Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-08050-AAA-JP-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. This rectangular package sensor in 4/3 inch optical format is ideal for applications requiring high-quality imaging such as industrial machine vision and surveillance systems.
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UHIMA Technologies
This product offers a small pixel size, allowing for high resolution and detailed images to be captured.
CCD sensors are known for their high-quality image capture and low noise, making this product ideal for demanding imaging applications.
The rectangular package shape makes it easy to integrate this image sensor into various devices and systems.
With a high horizontal pixel count, this image sensor can capture wide and detailed images with precision.
The high dynamic range of this image sensor allows for capturing both bright and dark areas in an image accurately, resulting in high-quality outputs.
The vertical pixel count contributes to the overall resolution and detail that can be captured by this image sensor.
The 4/3 optical format is commonly used in digital cameras, providing compatibility and versatility for various imaging applications.
The solder termination type ensures a secure and reliable connection, making the installation process easier and more efficient.
The interline array type helps in reducing the blooming effect and improving the overall image quality, especially in high-speed imaging scenarios.
The through-hole mounting feature offers a sturdy and stable installation option, ensuring the image sensor stays securely in place during operation.
Image Sensors KAI-08050-AAA-JP-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Dynamic Range:
Horizontal Pixel:
Mounting Feature:
Optical Format (inch):
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
LL4148
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
LM317T/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
1N4148WS
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
LM107H/883
Texas Instruments
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
BAV99WT1G
Onsemi
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Weitronic Enterprise
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Taitron Components
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LM107H/883C
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
KAI-29050-AAA-JP-B2
Onsemi's KAI-29050-AAA-JP-B2 is a 5.5x5.5 um CCD image sensor with 6576 (H) x 4384 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C, with data rate of 40 Mbps and frame rate of 4 fps. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.
KAF-8300-AXC-CP-AA
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Pixel Size (um): 5.4X5.4;
MT9P031I12STC
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Body Height: 1.25 mm;
LC9945
The Onsemi LC9945 is an image sensor with 258Hx299V pixels, 9.7X6.2um pixel size, and operates at -10 to 55 °C. It requires a 15V power supply. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAI-1003-ABA-CD-B2
KAI-1003-ABA-CD-B2 by Onsemi is an image sensor with 12.8X12.8 um pixel size, 1024 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w 0 to 40 °C and has a supply voltage range of 14.5V to 15.5V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various industries.
KAI-2001M
Image Sensors;
TC215-50
TC215-50 by Texas Instruments is an image sensor with 12x12 um pixel size, 1000 horizontal pixels, and 1018 vertical pixels. It operates at temperatures from -10 to 40 °C and requires a 12V power supply. Ideal for applications requiring high-resolution imaging in various environments.
KAI-08050-PBA-JD-AE
KAI-08050-PBA-JD-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. This rectangular package sensor in 4/3 inch optical format is ideal for applications requiring high-quality imaging such as industrial machine vision and surveillance systems.
MT9T031C12STC-DP
Onsemi's MT9T031C12STC-DP is a 3.20x3.20 um CMOS image sensor with 2048H x 1536V pixels, offering a dynamic range of 61 dB and operating at a max clock speed of 48 MHz. This sensor, housed in ceramic, features a digital voltage output interface and is ideal for applications requiring high-resolution imaging at up to 12 fps.
KAI-11002-CBA-CD-AE
KAI-11002-CBA-CD-AE by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for digital imaging applications requiring high-resolution and low-light performance.
KAF-1603-ABA-CD-B2
The Onsemi KAF-1603-ABA-CD-B2 is a CCD image sensor with 9x9 um pixel size, offering 1536 horizontal and 1024 vertical pixels. It operates b/w -60 to 60 °C, with a dynamic range of 74 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR0135CS2C00SUD20
The Onsemi AR0135CS2C00SUD20 is a 1/3 inch CMOS image sensor with 1280x960 resolution. It operates at -30 to 70 °C, with a pixel size of 3.75μm and a max supply voltage of 1.95V. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
AR0135CS2M00SUEA0-DRBR1
Onsemi's AR0135CS2M00SUEA0-DRBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a dynamic range of 71.1 dB and operating at temperatures from -30 to 70°C. With a max supply voltage of 1.95V and output interface type of 2-WIRE INTERFACE, it is ideal for applications requiring high-resolution imaging at up to 54 fps.
AR0132AT6R00XPEA0-TRBR
Onsemi's AR0132AT6R00XPEA0-TRBR is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. It operates at -40 to 105 °C, has a max supply voltage of 1.95V, and uses a digital output interface. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAI-43140-AXA-JD-AE
Onsemi's KAI-43140-AXA-JD-AE is a 4.5x4.5 um CCD image sensor with 8040 (H) x 5360 (V) pixels, offering a dynamic range of 60 dB. Operating b/w -50 to 70 °C, it has a data rate of 60 Mbps and is ideal for high-resolution imaging applications in industrial and scientific fields.
KAI-08051-FBA-JB-B2
KAI-08051-FBA-JB-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 3364 horizontal pixels, and 2520 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-1003-AAA-CR-B2
KAI-1003-AAA-CR-B2 by Onsemi is an image sensor with 1024x1024 pixels, 12.8um pixel size, and 72dB dynamic range. It operates b/w 0 to 40°C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-quality imaging in various environments.
VSP7502ZWVR
VSP7502ZWVR by Texas Instruments is an 8mm square CCD image sensor with a supply voltage range of 1.65-1.95V, operating temperature from -25 to 85°C, and digital output voltage of 1.50-2.10V. Ideal for applications requiring precise imaging in compact devices due to its small form factor and surface mounting feature.
KLI-2104-DAA-ED-AA
KLI-2104-DAA-ED-AA by Onsemi is an image sensor with 2098 horizontal pixels and a pixel size of 14x7 um. It operates at temperatures ranging from -25 to 80 °C, with a dynamic range of 80 dB. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging in various environments.
KAI-29050-AXA-JD-B2
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Dynamic Range: 64 dB; Vertical Pixel: 4384; Pixel Size (um): 5.5X5.5; Optical Format (inch): 4/2.99;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-02150-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 2/3; Pixel Size (um): 5.5X5.5; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: -50 Cel; Minimum Supply Voltage: 14.5 V;
KAI-02150-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64 dB; Maximum Operating Temperature: 70 Cel; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Optical Format (inch): 2/3;
Onsemi's KAI-02150-ABA-JD-BA is a 2/3" CCD image sensor with 1920x1080 resolution, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70°C, suitable for industrial cameras and machine vision applications.
KAI-04050-FBA-JB-B2
KAI-04050-FBA-JB-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates b/w -50 to 70°C, has a dynamic range of 64 dB, and requires a supply voltage of 14.5-15.5 V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various environments.
KAI-02150-AAA-JP-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel; Dynamic Range: 64 dB;
KAI-01150-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Dynamic Range: 64 dB; Array Type: INTERLINE;
KAI-01050-FBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Width: 18.29 inch; Housing: CERAMIC; Horizontal Pixel: 1024;
KAI-01150-CBA-JB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33.02 mm; Array Type: INTERLINE;
KAI-01150-ABA-JD-BA
KAI-01050-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 5.5X5.5; Maximum Operating Temperature: 70 Cel;
KAI-01150-CBA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Body Length/Diameter: 18.29 mm;
KAI-01050-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: INTERLINE;
KAI-01150-CBA-JB-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Optical Format (inch): 1/2;
KAI-01050-ABA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Minimum Operating Temperature: -50 Cel;
KAI-01050-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel;
KAI-01050-FBA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Maximum Supply Voltage: 15.5 V; Termination Type: SOLDER;
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