Loading...

KAI-1010-ABA-CR-AE

Onsemi

KAI-1010-ABA-CR-AE by Onsemi

KAI-1010-ABA-CR-AE by Onsemi is an image sensor with 9x9 um pixel size, 1008 horizontal pixels, and 1018 vertical pixels. It has a dynamic range of 60 dB and spectral response of 400-1000 nm. Ideal for applications requiring high-resolution imaging with analog voltage output, such as industrial machine vision systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

917

-

-

-

-

Vyrian

USA . 503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

503

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,166

-

-

-

-

Problanco Electronics

Mexico . 7,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,083

-

-

-

-

TANS Electronics

Latvia . 5,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,836

-

-

-

-

SupplyDigital Components

Austria . 5,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,200

-

-

-

-

Corphita

USA . 1,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,721

-

-

-

-

UHIMA Technologies

Türkiye . 314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

314

-

-

-

-

Corohmni

South Africa . 267 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

267

-

-

-

-

Overview

Unlock the power of high-quality imaging with the KAI-1010-ABA-CR-AE by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch image sensors that are versatile and reliable. Ideal for a wide range of applications, this image sensor offers exceptional value with its superior performance and precision. Capture stunning visuals with ease and confidence, knowing that you have a trusted product that delivers exceptional results every time. Elevate your imaging experience with the KAI-1010-ABA-CR-AE by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 9X9

Smaller pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage: 15 V

Higher supply voltage ensures optimal performance and allows for flexibility in power options.

Body Width: 20.07 inch

Compact size makes the image sensor suitable for various applications where space is a constraint.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image capture capabilities, making this product a good choice for applications requiring superior image quality.

Package Shape or Style: RECTANGULAR

Rectangular shape is convenient for integration into various devices and systems.

Minimum Supply Voltage: 12 V

Lower minimum supply voltage helps in reducing power consumption while maintaining performance.

Horizontal Pixel: 1008

Higher number of horizontal pixels contribute to greater image clarity and detail.

Output Type: ANALOG VOLTAGE

Analog voltage output facilitates easy interfacing with other systems and devices.

Dynamic Range: 60 dB

Wide dynamic range allows the image sensor to capture both dark and bright areas accurately in the same scene.

Vertical Pixel: 1018

More vertical pixels lead to better image resolution and details in the images captured.

Body Length/Diameter: 30.48 mm

Moderate body length ensures ease of integration and compatibility with different setups.

Spectral Response (nm): 400-1000

Wide spectral response range enables the image sensor to capture a broad range of colors and wavelengths.

Data Rate: 20 Mbps

High data rate allows for fast and efficient transfer of image data, suitable for real-time applications.

Termination Type: SOLDER

Solder termination provides secure connectivity and reliability in various environmental conditions.

Array Type: INTERLINE

Interline array type offers fast readout speeds and reduced image lag, which is beneficial for capturing moving objects.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting ensures secure and stable installation of the image sensor in different devices and systems.

Technical Specifications

Image Sensors KAI-1010-ABA-CR-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 12 MICRO V/ELECTRON

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Height:

3.68 mm

Body Length/Diameter:

30.48 mm

Data Rate:

20 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

1008

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Spectral Response (nm):

400-1000

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

12 V

Termination Type:

SOLDER

Vertical Pixel:

1018

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20