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CYIL1SM4000AA-GBC

Onsemi

CYIL1SM4000AA-GBC by Onsemi

CYIL1SM4000AA-GBC by Onsemi is a 12x12 um CMOS image sensor with 66 MHz master clock. It operates b/w 0-60 °C and has a dynamic range of 66 dB. Ideal for full-frame array applications, offering analog voltage output via a 3-wire interface at 15 fps frame rate.

Median Price

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Lifecycle Status

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In-Stock Inventory

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Digiode

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Vyrian

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Native Components

USA . 201 parts In-Stock

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$24.050

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Northwest PG Solutions

USA . 750 parts In-Stock

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Kulean Microsystems

USA . 6,650 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 1,954 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

Mexico . 600 parts In-Stock

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UHIMA Technologies

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Corohmni

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Overview

Elevate your imaging experience with the CYIL1SM4000AA-GBC by Onsemi. Crafted by a trusted manufacturer, this cutting-edge image sensor offers unrivaled quality and reliability. Ideal for a diverse range of applications, this sensor delivers exceptional performance and precision. From capturing stunning visuals to enhancing security systems, this product is designed to meet all your imaging needs. Experience the value and benefits of superior technology with the CYIL1SM4000AA-GBC by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 12X12

Smaller pixel size allows for higher resolution images to be captured, resulting in clearer and more detailed pictures.

Maximum Supply Voltage: 2.5 V

Higher supply voltage allows for greater flexibility in powering the image sensor, ensuring reliable performance in various applications.

Master Clock: 66 MHz

High master clock frequency enables fast data processing and high-speed image capturing, making it suitable for applications requiring real-time image processing.

Body Width: 42 inch

Compact body width allows for easy integration into different devices and systems, making it versatile for use in a wide range of applications.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors are known for their low power consumption, high sensitivity, and excellent image quality, making them a popular choice for various imaging applications.

Body Height: 3.57 mm

Low body height allows for a slim and compact design, making the image sensor suitable for use in small and portable devices.

Package Shape or Style: SQUARE

Square package shape provides easy handling and mounting options, ensuring compatibility with standard mounting techniques and reducing installation complexity.

Minimum Supply Voltage: 1 V

Low minimum supply voltage helps in reducing power consumption and extends the battery life of devices using the image sensor.

Maximum Operating Temperature: 60 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions, making it suitable for outdoor and industrial applications.

Output Type: ANALOG VOLTAGE

Analog voltage output provides compatibility with a wide range of systems and devices, allowing for easy integration and data processing.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the image sensor can function in cold environments, making it suitable for applications in extreme weather conditions.

Housing: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired housing provides excellent protection against environmental factors and ensures durability in harsh operating conditions.

Dynamic Range: 66 dB

High dynamic range allows the image sensor to capture both bright and dark areas in a scene with good detail and minimal loss of information.

Body Length/Diameter: 42 mm

Compact body length/diameter enables easy installation and integration into various devices and systems, making it suitable for space-constrained applications.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection, ensuring stable performance and reducing the risk of signal loss or interference.

Output Interface Type: 3-WIRE INTERFACE

3-wire interface simplifies connectivity and data transfer, allowing for easy integration with other components and systems for seamless operation.

Frame Rate: 15 fps

Moderate frame rate of 15 frames per second allows for smooth and clear video recording and playback, making it suitable for applications requiring real-time imaging.

Array Type: FULL FRAME

Full frame array type ensures the image sensor captures the entire image in one frame, providing accurate and comprehensive image data for analysis and processing.

Sensitivity (V/lx.s): 11.61 V/lx.s

High sensitivity allows the image sensor to capture clear and detailed images even in low-light conditions, making it suitable for low-light imaging applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides easy and secure installation, ensuring stable positioning of the image sensor in various devices and systems.

Technical Specifications

Image Sensors CYIL1SM4000AA-GBC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FULL FRAME

Body Width:

42 inch

Body Height:

3.57 mm

Body Length/Diameter:

42 mm

Dynamic Range:

66 dB

Frame Rate:

15 fps

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

66 MHz

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

3-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

12X12

Sensitivity (V/lx.s):

11.61 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

2.5 V

Minimum Supply Voltage:

1 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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