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KAI-04050-ABA-JD-BA

Onsemi

KAI-04050-ABA-JD-BA by Onsemi

KAI-04050-ABA-JD-BA by Onsemi is an image sensor with 5.5x5.5um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates at temperatures ranging from -50 to 70 °C and has a dynamic range of 64 dB. This CCD sensor is ideal for applications requiring high-quality imaging in various environments.

Median Price

$602.445

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$475.610

100+ parts

$447.070

1k+ parts

$418.540

10k+ parts

-

3

$475.610

$447.070

$418.540

-

DigiKey

USA . 3 parts In-Stock

1+ parts

$594.510

100+ parts

-

1k+ parts

-

10k+ parts

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3

$594.510

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-

-

Arrow

USA . 195 parts In-Stock

1+ parts

$610.380

100+ parts

$594.520

1k+ parts

-

10k+ parts

-

195

$610.380

$594.520

-

-

Verical

USA . 195 parts In-Stock

1+ parts

$610.380

100+ parts

$594.520

1k+ parts

-

10k+ parts

-

195

$610.380

$594.520

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 913 parts In-Stock

1+ parts

$525.948

100+ parts

-

1k+ parts

-

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913

$525.948

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-

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Vyrian

USA . 3,665 parts In-Stock

1+ parts

-

100+ parts

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3,665

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$446.230

100+ parts

-

1k+ parts

-

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3

$446.230

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-

-

Corphita

USA . 1,520 parts In-Stock

1+ parts

$498.267

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

$498.267

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-

-

Corohmni

South Africa . 129 parts In-Stock

1+ parts

$553.630

100+ parts

-

1k+ parts

-

10k+ parts

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129

$553.630

-

-

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Problanco Electronics

Mexico . 4,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,789

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SupplyDigital Components

Austria . 4,131 parts In-Stock

1+ parts

-

100+ parts

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4,131

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Kulean Microsystems

USA . 2,966 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,966

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-

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TANS Electronics

Latvia . 2,373 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,373

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-

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UHIMA Technologies

Türkiye . 275 parts In-Stock

1+ parts

-

100+ parts

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275

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Perfect Parts

USA . 7 parts In-Stock

1+ parts

-

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7

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Overview

Capture every detail with the KAI-04050-ABA-JD-BA by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers top-notch quality and reliability. Ideal for a wide range of applications, this image sensor offers unparalleled value, clarity, and precision. Experience the benefits of enhanced imaging performance and seamless integration with this innovative product. Elevate your projects with the KAI-04050-ABA-JD-BA and unlock endless possibilities in imaging technology.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution images, making this sensor suitable for applications where detailed images are required.

Power Supplies (V): 15

The power supply requirement of 15V provides sufficient power for the sensor to operate efficiently and reliably.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Being a CCD image sensor, this product offers high-quality image capture with low noise, making it ideal for applications where image clarity is essential.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into various devices and systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this sensor can withstand high temperatures, making it suitable for use in industrial environments.

Minimum Operating Temperature: -50 °C

The sensor can also operate in extremely low temperatures, down to -50 °C, ensuring reliable performance in a wide range of environments.

Dynamic Range: 64 dB

The sensor's high dynamic range allows it to capture both bright and dark areas in an image accurately, making it versatile for different lighting conditions.

Vertical Pixel: 1752

The high vertical pixel count contributes to the sensor's ability to capture detailed images with excellent clarity and sharpness.

Termination Type: SOLDER

The solder termination type makes it easy to connect the sensor securely to other components in a device or system, ensuring reliable operation.

Array Type: INTERLINE

The interline array type enhances the sensor's speed and efficiency in capturing images, making it suitable for applications that require fast image processing.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process, providing a secure and stable mounting option for the sensor in various applications.

Technical Specifications

Image Sensors KAI-04050-ABA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Dynamic Range:

64 dB

Horizontal Pixel:

2336

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Termination Type:

SOLDER

Vertical Pixel:

1752

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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