Loading...

CYIL1SM4000AA-GDC

Onsemi

CYIL1SM4000AA-GDC by Onsemi

CYIL1SM4000AA-GDC by Onsemi is an image sensor with 2048x2048 pixels, 12x12 um pixel size, and a 33 MHz master clock. It operates at temperatures from 0 to 60 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,696

-

-

-

-

Digiode

USA . 402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

402

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

TANS Electronics

Latvia . 3,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,630

-

-

-

-

Problanco Electronics

Mexico . 3,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,028

-

-

-

-

Corphita

USA . 1,854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,854

-

-

-

-

Kulean Microsystems

USA . 1,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,756

-

-

-

-

Northwest PG Solutions

USA . 1,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,433

-

-

-

-

Corohmni

South Africa . 491 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

491

-

-

-

-

UHIMA Technologies

Türkiye . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

332

-

-

-

-

Native Components

USA . 265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

265

-

-

-

-

SupplyDigital Components

Austria . 26 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26

-

-

-

-

Overview

Capture every moment in stunning clarity with the CYIL1SM4000AA-GDC image sensor by Onsemi. As a leader in the industry, Onsemi delivers top-quality products that meet the highest standards. This sensor is perfect for a wide range of applications, from security cameras to medical imaging devices. With its advanced features and reliable performance, the CYIL1SM4000AA-GDC provides unrivaled value and benefits to customers, ensuring they can capture every detail with ease. Trust Onsemi for all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 12X12

The small pixel size allows for high resolution images to be captured, making this image sensor ideal for detailed imaging applications.

Maximum Supply Voltage: 2.75 V

The higher maximum supply voltage provides flexibility in powering the image sensor and allows for stable operation at various input voltages.

Master Clock: 33 MHz

The high master clock frequency enables fast data processing and capture, resulting in smoother and more accurate image output.

Body Width: 42 inch

The compact body width makes this image sensor easy to integrate into various devices and systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

Being a CMOS image sensor, it offers low power consumption, high sensitivity, and high speed operation, making it a reliable choice for imaging applications.

Output Range: -0.50-3.80V

The wide output range allows for capturing images in both bright and low light conditions, offering versatility in different lighting environments.

Dynamic Range: 66 dB

The high dynamic range ensures that the image sensor can accurately capture both dark and bright areas in a scene, resulting in detailed and well-balanced images.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature simplifies the installation process and provides a secure and stable connection for the image sensor in various applications.

Technical Specifications

Image Sensors CYIL1SM4000AA-GDC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC SHUTTER

Array Type:

FULL FRAME

Body Width:

42 inch

Body Height:

3.25 mm

Body Length/Diameter:

42 mm

Data Rate:

66 Mbps

Dynamic Range:

66 dB

Frame Rate:

15 fps

Horizontal Pixel:

2048

Housing:

CERAMIC

Master Clock:

33 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

0.96

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

12X12

Sensitivity (V/lx.s):

11.61 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20