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TC277-10

Texas Instruments

TC277-10 by Texas Instruments

TC277-10 by Texas Instruments is an image sensor with 699x288 pixels, 9.2x16.8um size, and operates at -30 to 85°C. It requires a 12V power supply and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in varying temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,256 parts In-Stock

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5,256

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Digiode

USA . 3,529 parts In-Stock

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3,529

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,620 parts In-Stock

1+ parts

$1.971

100+ parts

-

1k+ parts

$2.504

10k+ parts

-

1,620

$1.971

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$2.504

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DigiPath Technology Company

USA . 20 parts In-Stock

1+ parts

$2.171

100+ parts

$1.997

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-

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20

$2.171

$1.997

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IDEA Electronic Components Group

UK . 1,000 parts In-Stock

1+ parts

$2.215

100+ parts

-

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$1.994

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1,000

$2.215

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$1.994

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ChromeModa Solutions

Germany . 311 parts In-Stock

1+ parts

$2.215

100+ parts

$1.816

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-

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311

$2.215

$1.816

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AZTECH Wire

Italy . 850 parts In-Stock

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$4.948

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850

$4.948

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Ampacity Inc.

Singapore . 563 parts In-Stock

1+ parts

$10.750

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563

$10.750

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Semicontronic

India . 521 parts In-Stock

1+ parts

$44.750

100+ parts

$43.631

1k+ parts

$43.408

10k+ parts

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521

$44.750

$43.631

$43.408

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One Stop Electronics

USA . 964 parts In-Stock

1+ parts

$52.750

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964

$52.750

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Corphita

USA . 1,450 parts In-Stock

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1,450

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Corohmni

South Africa . 400 parts In-Stock

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400

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Overview

Unleash the power of high-quality imaging with the TC277-10 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and reliability. The TC277-10 is perfect for applications in image sensors, offering superior pixel size and resolution. With a wide operating temperature range and easy mounting feature, this product provides exceptional value and benefits for customers looking to enhance their imaging capabilities. Elevate your projects to the next level with the TC277-10 from Texas Instruments.

Feature Benefit Bullets

Pixel Size (um): 9.2X16.8

The small pixel size allows for high resolution images to be captured, making this sensor ideal for applications requiring detailed image quality.

Power Supplies (V): 12

The 12V power supply requirement is common and easily accessible, ensuring compatibility with most systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this sensor to be used in a wide range of environments without risk of overheating.

Horizontal Pixel: 699

With 699 horizontal pixels, this sensor can capture wide images with great detail, making it suitable for panoramic or landscape photography.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures that this sensor can still function effectively in cold environments without any issues.

Vertical Pixel: 288

With 288 vertical pixels, this sensor can capture images with good depth and clarity, making it suitable for various types of photography.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mount feature allows for easy and secure installation of the sensor in a wide range of equipment, ensuring stability and reliability.

Technical Specifications

Image Sensors TC277-10 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Horizontal Pixel:

699

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Pixel Size (um):

9.2X16.8

Power Supplies (V):

12

Sub-Category:

CCD Image Sensors

Vertical Pixel:

288

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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