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TC281

Texas Instruments

TC281 by Texas Instruments

TC281 by Texas Instruments is an image sensor with 8x8 um pixel size, 13V power supply, and max operating temp of 45°C. With 1010 horizontal pixels and 1030 vertical pixels, it's ideal for THROUGH HOLE MOUNT applications in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,904 parts In-Stock

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Digiode

USA . 2,648 parts In-Stock

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2,648

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 654 parts In-Stock

1+ parts

$2.884

100+ parts

$267.786

1k+ parts

$2.595

10k+ parts

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654

$2.884

$267.786

$2.595

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DigiPath Technology Company

USA . 595 parts In-Stock

1+ parts

$3.175

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595

$3.175

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ChromeModa Solutions

Germany . 888 parts In-Stock

1+ parts

$3.240

100+ parts

$2.657

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888

$3.240

$2.657

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IDEA Electronic Components Group

UK . 66 parts In-Stock

1+ parts

$3.240

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$2.916

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66

$3.240

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$2.916

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AZTECH Wire

Italy . 769 parts In-Stock

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$17.917

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769

$17.917

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Ampacity Inc.

Singapore . 1,640 parts In-Stock

1+ parts

$23.750

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$23.750

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One Stop Electronics

USA . 1,066 parts In-Stock

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$36.750

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$36.750

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Semicontronic

India . 721 parts In-Stock

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$45.750

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$44.606

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$44.378

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721

$45.750

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$44.378

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Corphita

USA . 1,122 parts In-Stock

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Corohmni

South Africa . 469 parts In-Stock

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Overview

Elevate your imaging projects with the TC281 Image Sensor by Texas Instruments. With a compact design and high-quality components, this sensor is perfect for capturing crisp, clear images in a wide range of applications. From computer vision systems to security cameras, the TC281 offers unrivaled performance and reliability. Trust in Texas Instruments' reputation for excellence and innovation, and experience the value and benefits that the TC281 brings to your projects. Elevate your imaging game with the TC281 today.

Feature Benefit Bullets

Pixel Size (um): 8X8

The small pixel size allows for high-resolution imaging and detailed capture of images, making this sensor suitable for applications requiring high image quality.

Power Supplies (V): 13

The use of a 13V power supply provides sufficient power for the sensor to operate effectively, ensuring reliable performance in various operating conditions.

Maximum Operating Temperature: 45 °C

The sensor can operate at a relatively high temperature of 45°C, making it suitable for use in environments where heat may be a concern without compromising performance.

Horizontal Pixel: 1010

The high number of horizontal pixels allows for detailed and sharp images to be captured, making this sensor suitable for applications that require high image resolution.

Minimum Operating Temperature: -10 °C

The sensor can operate at temperatures as low as -10°C, making it versatile and suitable for use in various environments with different temperature conditions.

Vertical Pixel: 1030

The high number of vertical pixels enables the sensor to capture images with greater detail and clarity, making it ideal for applications where image quality is crucial.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides secure and stable installation of the sensor, ensuring reliable performance and accurate image capture without the risk of displacement.

Technical Specifications

Image Sensors TC281 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Horizontal Pixel:

1010

Mounting Feature:

Maximum Operating Temperature:

45 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

8X8

Power Supplies (V):

13

Sub-Category:

CCD Image Sensors

Vertical Pixel:

1030

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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