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AR0135AT2M25XUEA0-TRBR

Onsemi

AR0135AT2M25XUEA0-TRBR by Onsemi

The Onsemi AR0135AT2M25XUEA0-TRBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size, offering a frame rate of 54 fps. It is designed for surface mount applications, featuring Tin/Silver/Copper terminal finish and a square package style.

Median Price

$29.090

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

AR0135AT2M25XUEA0-TRBR by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,000 parts In-Stock

1+ parts

$29.090

100+ parts

$23.260

1k+ parts

-

10k+ parts

$22.063

4,000

$29.090

$23.260

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$22.063

Flip Electronics (Authorized)

USA . 21,800 parts In-Stock

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21,800

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Digiode

USA . 313 parts In-Stock

1+ parts

$33.098

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313

$33.098

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Vyrian

USA . 240 parts In-Stock

1+ parts

$34.840

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240

$34.840

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Flip Electronics

USA . 45,800 parts In-Stock

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45,800

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VNN

France . 4,464 parts In-Stock

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Nova Conductors

Japan . 49 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12,659 parts In-Stock

1+ parts

$29.610

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12,659

$29.610

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Corphita

USA . 240 parts In-Stock

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$31.356

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240

$31.356

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Corohmni

South Africa . 256 parts In-Stock

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$34.840

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256

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Problanco Electronics

Mexico . 4,601 parts In-Stock

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4,601

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Kulean Microsystems

USA . 3,708 parts In-Stock

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3,708

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TANS Electronics

Latvia . 2,348 parts In-Stock

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Argo Parts USA

USA . 2,085 parts In-Stock

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2,085

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Continental Prestige Electronics

USA . 779 parts In-Stock

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UHIMA Technologies

Türkiye . 652 parts In-Stock

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652

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Netroflash

USA . 500 parts In-Stock

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500

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SupplyDigital Components

Austria . 249 parts In-Stock

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Overview

Capture every moment in stunning clarity with the AR0135AT2M25XUEA0-TRBR image sensor by Onsemi. As a leader in the industry, Onsemi delivers top-quality products that exceed expectations. Ideal for a wide range of applications, this image sensor is perfect for capturing high-resolution images with incredible detail. Whether you're designing a security camera, automotive system, or industrial machine vision application, this sensor offers unmatched value and performance. Trust Onsemi to provide innovative solutions that elevate your projects to the next level.

Feature Benefit Bullets

Pixel Size (um): 3.75X3.75

Smaller pixel size allows for higher resolution images to be captured with more detail and clarity.

Body Width: 9 inch

Compact width enables easy integration into various devices and systems without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high image quality, making them a popular choice for many applications.

Body Height: 1.4 mm

Low profile design facilitates placement in slim devices and allows for versatility in mounting options.

Package Shape or Style: SQUARE

Square shape provides a more uniform and stable mounting surface, ensuring reliable performance over time.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Multiple terminal finish options allow for compatibility with various assembly processes and environments, increasing flexibility.

Body Length/Diameter: 9 mm

Balanced length/diameter ratio provides a compact form factor while offering sufficient surface area for mounting and connectivity.

Optical Format (inch): 1/3

1/3 inch optical format is commonly used in image sensors and offers a good balance between sensor size and image quality.

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections, enhancing the durability and longevity of the product.

Frame Rate: 54 fps

High frame rate enables smooth and real-time image capture, making it suitable for applications that require fast imaging.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies the integration process and allows for easy installation on PCBs, saving time and effort.

Technical Specifications

Image Sensors AR0135AT2M25XUEA0-TRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Frame Rate:

54 fps

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Pixel Size (um):

3.75X3.75

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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