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VSP2590ZWV

Texas Instruments

VSP2590ZWV by Texas Instruments

VSP2590ZWV by Texas Instruments is an 8mm square CCD image sensor with a supply voltage range of 2.7-3.3 V, operating temperature from -25 to 85°C, and data rate of 42 Mbps. It is ideal for applications requiring analog voltage output, such as in digital cameras or industrial imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,565 parts In-Stock

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Digiode

USA . 1,893 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 421 parts In-Stock

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$2.248

100+ parts

-

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$2.751

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421

$2.248

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$2.751

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DigiPath Technology Company

USA . 1,324 parts In-Stock

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$2.475

100+ parts

$2.277

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$2.475

$2.277

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ChromeModa Solutions

Germany . 6,462 parts In-Stock

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$2.526

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$2.071

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$2.526

$2.071

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IDEA Electronic Components Group

UK . 2,012 parts In-Stock

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$2.526

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$2.273

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$2.526

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AZTECH Wire

Italy . 715 parts In-Stock

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$14.785

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715

$14.785

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One Stop Electronics

USA . 1,484 parts In-Stock

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$23.750

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$23.750

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Semicontronic

India . 1,266 parts In-Stock

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$27.750

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$27.056

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$26.918

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$27.056

$26.918

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Ampacity Inc.

Singapore . 847 parts In-Stock

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$31.750

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847

$31.750

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Corphita

USA . 1,576 parts In-Stock

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Microchip USA

USA . 482 parts In-Stock

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Corohmni

South Africa . 226 parts In-Stock

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Overview

Unleash the power of cutting-edge imaging technology with the VSP2590ZWV by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This image sensor offers unparalleled performance and precision, making it ideal for a wide range of applications. From surveillance systems to medical imaging, this sensor delivers crystal-clear images with ease. Experience the value and benefits of superior image quality with the VSP2590ZWV - your go-to solution for all your imaging needs.

Feature Benefit Bullets

Maximum Supply Voltage: 3.3 V

By having a higher maximum supply voltage, this image sensor can operate effectively with a wider range of power sources, providing versatility and flexibility in various applications.

Body Width: 8 inch

The larger body width allows for more surface area for components, potentially leading to improved signal processing and data transmission capabilities.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Using CCD technology as the sensor type ensures high-quality image capture with excellent color reproduction and sensitivity, making this product suitable for advanced imaging applications.

Package Shape or Style: SQUARE

The square package shape provides a compact form factor, making it easier to integrate into devices with limited space without sacrificing performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this image sensor can reliably operate in a wide range of environmental conditions, ensuring consistent performance even in challenging settings.

Output Type: ANALOG VOLTAGE

An analog voltage output allows for seamless integration with analog circuitry, enabling precise signal processing and compatibility with a variety of systems that rely on analog signals.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures that this image sensor can function effectively even in cold environments, making it suitable for applications in various climates and conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple materials for terminal finish enhances the durability and conductivity of the connections, resulting in reliable performance and longevity of the product.

Data Rate: 42 Mbps

With a high data rate of 42 Mbps, this image sensor can capture and transmit data quickly and efficiently, ideal for applications requiring high-speed image processing and transfer.

Termination Type: SOLDER

The solder termination type simplifies the installation and assembly process, ensuring a secure connection and ease of integration into different electronic systems.

Technical Specifications

Image Sensors VSP2590ZWV attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Body Width:

8 inch

Body Height:

.9 mm

Body Length/Diameter:

8 mm

Data Rate:

42 Mbps

Housing:

PLASTIC

JESD-609 Code:

e1

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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