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KAI-04050-FBA-JB-B2

Onsemi

KAI-04050-FBA-JB-B2 by Onsemi

KAI-04050-FBA-JB-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates b/w -50 to 70°C, has a dynamic range of 64 dB, and requires a supply voltage of 14.5-15.5 V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various environments.

Median Price

$595.125

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 189 parts In-Stock

1+ parts

$476.100

100+ parts

$447.530

1k+ parts

$418.970

10k+ parts

-

189

$476.100

$447.530

$418.970

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Verical

USA . 151 parts In-Stock

1+ parts

$595.125

100+ parts

$559.413

1k+ parts

-

10k+ parts

-

151

$595.125

$559.413

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-

DigiKey

USA . 189 parts In-Stock

1+ parts

$595.130

100+ parts

-

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-

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189

$595.130

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$490.449

100+ parts

-

1k+ parts

-

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500

$490.449

-

-

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Digiode

USA . 623 parts In-Stock

1+ parts

$526.480

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-

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623

$526.480

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Vyrian

USA . 4,624 parts In-Stock

1+ parts

-

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4,624

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 985 parts In-Stock

1+ parts

$2.270

100+ parts

-

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985

$2.270

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$9.531

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-

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559

$9.531

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-

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Semicontronic

India . 176 parts In-Stock

1+ parts

$471.060

100+ parts

$459.284

1k+ parts

$456.928

10k+ parts

-

176

$471.060

$459.284

$456.928

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Ampacity Inc.

Singapore . 18 parts In-Stock

1+ parts

$471.060

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-

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18

$471.060

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Corohmni

South Africa . 405 parts In-Stock

1+ parts

$480.640

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-

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405

$480.640

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Argo Parts USA

USA . 4,287 parts In-Stock

1+ parts

$490.449

100+ parts

$485.544

1k+ parts

$480.640

10k+ parts

$475.735

4,287

$490.449

$485.544

$480.640

$475.735

Continental Prestige Electronics

USA . 3,790 parts In-Stock

1+ parts

$490.449

100+ parts

-

1k+ parts

-

10k+ parts

$480.640

3,790

$490.449

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-

$480.640

Netroflash

USA . 100 parts In-Stock

1+ parts

$490.449

100+ parts

-

1k+ parts

$465.926

10k+ parts

$456.117

100

$490.449

-

$465.926

$456.117

Corphita

USA . 722 parts In-Stock

1+ parts

$498.771

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722

$498.771

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Problanco Electronics

Mexico . 7,637 parts In-Stock

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7,637

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SupplyDigital Components

Austria . 6,410 parts In-Stock

1+ parts

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6,410

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TANS Electronics

Latvia . 2,963 parts In-Stock

1+ parts

-

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2,963

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UHIMA Technologies

Türkiye . 784 parts In-Stock

1+ parts

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784

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Kulean Microsystems

USA . 337 parts In-Stock

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337

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Kepictronics

USA . 192 parts In-Stock

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192

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Overview

Capture every moment with the KAI-04050-FBA-JB-B2 by Onsemi, a top-of-the-line image sensor designed to deliver unparalleled quality and performance. Manufactured by Onsemi, a trusted name in the industry, this sensor is perfect for a wide range of applications. Whether you're looking to enhance your security system, improve your medical imaging devices, or elevate your photography equipment, this sensor offers exceptional value, benefits, and advantages. Trust the KAI-04050-FBA-JB-B2 to bring your projects to life with clarity and precision like never before.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution images to be captured, making this image sensor suitable for applications where detail is important.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage provides flexibility in power supply options, allowing for compatibility with a range of systems.

Body Width: 20.07 inch

The compact body width makes this image sensor easy to integrate into various devices or systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD sensor type ensures high-quality image capture with low noise, making it ideal for applications where image quality is crucial.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package makes it easy to mount and align, ensuring reliable performance in different setups.

Minimum Supply Voltage: 14.5 V

Having a relatively low minimum supply voltage helps in optimizing power consumption while maintaining stability in operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows this image sensor to be used in various environments without risking damage from overheating.

Horizontal Pixel: 2336

The high number of horizontal pixels contributes to the detailed and sharp image output, making this sensor suitable for demanding imaging tasks.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature range ensures that this image sensor can function reliably even in extreme cold conditions.

Dynamic Range: 64 dB

The wide dynamic range enables the sensor to capture both dark and bright areas within the same scene accurately, leading to high-quality image output.

Vertical Pixel: 1752

The vertical pixel count contributes to the resolution of the image, ensuring clear and detailed pictures are produced with this sensor.

Body Length/Diameter: 33.02 mm

The compact body length/diameter makes this sensor easy to handle and install, enhancing its suitability for various applications.

Termination Type: SOLDER

The solder termination type ensures secure connections, improving the reliability and durability of the sensor in different operating conditions.

Array Type: INTERLINE

The interline array type enables faster readout speeds and improved noise performance, making this sensor a good choice for dynamic imaging applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting option simplifies the installation process, allowing for secure and stable mounting of the sensor in a variety of setups.

Technical Specifications

Image Sensors KAI-04050-FBA-JB-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Length/Diameter:

33.02 mm

Dynamic Range:

64 dB

Horizontal Pixel:

2336

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1752

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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