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AR0221SR2C00SUEA0-DPBR1

Onsemi

AR0221SR2C00SUEA0-DPBR1 by Onsemi

Onsemi's AR0221SR2C00SUEA0-DPBR1 is a 1928x1088 CMOS image sensor with 1/1.7" optical format, offering 60 fps frame rate. Ideal for surface mount applications, it features a 2-wire interface and solder termination type.

Median Price

$45.890

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

AR0221SR2C00SUEA0-DPBR1 by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$31.980

1k+ parts

$28.610

10k+ parts

$26.930

195

-

$31.980

$28.610

$26.930

Verical

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$59.800

1k+ parts

$53.513

10k+ parts

$50.362

195

-

$59.800

$53.513

$50.362

Distributors (In-Stock)

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Digiode

USA . 1,321 parts In-Stock

1+ parts

$50.626

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1,321

$50.626

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Vyrian

USA . 5,437 parts In-Stock

1+ parts

-

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5,437

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Flip Electronics

USA . 195 parts In-Stock

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195

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Distributors (Availability)

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Native Components

USA . 754 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

-

10k+ parts

$0.106

754

$0.110

-

-

$0.106

Northwest PG Solutions

USA . 1,255 parts In-Stock

1+ parts

$0.121

100+ parts

-

1k+ parts

-

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$0.107

1,255

$0.121

-

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$0.107

AZTECH Wire

Italy . 42 parts In-Stock

1+ parts

$21.400

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42

$21.400

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Corphita

USA . 1,332 parts In-Stock

1+ parts

$47.961

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1,332

$47.961

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Corohmni

South Africa . 206 parts In-Stock

1+ parts

$53.290

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206

$53.290

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 7,029 parts In-Stock

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7,029

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SupplyDigital Components

Austria . 6,063 parts In-Stock

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6,063

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Problanco Electronics

Mexico . 5,410 parts In-Stock

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Kulean Microsystems

USA . 3,167 parts In-Stock

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UHIMA Technologies

Türkiye . 102 parts In-Stock

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Overview

Capture stunning images with the AR0221SR2C00SUEA0-DPBR1 by Onsemi, a leading manufacturer of high-quality image sensors. This innovative CMOS sensor offers exceptional performance and reliability, making it ideal for a wide range of applications. From surveillance cameras to automotive systems, this sensor delivers superior image quality and accuracy. Experience the value and benefits of this cutting-edge technology, and elevate your products to new heights with the AR0221SR2C00SUEA0-DPBR1.

Feature Benefit Bullets

Body Width: 9 inch

The compact body width of 9 inches allows for easy integration into various devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high-quality image capture, making them ideal for a wide range of applications.

Body Height: 1.65 mm

The slim body height of 1.65 mm enables this sensor to be used in thin devices where space is limited.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides versatility in mounting options and allows for easy placement within devices.

Horizontal Pixel: 1928

The high horizontal pixel count of 1928 results in sharp and detailed images, perfect for applications requiring high image quality.

Vertical Pixel: 1088

The vertical pixel count of 1088 complements the high horizontal pixel count, ensuring well-balanced and clear images.

Body Length/Diameter: 12 mm

With a body length/diameter of 12 mm, this sensor is compact and can fit into small devices without compromising on performance.

Optical Format (inch): 1/1.7

The optical format of 1/1.7 inch provides a good balance between image quality and sensor size, making it suitable for a wide range of applications.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection, making installation and maintenance of the sensor hassle-free.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication with other devices, improving overall system integration.

Frame Rate: 60 fps

With a high frame rate of 60 fps, this sensor is capable of capturing fast-moving objects with smooth and detailed motion, suitable for dynamic environments.

Array Type: FRAME

The frame array type allows for efficient image capture and processing, providing consistent and reliable performance in various scenarios.

Mounting Feature: SURFACE MOUNT

The surface mounting feature offers easy and secure installation onto PCBs or other surfaces, making it convenient for production and maintenance processes.

Technical Specifications

Image Sensors AR0221SR2C00SUEA0-DPBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.65 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1928

Mounting Feature:

Optical Format (inch):

1/1.7

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1088

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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