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AR0138AT2C00XUD20-E

Onsemi

AR0138AT2C00XUD20-E by Onsemi

Onsemi's AR0138AT2C00XUD20-E is a 1/2.6 inch CMOS image sensor with 4.2um pixel size, offering 1288x968 resolution and 115dB dynamic range. Operating at -40 to 110 °C, it has a max supply voltage of 1.26V and outputs digital voltage in the range of 0.40-2.50V. Ideal for applications requiring high-resolution imaging with low power consumption and wide temperature range capabilities at up to 69 fps frame rate using a two-wire interface.

Median Price

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Lifecycle Status

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TANS Electronics

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Corphita

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Northwest PG Solutions

USA . 816 parts In-Stock

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South Africa . 154 parts In-Stock

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Native Components

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Overview

Experience the exceptional quality and superior performance of the AR0138AT2C00XUD20-E image sensor by Onsemi. Known for their innovative technology and cutting-edge design, Onsemi delivers top-of-the-line image sensors that excel in a variety of applications. Whether you're in automotive, security, or consumer electronics, this sensor offers unmatched value with its high resolution, wide dynamic range, and reliable operation in extreme temperatures. Elevate your products with the AR0138AT2C00XUD20-E and experience the difference Onsemi can make in your designs.

Feature Benefit Bullets

Pixel Size (um): 4.2

Small pixel size allows for high resolution imaging and detailed capture of images.

Maximum Supply Voltage: 1.26V

Provides sufficient power for efficient operation of the image sensor.

Master Clock: 85.5MHz

High master clock frequency enables fast data processing and high frame rates.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors are known for their low power consumption and high image quality, making them a popular choice in various applications.

Minimum Supply Voltage: 1.14V

Low minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 110 °C

Wide operating temperature range makes this image sensor suitable for use in various environmental conditions.

Horizontal Pixel: 1288

High number of horizontal pixels allows for detailed and sharp image capture.

Output Range: 0.40-2.50V

Wide output range provides flexibility in capturing images with varying light conditions.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies the interfacing of the image sensor with other electronics.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation even in extreme cold conditions.

Dynamic Range: 115 dB

High dynamic range enables the sensor to capture both bright and dark areas in an image with great detail.

Vertical Pixel: 968

High number of vertical pixels enhances the sensor's ability to capture detailed and high-resolution images.

Optical Format (inch): 1/2.6

Popular optical format provides compatibility with various lenses and optical systems.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connectivity and integration of the image sensor with other devices.

Frame Rate: 69 fps

High frame rate allows for smooth and continuous video capture.

Array Type: FRAME

Array type provides a structured arrangement of pixels for efficient image capture and processing.

Technical Specifications

Image Sensors AR0138AT2C00XUD20-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8V NOMINAL SUPPLY VOLTAGE

Array Type:

FRAME

Dynamic Range:

115 dB

Frame Rate:

69 fps

Horizontal Pixel:

1288

Master Clock:

85.5 MHz

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/2.6

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Pixel Size (um):

4.2

Sensors or Transducers Type:

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Vertical Pixel:

968

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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