maximum operating current helps in reducing power consumption and heat dissipation, leading to improved energy efficiency and longer device lifespan.

Dynamic Range: 74.6 dB

The high dynamic range allows for capturing both bright and dark scenes with detail and accuracy, making it suitable for high-contrast imaging applications.

Vertical Pixel: 512

The vertical pixel count provides high-resolution images with good clarity and sharpness, making it suitable for applications requiring detailed vertical imaging.

Body Length/Diameter: 9 mm

The compact body length or diameter allows for easy installation and integration into various devices or systems, providing flexibility in design and mounting options.

Optical Format (inch): 1/4

The 1/4 inch optical format is a common standard size, providing compatibility with various lenses and imaging systems, making it versatile for different applications.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections, preventing signal loss or interference, making it suitable for rugged or high-vibration environments.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface type simplifies communication and data transfer, making it easier to integrate the image sensor with other components or systems, enhancing overall functionality.

Frame Rate: 30 fps

The high frame rate of 30 frames per second allows for smooth and fluid video capture, making it suitable for applications requiring real-time imaging or video recording.

Array Type: FRAME

The frame array type provides a structured layout for capturing and processing image data, enabling efficient image acquisition and manipulation for various applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation on PCBs or other surfaces, providing convenience and reliability in mounting the image sensor.

Technical Specifications

Image Sensors MT9V126IA3XTC-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.66-2.94 V

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Dynamic Range:

74.6 dB

Frame Rate:

30 fps

Horizontal Pixel:

680

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.60X5.60

Power Supplies (V):

1.8

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

512

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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