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KAI-11002-CBA-CD-B2

Onsemi

KAI-11002-CBA-CD-B2 by Onsemi

KAI-11002-CBA-CD-B2 by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in various industries.

Median Price

$2,990.120

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$2,469.980

100+ parts

$2,321.780

1k+ parts

$2,173.580

10k+ parts

-

1

$2,469.980

$2,321.780

$2,173.580

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$2,990.120

100+ parts

$2,990.120

1k+ parts

$2,990.120

10k+ parts

$2,990.120

1

$2,990.120

$2,990.120

$2,990.120

$2,990.120

Verical

USA . 1 parts In-Stock

1+ parts

$3,087.475

100+ parts

$2,902.225

1k+ parts

$2,716.975

10k+ parts

-

1

$3,087.475

$2,902.225

$2,716.975

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,619 parts In-Stock

1+ parts

$2,731.364

100+ parts

-

1k+ parts

-

10k+ parts

-

1,619

$2,731.364

-

-

-

Vyrian

USA . 2,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,187

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$2,441.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$2,441.000

-

-

-

Corphita

USA . 1,282 parts In-Stock

1+ parts

$2,587.608

100+ parts

-

1k+ parts

-

10k+ parts

-

1,282

$2,587.608

-

-

-

Corohmni

South Africa . 142 parts In-Stock

1+ parts

$2,875.120

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$2,875.120

-

-

-

Problanco Electronics

Mexico . 4,929 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,929

-

-

-

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TANS Electronics

Latvia . 3,849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,849

-

-

-

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Kulean Microsystems

USA . 3,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,393

-

-

-

-

SupplyDigital Components

Austria . 2,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,036

-

-

-

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UHIMA Technologies

Türkiye . 157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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157

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Overview

Capture stunning images with the KAI-11002-CBA-CD-B2 Image Sensor by Onsemi. Known for their superior quality and reliability, Onsemi delivers top-notch products that excel in various applications. Whether you're in the field of surveillance, automotive, or medical imaging, this sensor offers unmatched performance and precision. With a wide range of features and benefits, including high resolution, low noise, and exceptional dynamic range, the KAI-11002-CBA-CD-B2 promises to elevate your imaging experience to new heights. Trust Onsemi for cutting-edge technology that delivers exceptional results every time.

Feature Benefit Bullets

Pixel Size (um): 9X9

Smaller pixel size allows for higher resolution images with greater detail.

Maximum Supply Voltage: 15.5 V

Allows for flexibility in power supply options and can handle higher voltages for improved performance.

Body Width: 32.64 inch

Wide body width provides stability and durability for the sensor.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality imaging capabilities, making this sensor a good choice for capturing clear and detailed images.

Body Height: 5.97 mm

Low body height allows for compact design and easy integration into various devices.

Package Shape or Style: RECTANGULAR

Rectangular shape enables easy mounting and placement in devices.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage ensures energy efficiency and can operate at lower power levels.

Maximum Operating Temperature: 70 °C

High operating temperature range allows for reliability in various environmental conditions.

Horizontal Pixel: 4008

High horizontal pixel count provides detailed and high-resolution images.

Output Type: DIGITAL VOLTAGE

Digital output allows for easy integration with digital processing systems.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Housing: CERAMIC

Ceramic housing provides durability and protection for the sensor components.

Dynamic Range: 66 dB

High dynamic range ensures accurate capturing of both dark and bright areas in an image.

Vertical Pixel: 2672

High vertical pixel count complements the high horizontal pixel count for detailed images.

Body Length/Diameter: 44.45 mm

Compact body length/diameter allows for easy integration into various devices without taking up too much space.

Data Rate: 28 Mbps

High data rate allows for fast data transfer and processing, making it ideal for high-speed imaging applications.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections for the sensor.

Array Type: INTERLINE

Interline array type allows for efficient image capture and processing.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure and stable mounting in devices.

Technical Specifications

Image Sensors KAI-11002-CBA-CD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 13 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

32.64 inch

Body Height:

5.97 mm

Body Length/Diameter:

44.45 mm

Data Rate:

28 Mbps

Dynamic Range:

66 dB

Horizontal Pixel:

4008

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2672

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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