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AR0135AT2M25XUEA0-DPBR

Onsemi

AR0135AT2M25XUEA0-DPBR by Onsemi

Onsemi's AR0135AT2M25XUEA0-DPBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size, offering 54 fps frame rate for high-speed imaging applications. Its square package shape and surface mounting feature make it ideal for compact camera designs in various industries.

Median Price

$29.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

AR0135AT2M25XUEA0-DPBR by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,959 parts In-Stock

1+ parts

$29.720

100+ parts

$23.779

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1,959

$29.720

$23.779

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Flip Electronics

USA . 674 parts In-Stock

1+ parts

$15.770

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674

$15.770

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Digiode

USA . 2,393 parts In-Stock

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$33.886

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2,393

$33.886

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Vyrian

USA . 1,781 parts In-Stock

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$35.670

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1,781

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VNN

France . 2,528 parts In-Stock

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2,528

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Ampacity Inc.

Singapore . 2,202 parts In-Stock

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$30.320

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Corphita

USA . 2,212 parts In-Stock

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$32.103

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Corohmni

South Africa . 320 parts In-Stock

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$35.670

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320

$35.670

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Problanco Electronics

Mexico . 6,738 parts In-Stock

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Kulean Microsystems

USA . 6,579 parts In-Stock

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SupplyDigital Components

Austria . 5,751 parts In-Stock

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Argo Parts USA

USA . 3,658 parts In-Stock

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Continental Prestige Electronics

USA . 2,311 parts In-Stock

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TANS Electronics

Latvia . 1,527 parts In-Stock

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1,527

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UHIMA Technologies

Türkiye . 415 parts In-Stock

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415

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Netroflash

USA . 100 parts In-Stock

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Overview

Experience the world through a clearer lens with the AR0135AT2M25XUEA0-DPBR by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers unmatched quality and reliability. Perfect for applications in automotive and industrial cameras, this product provides high-resolution images with a pixel size of 3.75X3.75 um. With a frame rate of 54 fps, customers can capture fast-moving scenes with precision. Trust Onsemi to bring innovation and excellence to your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 3.75X3.75

The small pixel size allows for higher resolution images with greater detail, making this sensor ideal for applications requiring sharp, clear images.

Body Width: 9 inch

The compact body width of 9 inches makes this sensor suitable for integration into various devices without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

Being a CMOS image sensor, this product offers low power consumption, high speed, and excellent image quality, making it a versatile choice for different imaging applications.

Body Height: 1.4 mm

The slim body height of 1.4 mm allows for easy integration into thin devices or systems where space is limited.

Package Shape or Style: SQUARE

The square package shape provides stability and easy mounting, ensuring a secure fit for the sensor in various applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish options of Tin, Silver, or Copper provide flexibility for different soldering processes and ensure reliable electrical connections.

Body Length/Diameter: 9 mm

The small body length/diameter of 9 mm contributes to the compact size of the sensor, making it suitable for space-constrained applications.

Optical Format (inch): 1/3

The 1/3 inch optical format is a common industry standard that ensures compatibility with various lenses and imaging systems.

Termination Type: SOLDER

The solder termination type simplifies the installation process, making it easier to connect the sensor to the desired system or circuit.

Frame Rate: 54 fps

With a high frame rate of 54 fps, this sensor can capture fast-moving objects or scenes with smooth and clear motion, making it ideal for dynamic imaging applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure attachment of the sensor to PCBs or other surfaces, simplifying the integration process.

Technical Specifications

Image Sensors AR0135AT2M25XUEA0-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Frame Rate:

54 fps

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Pixel Size (um):

3.75X3.75

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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