Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi MT9P401I12STC-DP1 is a CMOS image sensor with 2.2x2.2 um pixel size, offering 2592x1944 resolution and 70.1 dB dynamic range. It operates at 48 MHz master clock, suitable for applications requiring high-quality digital imaging in a compact form factor.
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Vyrian
Digiode
AZTECH Wire
$15.160
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Problanco Electronics
TANS Electronics
Corphita
Kulean Microsystems
UHIMA Technologies
Corohmni
Small pixel size allows for high resolution imaging and low noise performance.
Efficient power consumption and compatibility with various power sources.
High-speed operation for quick image processing and data transfer.
Compact size for easy integration into various devices.
CMOS technology provides low power consumption and high sensitivity.
Slim profile for space-constrained applications.
Standard square package for easy mounting and handling.
Flexible voltage requirements for versatile operation.
Wide temperature range for operation in various environments.
High resolution for detailed imaging and precise data capture.
Stable output current for consistent performance.
Digital output for easy interfacing with other digital devices.
Low temperature operation for use in extreme conditions.
Low power consumption for energy-efficient operation.
Wide dynamic range for capturing both dark and bright areas in an image.
High resolution in both horizontal and vertical dimensions.
Compact size for easy installation and integration.
Broad spectral response for capturing various colors and light intensities.
Standard optical format for compatibility with different lenses.
High data rate for quick transmission of image data.
Secure solder termination for reliable connection.
Simple 2-wire interface for easy connection to other devices.
High frame rate for smooth video recording and motion capture.
Full-frame array for capturing the entire image in one shot.
High sensitivity for low-light imaging and accurate color reproduction.
Surface mount capability for easy and secure mounting on PCBs.
Image Sensors MT9P401I12STC-DP1 attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensitivity (V/lx.s):
Sensors or Transducers Type:
Spectral Response (nm):
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 09/Oct/2020
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BAV99
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Deltrol Controls
Other Relays;
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Sangdest Microelectronics (Nanjing)
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
General Instrument
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Multicomp Pro
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sensitron Semiconductor
LM7805CT/NOPB
Texas Instruments
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Micro Commercial Components
General Semiconductor
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
TC241-22
TC241-22 by Texas Instruments is an image sensor with 754x244 pixels, 11.5X27um size, and operates at -10 to 45 °C. It requires a 12V power supply and features THROUGH HOLE MOUNT. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
ASX340AT3C00XPED0-TPBR
ASX340AT3C00XPED0-TPBR by Onsemi is an image sensor with 5.6x5.6 um pixel size, 27 MHz master clock, and 1/4 inch optical format. It operates b/w -40 to 105 °C and has a digital voltage output range of 0.84-1.96V. Ideal for applications requiring high-resolution imaging at a frame rate of 60 fps in a compact square package design for surface mount installation.
TC245-10
IMAGE SENSOR,CCD;
KAI-08050-AAA-JP-AE
KAI-08050-AAA-JP-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. This rectangular package sensor in 4/3 inch optical format is ideal for applications requiring high-quality imaging such as industrial machine vision and surveillance systems.
KAI-4011M
The Onsemi KAI-4011M is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V and outputs analog voltage signals. Ideal for applications requiring high-resolution imaging with precise color reproduction and low noise levels.
AR0238CSSC12SHRA0-DR1
Onsemi's AR0238CSSC12SHRA0-DR1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at 48 MHz master clock, offers a dynamic range of 96 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.
KAI-02150-AAA-JP-BA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
KAF-0402-AAA-CB-AE
The Onsemi KAF-0402-AAA-CB-AE is a CCD image sensor with 9x9 um pixel size, offering 768 horizontal and 512 vertical pixels. It operates at a supply voltage range of 14.75V to 15.5V, providing a dynamic range of 76 dB. This rectangular package sensor has a data rate of 10 Mbps and is suitable for full-frame imaging applications.
KAE-04471-ABA-JP-EE
KAE-04471-ABA-JP-EE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal pixels, and 2096 vertical pixels. It operates b/w -30 to 40 °C with a dynamic range of 72 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings at a max supply voltage of 15.3 V and min supply voltage of 14.7 V.
AR0134CSSM25SUEA0-DPBR
AR0134CSSM25SUEA0-DPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and has a master clock frequency of 50MHz. Ideal for applications requiring high-resolution imaging in compact devices due to its small body dimensions and surface mounting feature.
AR0135AT2M00XUEA0-TPBR
The Onsemi AR0135AT2M00XUEA0-TPBR is a 1/3-inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and features a digital output interface, making it suitable for applications requiring high-resolution imaging at up to 54 fps.
KAI-4021-CBA-CD-BA
KAI-4021-CBA-CD-BA by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and low-light performance. The sensor comes in a rectangular ceramic housing with through-hole mounting, offering a data rate of 40 Mbps.
NOM02A6-AR25G
NOM02A6-AR25G by Onsemi is a CMOS image sensor with a supply voltage range of 4.5V to 5.5V and operates b/w 0 °C to 50°C. It outputs analog voltage in the range of 0.90-1.1V, making it suitable for applications requiring precise image capture in various environments such as industrial automation and surveillance systems.
AR0239ATSC00XUEA0-DRBR
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
KAI-1020M
AR0220AT4B00XUEA2-DRBR
Onsemi's AR0220AT4B00XUEA2-DRBR is a 1/1.8 inch CMOS image sensor with 1828x948 pixels, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor provides high-quality imaging solutions in compact devices.
KAF-50100-ABA-JP-BA
The Onsemi KAF-50100-ABA-JP-BA is a CCD image sensor with 6x6 um pixel size, offering a max supply voltage of 15.5V and a dynamic range of 70.2 dB. Ideal for applications requiring high-resolution imaging in environments with temperatures ranging from 0 to 60 °C, such as scientific research or industrial inspection systems.
NOIP1SE5000A-QTI
NOIP1SE5000A-QTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592x2048 pixels, offering a dynamic range of 60 dB and sensitivity of 7.5 V/lx.s. It operates b/w -40 to 85 °C, has a max supply voltage of 1.9 V, and supports a frame rate of up to 100 fps. Ideal for applications requiring high-resolution imaging in various lighting conditions.
AR0135CS2C19SUEA0-DRBR
The Onsemi AR0135CS2C19SUEA0-DRBR is a 1/3 inch CMOS image sensor with a square package style. It features dimensions of 9mm x 9mm x 1.55mm and uses Tin/Silver/Copper terminal finish for soldering. Ideal for surface mount applications, this sensor offers high-quality imaging capabilities in a compact form factor.
KAI-02050-AAA-JR-BA
Onsemi's KAI-02050-AAA-JR-BA is a 5.5x5.5 um CCD image sensor with 1600H x 1200V pixels, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and is ideal for digital imaging applications requiring high-quality output in a compact rectangular package.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MT9P031I12STM-DP1
MT9P031I12STM-DP1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 pixels, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at frame rates up to 14 fps in a compact square package suitable for surface mounting.
MT9P031I12STM-DP
Onsemi's MT9P031I12STM-DP is a 2.2x2.2um CMOS image sensor with 2592Hx1944V pixels, offering a dynamic range of 70.1dB and operating at temperatures from -30 to 70°C. It has a digital voltage output interface, operates on 1.7-1.9V supply voltage, and is suitable for frame array applications in various industries like surveillance and automotive systems.
MT9P031I12STC-DP
MT9P031I12STC-DP by Onsemi is an image sensor with 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring a square CMOS image sensor with a digital voltage output interface and frame array type at temperatures ranging from -30 to 70 °C.
MT9P031I12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Minimum Operating Temperature: -30 Cel;
MT9P031I12STC-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Master Clock: 96 MHz;
MT9P031I12STM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Array Type: FULL FRAME;
MT9P031I12STC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Maximum Supply Voltage: 1.9 V;
MT9P031I12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Horizontal Pixel: 2592;
MT9P031I12STC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Pixel Size (um): 2.2X2.2;
MT9P031I12STM-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Horizontal Pixel: 2592;
MT9P031I12STC
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC ROLLING SHUTTER, GLOBAL RESET RELEASE, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.6-3.1V; Horizontal Pixel: 2592; Output Interface Type: 2-WIRE INTERFACE;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Body Height: 1.25 mm;
MT9P001I12STC-B-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Maximum Operating Current: 35 mA; Pixel Size (um): 2.20X2.20;
MT9P006I12STCU-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Termination Type: SOLDER;
MT9P001I12-N4005-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Master Clock: 48 MHz; Array Type: FRAME;
MT9P011D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Maximum Supply Voltage: 1.9 V; Vertical Pixel: 1944;
MT9P031D00STMC18BC1-200
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Output Range: 0.35-2.30V; Array Type: FRAME; Maximum Supply Voltage: 1.9 V;
MT9P014D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Optical Format (inch): 1/2.5; Frame Rate: 15 fps;
MT9P006I12STCU
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Minimum Supply Voltage: 1.7 V;
Supply Digital Components
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12,000 In-Stock
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