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AR0238CSSC12SPRA0-DR1

Onsemi

AR0238CSSC12SPRA0-DR1 by Onsemi

Onsemi's AR0238CSSC12SPRA0-DR1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at 48 MHz master clock, offers a dynamic range of 96 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive cameras and surveillance systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,524 parts In-Stock

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Digiode

USA . 2,440 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 326 parts In-Stock

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$0.680

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Northwest PG Solutions

USA . 350 parts In-Stock

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$0.748

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AZTECH Wire

Italy . 377 parts In-Stock

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$20.860

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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TANS Electronics

Latvia . 6,981 parts In-Stock

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Problanco Electronics

Mexico . 5,817 parts In-Stock

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SupplyDigital Components

Austria . 2,483 parts In-Stock

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Kulean Microsystems

USA . 926 parts In-Stock

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Corphita

USA . 371 parts In-Stock

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Corohmni

South Africa . 280 parts In-Stock

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UHIMA Technologies

Türkiye . 275 parts In-Stock

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Overview

Unlock a world of crystal-clear images with the AR0238CSSC12SPRA0-DR1 by Onsemi. As a leading manufacturer in image sensors, Onsemi guarantees top-quality products that deliver exceptional performance. Perfect for a wide range of applications, this image sensor offers unparalleled value and benefits to customers seeking superior image quality. Experience the advantages of Onsemi's cutting-edge technology with the AR0238CSSC12SPRA0-DR1.

Feature Benefit Bullets

Pixel Size (um): 3X3

The small pixel size of 3X3 allows for high resolution image capture with detailed quality.

Maximum Supply Voltage: 1.95 V

The high maximum supply voltage ensures reliable and stable power input for the image sensor.

Master Clock: 48 MHz

The fast master clock speed of 48 MHz enables quick data processing and high frame rates.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption and high-quality image capture, making them a preferred choice.

Body Height: 1.62 mm

The compact body height of 1.62 mm allows for easy integration into various devices or systems.

Optical Format (inch): 1/2.7

The 1/2.7 inch optical format provides a good balance between size and image quality, suitable for a wide range of applications.

Frame Rate: 60 fps

The high frame rate of 60 fps ensures smooth and fluid video capture, ideal for applications requiring fast motion recording.

Technical Specifications

Image Sensors AR0238CSSC12SPRA0-DR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8V NOMINAL ANALOG SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

11.3 inch

Body Height:

1.62 mm

Body Length/Diameter:

11.3 mm

Dynamic Range:

96 dB

Frame Rate:

60 fps

Horizontal Pixel:

1928

Housing:

PLASTIC

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

130 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.7

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3X3

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1088

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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