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AR0330CM1C12SHAA0-DP

Onsemi

AR0330CM1C12SHAA0-DP by Onsemi

Onsemi's AR0330CM1C12SHAA0-DP is a 1/3 inch CMOS image sensor with 2.2x2.2 um pixel size, offering a max supply voltage of 1.9V and a master clock of 27 MHz. Ideal for applications requiring high-resolution imaging at up to 60 fps, such as surveillance cameras and industrial machine vision systems.

Median Price

$7.360

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,696 parts In-Stock

1+ parts

-

100+ parts

$7.320

1k+ parts

$7.320

10k+ parts

$7.320

8,696

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$7.320

$7.320

$7.320

Rochester

USA . 1,082 parts In-Stock

1+ parts

-

100+ parts

$7.360

1k+ parts

$6.590

10k+ parts

$6.200

1,082

-

$7.360

$6.590

$6.200

Verical

USA . 1,082 parts In-Stock

1+ parts

-

100+ parts

$9.200

1k+ parts

$8.238

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1,082

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$9.200

$8.238

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Flip Electronics (Authorized)

USA . 1,032 parts In-Stock

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1,032

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Distributors (In-Stock)

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Vyrian

USA . 686 parts In-Stock

1+ parts

$7.320

100+ parts

-

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686

$7.320

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Digiode

USA . 1,857 parts In-Stock

1+ parts

$7.790

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1,857

$7.790

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Flip Electronics

USA . 1,032 parts In-Stock

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1,032

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 220 parts In-Stock

1+ parts

$7.320

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220

$7.320

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Corphita

USA . 1,244 parts In-Stock

1+ parts

$7.380

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1,244

$7.380

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Native Components

USA . 933 parts In-Stock

1+ parts

$249.007

100+ parts

$244.027

1k+ parts

$241.537

10k+ parts

$239.047

933

$249.007

$244.027

$241.537

$239.047

Northwest PG Solutions

USA . 755 parts In-Stock

1+ parts

$273.908

100+ parts

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755

$273.908

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Problanco Electronics

Mexico . 7,883 parts In-Stock

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TANS Electronics

Latvia . 7,569 parts In-Stock

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SupplyDigital Components

Austria . 5,716 parts In-Stock

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5,716

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Kulean Microsystems

USA . 5,481 parts In-Stock

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5,481

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Continental Prestige Electronics

USA . 1,082 parts In-Stock

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$6.960

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1,082

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$6.960

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UHIMA Technologies

Türkiye . 845 parts In-Stock

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845

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Overview

Unlock the power of crystal-clear imaging with the AR0330CM1C12SHAA0-DP by Onsemi. Crafted by a leading manufacturer in image sensors, this cutting-edge technology offers unparalleled performance and reliability. Ideal for a wide range of applications, this sensor delivers stunning image quality with every capture. Elevate your projects with the value and benefits that only Onsemi can provide. Experience the difference today!

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Small pixel size allows for higher resolution images with finer details

Maximum Supply Voltage: 1.9 V

Lower maximum supply voltage helps in reducing power consumption and heat generation

Master Clock: 27 MHz

High master clock frequency enables fast data processing and high frame rates

Body Width: 11.43 inch

Compact body width makes the sensor suitable for applications with space constraints

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology offers low power consumption and high integration capabilities

Body Height: 2.275 mm

Low profile body height allows for easy integration into compact devices

Package Shape or Style: SQUARE

Square package shape provides uniform mounting options and easy alignment

Minimum Supply Voltage: 1.7 V

Lower minimum supply voltage ensures stable operation even in low power scenarios

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for usage in various environmental conditions

Horizontal Pixel: 2304

High horizontal pixel count offers detailed and sharp images

Output Range: 0.40-1.40V

Wide output voltage range provides flexibility in signal processing and integration

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies data processing and reduces noise interference

Minimum Operating Temperature: -30 °C

Wide temperature range ensures reliable operation even in extreme cold conditions

Maximum Operating Current: 137 mA

Low operating current helps in reducing power consumption and heat dissipation

Housing: CERAMIC

Ceramic housing provides high durability and thermal stability

Dynamic Range: 69.5 dB

High dynamic range allows for capturing both bright and dark areas with detail

Vertical Pixel: 1296

Good vertical pixel count offers balanced image resolution

Body Length/Diameter: 11.43 mm

Compact body size makes the sensor suitable for small form factor devices

Optical Format (inch): 1/3

Standard optical format for compatibility with various camera systems

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and data transmission

Frame Rate: 60 fps

High frame rate enables smooth and fluid video recording capabilities

Array Type: FRAME

Frame array type offers efficient image capture and processing

Sensitivity (V/lx.s): 2 V/lx.s

High sensitivity allows for better performance in low light conditions

Mounting Feature: SURFACE MOUNT

Surface mount feature simplifies installation and ensures secure positioning

Technical Specifications

Image Sensors AR0330CM1C12SHAA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.7-2.9V

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.275 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

69.5 dB

Frame Rate:

60 fps

Horizontal Pixel:

2304

Housing:

CERAMIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

137 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

2 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1296

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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