Loading...

NOIP1FN016KA-GTI

Onsemi

NOIP1FN016KA-GTI by Onsemi

NOIP1FN016KA-GTI by Onsemi is an Image Sensor with 4.5x4.5 um pixel size, 360 MHz master clock, and 4096x4096 resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for high-speed imaging applications requiring precise detail capture at varying light levels.

Median Price

$2,230.200

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$2,230.200

1k+ parts

$2,150.550

10k+ parts

-

10

-

$2,230.200

$2,150.550

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,358

-

-

-

-

Digiode

USA . 2,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,327

-

-

-

-

Flip Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,180 parts In-Stock

1+ parts

$15.870

100+ parts

-

1k+ parts

-

10k+ parts

-

1,180

$15.870

-

-

-

Corohmni

South Africa . 407 parts In-Stock

1+ parts

$1,967.567

100+ parts

-

1k+ parts

-

10k+ parts

-

407

$1,967.567

-

-

-

SupplyDigital Components

Austria . 8,097 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,097

-

-

-

-

TANS Electronics

Latvia . 4,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,093

-

-

-

-

Problanco Electronics

Mexico . 3,747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,747

-

-

-

-

Corphita

USA . 1,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,831

-

-

-

-

Kulean Microsystems

USA . 742 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

742

-

-

-

-

UHIMA Technologies

Türkiye . 207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

207

-

-

-

-

Overview

Capture stunning images with the NOIP1FN016KA-GTI by Onsemi, a top-notch image sensor designed to deliver unparalleled quality and performance. Manufactured by Onsemi, a trusted name in the industry, this sensor is perfect for a wide range of applications. Its cutting-edge technology ensures crisp and clear images every time, making it an essential tool for photographers and imaging professionals alike. Elevate your projects with the superior value and benefits that this premium sensor offers.

Feature Benefit Bullets

Pixel Size (um): 4.5X4.5

Small pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 1.9 V

Higher supply voltage allows for better performance and signal processing capabilities.

Master Clock: 360 MHz

High master clock frequency enables fast image capturing and processing.

Body Width: 36.1 inch

Compact body width makes it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology provides high-quality image output and low power consumption.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy integration and mounting.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Horizontal Pixel: 4096

High horizontal pixel count provides detailed and sharp images.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in extreme weather conditions.

Dynamic Range: 59 dB

Wide dynamic range enables capturing images with varying light levels accurately.

Vertical Pixel: 4096

High vertical pixel count contributes to producing high-resolution images.

Body Length/Diameter: 43.1 mm

Optimal body length/diameter ratio for efficient packaging and integration.

Termination Type: SOLDER

Solder termination type provides secure and reliable electrical connections.

Output Interface Type: 4-WIRE INTERFACE

4-wire interface enables easy connectivity with other devices for data transfer.

Frame Rate: 120 fps

High frame rate allows for capturing fast-moving objects or scenes smoothly.

Array Type: FRAME

Frame array type offers versatility in capturing different types of images and scenes.

Sensitivity (V/lx.s): 5.8 V/lx.s

High sensitivity allows for capturing clear images even in low light conditions.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure and stable placement of the image sensor in various applications.

Technical Specifications

Image Sensors NOIP1FN016KA-GTI attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT 3.3 V NOMINAL SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

36.1 inch

Body Height:

3.5 mm

Body Length/Diameter:

43.1 mm

Dynamic Range:

59 dB

Frame Rate:

120 fps

Horizontal Pixel:

4096

Master Clock:

360 MHz

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

4-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

4.5X4.5

Sensitivity (V/lx.s):

5.8 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

4096

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 21