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AR0330CM1C00SHAA0-DR

Onsemi

AR0330CM1C00SHAA0-DR by Onsemi

The Onsemi AR0330CM1C00SHAA0-DR is a 1/3-inch CMOS image sensor with 2304x1296 pixels. It operates at a max supply voltage of 1.9V and offers a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging, such as surveillance cameras and industrial machine vision systems.

Median Price

$7.974

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48,346 parts In-Stock

1+ parts

-

100+ parts

$11.410

1k+ parts

$10.210

10k+ parts

$9.610

48,346

-

$11.410

$10.210

$9.610

Verical

USA . 27,666 parts In-Stock

1+ parts

-

100+ parts

$14.262

1k+ parts

$12.762

10k+ parts

$12.012

27,666

-

$14.262

$12.762

$12.012

Flip Electronics (Authorized)

USA . 18,076 parts In-Stock

1+ parts

-

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18,076

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DigiKey

USA . 9,475 parts In-Stock

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$1.730

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9,475

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$1.730

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Arrow

USA . 204 parts In-Stock

1+ parts

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10k+ parts

$4.538

204

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$4.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,785 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,785

$1.730

-

-

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Digiode

USA . 1,715 parts In-Stock

1+ parts

$12.074

100+ parts

-

1k+ parts

-

10k+ parts

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1,715

$12.074

-

-

-

Flip Electronics

USA . 18,076 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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18,076

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VNN

France . 1,000 parts In-Stock

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1,000

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14,808 parts In-Stock

1+ parts

$1.470

100+ parts

-

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-

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14,808

$1.470

-

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Modulus Dynamics

Lithuania . 415 parts In-Stock

1+ parts

$1.597

100+ parts

$1.597

1k+ parts

$1.597

10k+ parts

-

415

$1.597

$1.597

$1.597

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Corohmni

South Africa . 250 parts In-Stock

1+ parts

$1.730

100+ parts

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250

$1.730

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Corphita

USA . 934 parts In-Stock

1+ parts

$11.439

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934

$11.439

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SupplyDigital Components

Austria . 7,614 parts In-Stock

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7,614

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TANS Electronics

Latvia . 6,626 parts In-Stock

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6,626

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Continental Prestige Electronics

USA . 2,503 parts In-Stock

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2,503

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Argo Parts USA

USA . 2,457 parts In-Stock

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2,457

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Problanco Electronics

Mexico . 1,258 parts In-Stock

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1,258

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Kulean Microsystems

USA . 817 parts In-Stock

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817

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UHIMA Technologies

Türkiye . 544 parts In-Stock

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544

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the unparalleled quality and performance of the AR0330CM1C00SHAA0-DR image sensor by Onsemi. With a cutting-edge design and advanced technology, this sensor is perfect for a wide range of applications in industries such as automotive, security, and consumer electronics. Onsemi's reputation for reliability and innovation ensures that you are getting a top-notch product that will exceed your expectations. Experience the value and benefits of this sensor, from its high sensitivity to its wide dynamic range, and unlock endless possibilities for your projects. Choose the AR0330CM1C00SHAA0-DR and elevate your imaging solutions to the next level.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Smaller pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 1.9 V

Allows for efficient power usage and compatibility with various systems.

Master Clock: 27 MHz

Provides high-speed data processing for fast imaging.

Body Width: 11.43 inch

Compact size making it suitable for applications with limited space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for low power consumption and high image quality.

Body Height: 2.275 mm

Low profile design for easy integration into various devices.

Package Shape or Style: SQUARE

Square shape makes it easy to mount and align in systems.

Minimum Supply Voltage: 1.7 V

Allows for operation in low power environments.

Maximum Operating Temperature: 70 °C

Suitable for use in various environmental conditions.

Horizontal Pixel: 2304

High pixel count provides detailed images.

Output Range: 0.40-1.40V

Wide output range for versatile use in different applications.

Output Type: DIGITAL VOLTAGE

Digital output simplifies data processing and transmission.

Minimum Operating Temperature: -30 °C

Can operate in cold temperatures without performance issues.

Maximum Operating Current: 137 mA

Efficient current consumption for longer battery life.

Housing: CERAMIC

Durable ceramic housing for reliable performance and protection.

Dynamic Range: 69.5 dB

Wide dynamic range captures details in both bright and dark areas.

Vertical Pixel: 1296

Enhances image quality and resolution in vertical direction.

Body Length/Diameter: 11.43 mm

Compact size for easy integration into devices.

Optical Format (inch): 1/3

Standard optical format for compatibility with various lenses.

Termination Type: SOLDER

Secure soldered connections for reliable operation.

Output Interface Type: 2-WIRE INTERFACE

Simple 2-wire interface for easy connection to control systems.

Frame Rate: 60 fps

High frame rate for smooth and clear video capture.

Array Type: FRAME

Frame array design for efficient image capture and processing.

Sensitivity (V/lx.s): 2 V/lx.s

High sensitivity for improved low-light performance.

Mounting Feature: SURFACE MOUNT

Surface mountable for easy and secure installation in devices.

Technical Specifications

Image Sensors AR0330CM1C00SHAA0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.7-2.9V

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.275 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

69.5 dB

Frame Rate:

60 fps

Horizontal Pixel:

2304

Housing:

CERAMIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

137 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

2 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1296

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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