Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CYIL1SM4000AA-GDC by Onsemi is an image sensor with 2048x2048 pixels, 12x12 um pixel size, and a 33 MHz master clock. It operates at temperatures from 0 to 60 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
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UHIMA Technologies
Native Components
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The small pixel size allows for high resolution images to be captured, making this image sensor ideal for detailed imaging applications.
The higher maximum supply voltage provides flexibility in powering the image sensor and allows for stable operation at various input voltages.
The high master clock frequency enables fast data processing and capture, resulting in smoother and more accurate image output.
The compact body width makes this image sensor easy to integrate into various devices and systems without taking up too much space.
Being a CMOS image sensor, it offers low power consumption, high sensitivity, and high speed operation, making it a reliable choice for imaging applications.
The wide output range allows for capturing images in both bright and low light conditions, offering versatility in different lighting environments.
The high dynamic range ensures that the image sensor can accurately capture both dark and bright areas in a scene, resulting in detailed and well-balanced images.
The through hole mounting feature simplifies the installation process and provides a secure and stable connection for the image sensor in various applications.
Image Sensors CYIL1SM4000AA-GDC attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
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Frame Rate:
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Mounting Feature:
Maximum Operating Current:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
B340A-13-F
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
MMBT3904LT1G
Onsemi
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
Rectron
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Baneasa S A
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148WS
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
1554216002
Molex
WIRE AND CABLE;
MT9M413C36STM-DR
The Onsemi MT9M413C36STM-DR is a CMOS image sensor with 12x12 um pixel size, 1280 horizontal pixels, and 1024 vertical pixels. It operates at a max supply voltage of 3.6V and has a master clock of 66 MHz. Ideal for applications requiring high-resolution imaging in environments with temperatures ranging from -5 to 60 °C.
AR0521SR2C09SURA0-DP1
Onsemi's AR0521SR2C09SURA0-DP1 is a 12x12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It features a square package style, solder termination, and 2-wire interface for surface mount applications in various imaging devices.
MT9V022177ATMC
The Onsemi MT9V022177ATMC image sensor features 6x6 um pixel size, 26.6 MHz master clock, and 752x480 resolution. Ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras or industrial machine vision systems.
AR0134CSSC00SPCA0-TPBR
AR0134CSSC00SPCA0-TPBR by Onsemi is an image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70 °C, with a max supply voltage of 1.95V and a frame rate of 60fps. Ideal for applications requiring high-quality imaging in compact devices.
KAI-01050-ABA-FD-BA
KAI-01050-ABA-FD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. It operates b/w -50 to 70 °C and is ideal for digital voltage output applications in cameras or imaging systems.
EV76C560ABT-EQV
Teledyne E2v (Uk)
Teledyne E2v's EV76C560ABT-EQV is a 1280x1024 CMOS image sensor with 5.3um pixel size, operating at -30 to 65°C. It has a digital output range of 0.55-1.25V and supports frame rates up to 60 fps, making it ideal for high-resolution imaging applications in various industries.
KAE-04472-FBA-SD-EE
KAE-04472-FBA-SD-EE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 92 dB. It operates b/w -50 to 60 °C, outputs current, and has a data rate of 40 Mbps. Ideal for applications requiring high-quality imaging at 24 fps frame rate in a rectangular package shape.
KAI-11002-ABA-CD-B1
The Onsemi KAI-11002-ABA-CD-B1 is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates at a supply voltage range of 14.5V to 15.5V, offering a dynamic range of 28 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
NOIV2SN1300A-QDC
NOIV2SN1300A-QDC by Onsemi features 4.80X4.80 um pixel size, 62 MHz master clock, and 1280x1024 resolution. Ideal for image sensing applications due to its CMOS sensor type and 1/2 inch optical format, with a frame rate of 37 fps.
AR0220AT4B00XUD20-E
Onsemi's AR0220AT4B00XUD20-E is a CMOS image sensor with 1828x948 resolution, 1/1.8" optical format, and 60 fps frame rate. It features digital output and a 2-wire interface, making it ideal for high-speed imaging applications in automotive cameras and surveillance systems.
CMV2000-3E5C1CA
Ams Ag
CMV2000-3E5C1CA by Ams Ag is a 2/3-inch CMOS image sensor with 2048x1088 pixels, offering a dynamic range of 90 dB and sensitivity of 5.56 V/lx.s. It operates b/w -30°C to 70°C, has an SPI interface, and supports a frame rate of up to 340 fps. Ideal for applications requiring high-resolution imaging in varying lighting conditions.
MT9V022I77ATM
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-2.90V; Vertical Pixel: 480;
KAI-0330-ABA-CB-BA-DUAL
KAI-0330-ABA-CB-BA-DUAL by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at temperatures ranging from -50 to 70 °C and requires a power supply of 15V. Ideal for applications requiring high-resolution imaging in various environments.
KAE-02150-FBB-JP-FA
KAE-02150-FBB-JP-FA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1920x1080 resolution, and 68 dB dynamic range. Ideal for applications requiring high-quality imaging in industrial settings or surveillance systems due to its superior performance and reliability at a max supply voltage of 6V.
CYII5SC1300AB-QDC
CYII5SC1300AB-QDC by Onsemi is an image sensor with 1280x1024 pixels, 6.7x6.7um pixel size, and 40MHz master clock. It operates b/w -30 to 65 °C, outputs digital voltage from 0.50-2.20V, and has a dynamic range of 64dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
MT9M001C12STC-DR
Onsemi's MT9M001C12STC-DR is a 5.2x5.2 um CMOS image sensor with 1280x1024 resolution, operating at 48 MHz master clock. It offers a dynamic range of 68.2 dB and outputs digital voltage signals via a 2-wire interface. Ideal for applications requiring high-quality imaging at up to 30 fps in a compact square package.
AR0135AT2M25XUEA0-DPBR
Onsemi's AR0135AT2M25XUEA0-DPBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size, offering 54 fps frame rate for high-speed imaging applications. Its square package shape and surface mounting feature make it ideal for compact camera designs in various industries.
KAI-04050-CBA-JB-AE
KAI-04050-CBA-JB-AE by Onsemi is a 5.5x5.5um CCD image sensor with 2336H x 1752V pixels, offering a dynamic range of 64dB. It features an interline array type and solder termination, suitable for applications in digital cameras, machine vision systems, and medical imaging devices.
KAI-08051-QXA-JD-BA
KAI-08051-QXA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in various industries.
AR0521SR2C09SURA0-DR1
Onsemi's AR0521SR2C09SURA0-DR1 is a 12x12mm CMOS image sensor with 2592x1944 pixels, 1/2.5" optical format, and 60fps frame rate. Ideal for high-resolution imaging applications in automotive cameras, drones, and surveillance systems due to its compact size and surface mounting feature.
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CYIL1SC1300AA-GAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Data Rate: 40 Mbps;
CYIL1SC4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Minimum Supply Voltage: 2.25 V;
CYIL1SE0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 3.3 V; Housing: CERAMIC;
CYIL1SE3000AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 31 mm;
CYIL1SM0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Additional Features: ELECTRONIC SNAPSHOT SHUTTER;
CYIL1SM0300AA-WWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC SNAPSHOT SHUTTER; Array Type: FULL FRAME;
CYIL1SM1300AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Maximum Operating Current: 50 mA;
CYIL1SM4000AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Temperature: 60 Cel; Additional Features: ELECTRONIC ROLLING SHUTTER;
CYIL1SM4000AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Master Clock: 33 MHz;
CYIL1SN3000AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 3.465 V; Array Type: FULL FRAME;
CYIL2SC1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1280; Output Interface Type: 3-WIRE INTERFACE;
CYIL2SM1300AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Master Clock: 315 MHz; Horizontal Pixel: 1280;
CYIL2SM1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Optical Format (inch): 1; Body Length/Diameter: 35.5 mm;
CYIL1SE3000AA-BDCES
Infineon Technologies
Image Sensors; Mounting Feature: SURFACE MOUNT; Vertical Pixel: 1710; Power Supplies (V): 2.5; Horizontal Pixel: 1696; Maximum Operating Temperature: 60 Cel;
CYIL1SN3000AA-BDCES
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: 0 Cel; Pixel Size (um): 8X8; Maximum Operating Temperature: 60 Cel; Power Supplies (V): 2.5;
CYIL2SM1300AA-GZWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Pixel Size (um): 14X14; Power Supplies (V): 2.5; Maximum Operating Temperature: 70 Cel; Vertical Pixel: 1024;
CYIL1SM4000AA-GWC
Cypress Semiconductor
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: 0 Cel; Maximum Supply Voltage: 2.75 V;
CYIL1SM4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Output Interface Type: 3-WIRE INTERFACE;
CYIL1SM4000AA-GDCN
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Maximum Operating Current: 50 mA;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Dynamic Range: 66 dB;
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