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AR0234CSSC00SUKA0-CP1

Onsemi

AR0234CSSC00SUKA0-CP1 by Onsemi

The Onsemi AR0234CSSC00SUKA0-CP1 image sensor features 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It is ideal for applications requiring high-quality digital imaging such as surveillance cameras, automotive vision systems, and drones due to its compact rectangular package and 120 fps frame rate.

Median Price

$45.670

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 159 parts In-Stock

1+ parts

$31.141

100+ parts

-

1k+ parts

-

10k+ parts

-

159

$31.141

-

-

-

DigiKey

USA . 281 parts In-Stock

1+ parts

$45.670

100+ parts

$33.705

1k+ parts

$32.618

10k+ parts

-

281

$45.670

$33.705

$32.618

-

Farnell

UK . 209 parts In-Stock

1+ parts

$50.810

100+ parts

$35.796

1k+ parts

-

10k+ parts

-

209

$50.810

$35.796

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Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$40.280

1k+ parts

$36.040

10k+ parts

$33.920

50

-

$40.280

$36.040

$33.920

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$50.350

1k+ parts

$45.050

10k+ parts

$42.400

50

-

$50.350

$45.050

$42.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,269 parts In-Stock

1+ parts

$29.584

100+ parts

-

1k+ parts

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2,269

$29.584

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$36.680

100+ parts

-

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10k+ parts

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300

$36.680

-

-

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Vyrian

USA . 7,151 parts In-Stock

1+ parts

-

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7,151

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VNN

France . 4,619 parts In-Stock

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4,619

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Flip Electronics

USA . 15 parts In-Stock

1+ parts

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 54,357 parts In-Stock

1+ parts

$2.710

100+ parts

-

1k+ parts

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10k+ parts

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54,357

$2.710

-

-

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AZTECH Wire

Italy . 294 parts In-Stock

1+ parts

$15.667

100+ parts

-

1k+ parts

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294

$15.667

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-

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Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$26.470

100+ parts

-

1k+ parts

-

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150

$26.470

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Semicontronic

India . 150 parts In-Stock

1+ parts

$26.470

100+ parts

$25.808

1k+ parts

$25.676

10k+ parts

-

150

$26.470

$25.808

$25.676

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Corphita

USA . 2,196 parts In-Stock

1+ parts

$28.027

100+ parts

-

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10k+ parts

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2,196

$28.027

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Corohmni

South Africa . 165 parts In-Stock

1+ parts

$31.141

100+ parts

-

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165

$31.141

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$36.680

100+ parts

-

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2,000

$36.680

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-

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Continental Prestige Electronics

USA . 170 parts In-Stock

1+ parts

$39.190

100+ parts

-

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170

$39.190

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Problanco Electronics

Mexico . 8,365 parts In-Stock

1+ parts

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8,365

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Argo Parts USA

USA . 4,942 parts In-Stock

1+ parts

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4,942

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SupplyDigital Components

Austria . 4,092 parts In-Stock

1+ parts

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4,092

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-

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TANS Electronics

Latvia . 1,923 parts In-Stock

1+ parts

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1,923

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Kulean Microsystems

USA . 1,634 parts In-Stock

1+ parts

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1,634

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UHIMA Technologies

Türkiye . 947 parts In-Stock

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947

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Perfect Parts

USA . 448 parts In-Stock

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448

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Authorized Procurement Solutions

USA . 300 parts In-Stock

1+ parts

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300

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Overview

Capture stunning images with the AR0234CSSC00SUKA0-CP1 image sensor by Onsemi. Known for its superior quality and cutting-edge technology, Onsemi is a trusted manufacturer in the industry. This image sensor is perfect for applications such as automotive cameras, security systems, and industrial imaging. With high resolution, wide dynamic range, and fast frame rates, this product offers exceptional value and performance to customers looking to elevate their imaging solutions. Experience the advantages of Onsemi's AR0234CSSC00SUKA0-CP1 image sensor today.

Feature Benefit Bullets

Pixel Size (um): 3X3

Small pixel size allows for high-resolution image capture, making this sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage: 1.26 V

Wide supply voltage range provides flexibility in power requirements, enhancing compatibility with various systems.

Master Clock: 54 MHz

High master clock frequency enables fast data processing and high-speed image capture, ideal for real-time imaging applications.

Body Width: 5.595 inch

Compact body width allows for easy integration into devices with limited space, making it a versatile choice for compact designs.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology offers low power consumption and high sensitivity, resulting in efficient and high-quality image capture.

Body Height: 0.666 mm

Slim body height allows for a sleek and low-profile design, suitable for applications where space is a constraint.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides easy handling and mounting, making installation hassle-free.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage helps in reducing power consumption, making it an energy-efficient choice for battery-powered devices.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in harsh environmental conditions, increasing the sensor's durability and versatility.

Horizontal Pixel: 1920

High horizontal pixel count results in detailed and sharp images, making it suitable for applications that require high image resolution.

Output Range: 0.4-1.26V

Wide output voltage range offers flexibility in signal processing and compatibility with different interfaces, enhancing connectivity options.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital systems, offering accurate and reliable data transmission.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the sensor's functionality in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

Durable terminal finish provides corrosion resistance, ensuring long-term reliability and stability in various operating environments.

Maximum Operating Current: 250 mA

High maximum operating current capability enables the sensor to handle heavy loads, making it suitable for demanding applications.

Dynamic Range: 71.4 dB

Wide dynamic range allows the sensor to capture both bright and dark areas accurately in the same frame, ensuring high-quality imaging in challenging lighting conditions.

Vertical Pixel: 1200

High vertical pixel count enhances image clarity and detail, making the sensor suitable for applications that require precise vertical resolution.

Body Length/Diameter: 9.995 mm

Compact body length/diameter ratio facilitates easy integration into various devices, making it a versatile choice for space-constrained applications.

Optical Format (inch): 1/2.6

Standard optical format offers compatibility with a wide range of lenses, allowing for greater flexibility in the choice of optics for different applications.

Termination Type: SOLDER

Solder termination provides a reliable electrical connection, ensuring secure and stable signal transmission without the risk of connectivity issues.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connection process and enhances compatibility with different systems, making integration hassle-free.

Frame Rate: 120 fps

High frame rate enables the sensor to capture fast-moving objects accurately, making it ideal for applications that require high-speed imaging.

Array Type: FRAME

Frame array type ensures uniform and precise image capture, resulting in consistent image quality across the entire sensor surface.

Mounting Feature: SURFACE MOUNT

Surface mounting feature simplifies installation and enhances stability, making it easy to integrate the sensor into various devices.

Technical Specifications

Image Sensors AR0234CSSC00SUKA0-CP1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE; COLOR SENSITIVITY IS 22.3 KE/LUX.S

Array Type:

FRAME

Body Width:

5.595 inch

Body Height:

.666 mm

Body Length/Diameter:

9.995 mm

Dynamic Range:

71.4 dB

Frame Rate:

120 fps

Horizontal Pixel:

1920

JESD-609 Code:

e1

Master Clock:

54 MHz

Mounting Feature:

Maximum Operating Current:

250 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/2.6

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3X3

Sensors or Transducers Type:

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

1200

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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