Loading...

CYIWOSC3000AA

Onsemi

CYIWOSC3000AA by Onsemi

CYIWOSC3000AA by Onsemi is an image sensor with 2.54X2.54 um pixel size, 100 MHz master clock, and 55 dB dynamic range. Ideal for applications requiring a full-frame array, it operates b/w -30 to 70 °C and outputs digital voltage via I2C interface at 14 fps.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,982

-

-

-

-

Vyrian

USA . 556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

556

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 24 parts In-Stock

1+ parts

$0.191

100+ parts

-

1k+ parts

-

10k+ parts

$0.184

24

$0.191

-

-

$0.184

Northwest PG Solutions

USA . 1,631 parts In-Stock

1+ parts

$0.210

100+ parts

-

1k+ parts

-

10k+ parts

$0.186

1,631

$0.210

-

-

$0.186

Problanco Electronics

Mexico . 6,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,915

-

-

-

-

Kulean Microsystems

USA . 6,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,749

-

-

-

-

TANS Electronics

Latvia . 6,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,298

-

-

-

-

SupplyDigital Components

Austria . 3,312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,312

-

-

-

-

Corohmni

South Africa . 341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

341

-

-

-

-

Corphita

USA . 55 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

55

-

-

-

-

UHIMA Technologies

Türkiye . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Overview

Capture every moment in stunning clarity with the CYIWOSC3000AA Image Sensor by Onsemi. This cutting-edge technology offers unrivaled quality and performance, making it the perfect choice for a wide range of applications. From high-definition cameras to advanced medical imaging systems, this sensor delivers exceptional results that exceed expectations. Trust in Onsemi's reputation for excellence and innovation, and experience the superior value and benefits that the CYIWOSC3000AA brings to your projects. Elevate your imaging capabilities with this top-of-the-line sensor today.

Feature Benefit Bullets

Pixel Size (um): 2.54X2.54

This sensor has a relatively large pixel size, allowing for better light sensitivity and higher image quality even in low light conditions.

Maximum Supply Voltage: 3.1 V

With a high maximum supply voltage, this sensor can operate efficiently and reliably without being easily affected by fluctuations in power.

Master Clock: 100 MHz

The high master clock frequency of 100 MHz ensures fast and accurate data readout, leading to smoother image capture and processing.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

As a CMOS image sensor, this product offers low power consumption, high signal-to-noise ratio, and compatibility with various digital processing technologies.

Minimum Supply Voltage: 2.5 V

Despite the high maximum supply voltage, this sensor can also operate at a low minimum supply voltage, providing flexibility in power usage.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this sensor can withstand higher environmental temperatures, making it suitable for a wide range of applications.

Output Range: 0.20-2.60V

The wide output range of 0.20-2.60V allows for capturing images with varying brightness levels while maintaining accurate digital voltage output.

Output Type: DIGITAL VOLTAGE

The digital voltage output ensures easy integration with digital systems for further processing, reducing the need for additional signal conversion.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, this sensor can function reliably in cold environments without compromising performance.

Dynamic Range: 55 dB

The high dynamic range of 55 dB enables the sensor to capture details in both bright and dark areas of an image, resulting in rich and well-balanced image quality.

Optical Format (inch): 1/2.80

The 1/2.80 inch optical format provides a good balance between sensor size and image resolution, making it suitable for a variety of imaging applications.

Output Interface Type: I2C INTERFACE

The I2C interface allows for easy and efficient communication with other devices, making it convenient for integration into digital imaging systems.

Frame Rate: 14 fps

Although not the highest, the 14 frames per second frame rate is sufficient for most standard imaging tasks, ensuring smooth and responsive image capture.

Array Type: FULL FRAME

Being a full-frame array type, this sensor provides a larger active imaging area, allowing for higher resolution images and better overall image quality.

Technical Specifications

Image Sensors CYIWOSC3000AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FULL FRAME

Dynamic Range:

55 dB

Frame Rate:

14 fps

Master Clock:

100 MHz

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.80

Output Interface Type:

I2C INTERFACE

Output Range:

Output Type:

Pixel Size (um):

2.54X2.54

Sensors or Transducers Type:

Maximum Supply Voltage:

3.1 V

Minimum Supply Voltage:

2.5 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6