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KAI-01150-QBA-FD-BA

Onsemi

KAI-01150-QBA-FD-BA by Onsemi

The Onsemi KAI-01150-QBA-FD-BA is a 5.5x5.5 um CCD image sensor with 1280 (H) x 720 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and has a square package style, suitable for surface mount applications in various imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,664 parts In-Stock

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Digiode

USA . 1,624 parts In-Stock

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AZTECH Wire

Italy . 940 parts In-Stock

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$18.970

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Problanco Electronics

Mexico . 6,426 parts In-Stock

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SupplyDigital Components

Austria . 5,323 parts In-Stock

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Kulean Microsystems

USA . 4,107 parts In-Stock

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TANS Electronics

Latvia . 635 parts In-Stock

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Corphita

USA . 584 parts In-Stock

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UHIMA Technologies

Türkiye . 221 parts In-Stock

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Corohmni

South Africa . 188 parts In-Stock

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Overview

Upgrade your imaging experience with the KAI-01150-QBA-FD-BA by Onsemi, a top-of-the-line image sensor that delivers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this sensor is perfect for a wide range of applications. From capturing stunning visuals in low-light conditions to providing crystal-clear images, this sensor offers unmatched value and benefits to customers. Say goodbye to mediocre imaging quality and step up your game with the KAI-01150-QBA-FD-BA.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for higher resolution images to be captured with greater detail.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage ensures reliable operation and flexibility in power supply options.

Body Width: 18.29 inch

Compact body width makes it suitable for applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CCD

The CCD sensor type ensures high-quality image capture with low noise levels.

Body Height: 2.94 mm

Low body height allows for easy integration into various systems or devices.

Package Shape or Style: SQUARE

Square package shape provides stability and ease of mounting.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in saving power and extends battery life in portable devices.

Maximum Operating Temperature: 70 °C

Wide operating temperature range makes it suitable for use in various environments.

Horizontal Pixel: 1280

High horizontal pixel count enables capturing wide-angle images with great clarity.

Minimum Operating Temperature: -50 °C

Ability to withstand very low temperatures makes it suitable for outdoor or industrial applications.

Housing: CERAMIC

Ceramic housing provides durability and better thermal conductivity for efficient heat dissipation.

Dynamic Range: 64 dB

The wide dynamic range allows for capturing images with both bright and dark areas accurately.

Vertical Pixel: 720

High vertical pixel count ensures detailed image capture in the vertical direction.

Body Length/Diameter: 18.29 mm

Compact body length/diameter makes it easy to fit into space-constrained designs.

Optical Format (inch): 1/2

Standard optical format ensures compatibility with various lenses and optical systems.

Termination Type: SOLDER

Solder termination provides strong electrical connections for reliable performance.

Array Type: INTERLINE

Interline array type offers fast readout speeds and reduced blooming effects for improved image quality.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies the installation process and reduces production costs.

Technical Specifications

Image Sensors KAI-01150-QBA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

18.29 inch

Body Height:

2.94 mm

Body Length/Diameter:

18.29 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1280

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/2

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

720

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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